LFE5UM-85F-6BG554C

IC FPGA 259 I/O 554CABGA
Part Description

ECP5 Field Programmable Gate Array (FPGA) IC 259 3833856 84000 554-FBGA

Quantity 1,046 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package554-CABGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case554-FBGANumber of I/O259Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21000Number of Logic Elements/Cells84000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3833856

Overview of LFE5UM-85F-6BG554C – ECP5 Field Programmable Gate Array (FPGA), 84,000 logic elements, 259 I/Os, 554-FBGA

The LFE5UM-85F-6BG554C is a commercial-grade FPGA IC from Lattice Semiconductor’s ECP5 family. It delivers mid-range programmable logic capacity with approximately 84,000 logic elements, about 3.8 Mbits of embedded memory, and a high I/O count for flexible board-level integration.

Designed for compact surface-mount assemblies, this device targets commercial designs that require substantial programmable logic, on-chip RAM, and extensive I/O while operating within a 1.045 V to 1.155 V core supply range and a 0 °C to 85 °C operating window.

Key Features

  • Logic Capacity  Approximately 84,000 logic elements suitable for medium-complexity programmable logic implementations.
  • Embedded Memory  Approximately 3.8 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory for many applications.
  • High I/O Count  259 programmable I/Os provide broad interfacing options for peripherals, parallel buses, and multiple I/O standards described in the family datasheet.
  • Package and Mounting  Available in a 554-FBGA (554-CABGA, 23 × 23 mm) package optimized for surface-mount PCB assembly, enabling dense board layouts.
  • Power  Core supply voltage range of 1.045 V to 1.155 V to match system power rails and enable predictable power budgeting.
  • Temperature and Grade  Commercial operating range of 0 °C to 85 °C; device is specified as Commercial grade.
  • Standards and Compliance  RoHS compliant for regulatory compatibility in commercial electronic products.
  • Family-Level Architecture (ECP5)  The ECP5 family datasheet documents architecture elements including clocking (sysCLOCK PLL), programmable I/O cells, DDR memory support, sysDSP slices, SERDES and physical coding sublayer, device configuration options (including on-chip oscillator), and reliability features such as SEU support.

Typical Applications

  • Protocol Bridging and Glue Logic  Use the device’s logic density and abundant I/Os to implement custom protocol conversion and board-level glue logic between subsystems.
  • Embedded Control and Signal Processing  Leverage on-chip memory and the family’s sysDSP documentation to perform buffering, control-state machines, and moderate signal-processing tasks.
  • High‑I/O Peripheral Interfaces  The 259 I/Os make this FPGA suitable for dense peripheral interfaces, display controllers, or sensor aggregation where multiple signals must be handled concurrently.
  • Communication Endpoints  Family-level SERDES and DDR support described in the datasheet enable use in communication endpoints requiring serial lanes or external memory interfaces.

Unique Advantages

  • Highly integrated logic and memory: The combination of ~84,000 logic elements and roughly 3.8 Mbits of embedded RAM reduces dependence on external components for many designs.
  • Broad I/O flexibility: With 259 I/Os and programmable I/O cell capability (per family documentation), the device supports complex board-level interfacing without major PCB redesign.
  • Compact, manufacturable package: The 554-FBGA (23 × 23 mm) package provides a space-efficient footprint suitable for surface-mount assembly on dense boards.
  • Controlled core power envelope: A defined core voltage range (1.045 V–1.155 V) helps with predictable power-supply design and system integration.
  • Commercial operating range: Specified for 0 °C to 85 °C operation, matching many mainstream electronics applications.
  • Regulatory readiness: RoHS compliance supports environmental regulatory needs for commercial products.

Why Choose LFE5UM-85F-6BG554C?

The LFE5UM-85F-6BG554C positions itself as a mid-range member of the Lattice ECP5 family, offering a balance of substantial logic resources, on-chip memory, and high peripheral I/O in a compact 554-FBGA package. Its documented family-level features—clocking structures, DSP resources, SERDES, programmable I/O, and DDR support—make it suitable for designers who need a flexible, integrated FPGA solution for commercial embedded and communications-oriented designs.

Choose this part when you need predictable core-voltage operation, a large I/O budget, and significant embedded RAM to consolidate functionality on a single silicon device while maintaining RoHS compliance and standard commercial temperature support.

Request a quote to check pricing and availability for the LFE5UM-85F-6BG554C or submit a quote request to begin procurement and lead-time planning.

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