LFE5UM-85F-6BG381I

The LFE5UM-85F-6BG381I is a member of the Lattice ECP5 family of field-programmable gate arrays (FPGAs). It delivers a mid-density programmable logic fabric with a balance of on-chip memory, I/O count, and industrial-grade operating range for embedded and industrial system designs.

Targeted for applications that require flexible I/O, embedded memory, and robust temperature performance, this device provides 84,000 logic elements, approximately 3.83 Mbits of embedded RAM, and 205 user I/Os in a compact 381-FBGA (381-CABGA 17×17) package.

Key Features

• Logic Density — 84,000 logic elements for mid-density programmable logic implementations and custom digital functions.
• On-chip Memory — Approximately 3.83 Mbits of embedded RAM to support FIFOs, buffering, and local data storage.
• I/O and Packaging — 205 user I/Os in a 381-FBGA package (supplier package: 381-CABGA, 17×17); surface-mount mounting type for PCB assembly.
• Power — Voltage supply range of 1.045 V to 1.155 V for the device core supply.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• RoHS Compliant — Meets RoHS environmental requirements.
• ECP5 Family Architecture (series-level) — Family datasheet documents architecture features such as programmable I/O cells, configurable clocking (PLLs and clock distribution), DDR memory support, SERDES and physical coding sublayer, sysDSP slices, device configuration options, SEU support, and an on-chip oscillator.

Typical Applications

• Industrial Control and Automation — Utilize the industrial temperature rating and extensive I/O to implement sensor interfacing, motor control logic, and deterministic machine-control functions.
• Communications and Networking — Family-level support for high-speed serialized interfaces and DDR memory (as documented in the ECP5 family datasheet) enables protocol bridging and connectivity functions.
• Embedded Processing and DSP — On-chip memory and the ECP5 family’s sysDSP slice architecture support custom signal processing and data-path acceleration tasks.
• System Integration and Prototyping — Rich I/O count and a compact BGA package make this device suitable for consolidating glue logic and integrating multiple functions into a single programmable device.

Unique Advantages

• High logic capacity in a compact package: 84,000 logic elements in a 381-CABGA (17×17) footprint to maximize board-level integration while minimizing PCB area.
• Substantial embedded memory: Approximately 3.83 Mbits of on-chip RAM for local buffering, state storage, and memory-intensive logic blocks.
• Generous I/O resources: 205 user I/Os for flexible peripheral interfacing and board-level connectivity without external multiplexers.
• Designed for industrial use: −40 °C to 100 °C operating range supports deployment in demanding environmental conditions.
• Low-voltage core operation: Narrow supply window (1.045–1.155 V) enabling controlled core power design and predictable power budgeting.
• Documented family capabilities: The ECP5 family datasheet details configurable clocking, SERDES, DDR support, sysDSP slices, and configuration/SEU features to inform system-level design choices.

Why Choose LFE5UM-85F-6BG381I?

The LFE5UM-85F-6BG381I is positioned for designers who need a mid-density, industrial-grade FPGA that balances logic density, embedded memory, and extensive I/O in a compact surface-mount BGA package. Its documented ECP5 family architecture provides the design building blocks—programmable I/O, clocking, SERDES/DDR support, and DSP-oriented slices—so engineers can implement diverse embedded and connectivity functions while consolidating board-level components.

For projects requiring robustness across temperature extremes, predictable low-voltage core operation, and RoHS compliance, this device offers a clear specification set to support long-term designs and scalable implementations within the ECP5 family framework.

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