LFE5UM-85F-6BG554C
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 259 3833856 84000 554-FBGA |
|---|---|
| Quantity | 1,046 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 554-CABGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 554-FBGA | Number of I/O | 259 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21000 | Number of Logic Elements/Cells | 84000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFE5UM-85F-6BG554C – ECP5 Field Programmable Gate Array (FPGA), 84,000 logic elements, 259 I/Os, 554-FBGA
The LFE5UM-85F-6BG554C is a commercial-grade FPGA IC from Lattice Semiconductor’s ECP5 family. It delivers mid-range programmable logic capacity with approximately 84,000 logic elements, about 3.8 Mbits of embedded memory, and a high I/O count for flexible board-level integration.
Designed for compact surface-mount assemblies, this device targets commercial designs that require substantial programmable logic, on-chip RAM, and extensive I/O while operating within a 1.045 V to 1.155 V core supply range and a 0 °C to 85 °C operating window.
Key Features
- Logic Capacity Approximately 84,000 logic elements suitable for medium-complexity programmable logic implementations.
- Embedded Memory Approximately 3.8 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory for many applications.
- High I/O Count 259 programmable I/Os provide broad interfacing options for peripherals, parallel buses, and multiple I/O standards described in the family datasheet.
- Package and Mounting Available in a 554-FBGA (554-CABGA, 23 × 23 mm) package optimized for surface-mount PCB assembly, enabling dense board layouts.
- Power Core supply voltage range of 1.045 V to 1.155 V to match system power rails and enable predictable power budgeting.
- Temperature and Grade Commercial operating range of 0 °C to 85 °C; device is specified as Commercial grade.
- Standards and Compliance RoHS compliant for regulatory compatibility in commercial electronic products.
- Family-Level Architecture (ECP5) The ECP5 family datasheet documents architecture elements including clocking (sysCLOCK PLL), programmable I/O cells, DDR memory support, sysDSP slices, SERDES and physical coding sublayer, device configuration options (including on-chip oscillator), and reliability features such as SEU support.
Typical Applications
- Protocol Bridging and Glue Logic Use the device’s logic density and abundant I/Os to implement custom protocol conversion and board-level glue logic between subsystems.
- Embedded Control and Signal Processing Leverage on-chip memory and the family’s sysDSP documentation to perform buffering, control-state machines, and moderate signal-processing tasks.
- High‑I/O Peripheral Interfaces The 259 I/Os make this FPGA suitable for dense peripheral interfaces, display controllers, or sensor aggregation where multiple signals must be handled concurrently.
- Communication Endpoints Family-level SERDES and DDR support described in the datasheet enable use in communication endpoints requiring serial lanes or external memory interfaces.
Unique Advantages
- Highly integrated logic and memory: The combination of ~84,000 logic elements and roughly 3.8 Mbits of embedded RAM reduces dependence on external components for many designs.
- Broad I/O flexibility: With 259 I/Os and programmable I/O cell capability (per family documentation), the device supports complex board-level interfacing without major PCB redesign.
- Compact, manufacturable package: The 554-FBGA (23 × 23 mm) package provides a space-efficient footprint suitable for surface-mount assembly on dense boards.
- Controlled core power envelope: A defined core voltage range (1.045 V–1.155 V) helps with predictable power-supply design and system integration.
- Commercial operating range: Specified for 0 °C to 85 °C operation, matching many mainstream electronics applications.
- Regulatory readiness: RoHS compliance supports environmental regulatory needs for commercial products.
Why Choose LFE5UM-85F-6BG554C?
The LFE5UM-85F-6BG554C positions itself as a mid-range member of the Lattice ECP5 family, offering a balance of substantial logic resources, on-chip memory, and high peripheral I/O in a compact 554-FBGA package. Its documented family-level features—clocking structures, DSP resources, SERDES, programmable I/O, and DDR support—make it suitable for designers who need a flexible, integrated FPGA solution for commercial embedded and communications-oriented designs.
Choose this part when you need predictable core-voltage operation, a large I/O budget, and significant embedded RAM to consolidate functionality on a single silicon device while maintaining RoHS compliance and standard commercial temperature support.
Request a quote to check pricing and availability for the LFE5UM-85F-6BG554C or submit a quote request to begin procurement and lead-time planning.

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