LFE5UM-85F-6BG554I

The LFE5UM-85F-6BG554I is an ECP5 family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor, supplied in a 554-ball BGA package (554-CABGA, 23×23) and designed for surface-mount assembly. This device provides a balance of logic density, on-chip embedded memory, and broad I/O connectivity for industrial embedded systems.

Key attributes include 84,000 logic elements, approximately 3.83 Mbits of embedded RAM, and 259 user I/Os, together with family-level architecture features such as programmable I/O cells, flexible clocking (sysCLOCK PLL), DDR memory support and SERDES/PCS capabilities described in the ECP5 family datasheet.

Key Features

• Core Logic – 84,000 logic elements to implement a wide range of synchronous digital logic and control functions.
• Embedded Memory – 3,833,856 total RAM bits (approximately 3.83 Mbits) of on-chip embedded memory for buffers, FIFOs and local data storage.
• I/O and Packaging – 259 user I/Os in a compact 554-CABGA (23×23) package; surface-mount mounting type and shipped in tray packaging.
• Power – Device supply defined at 1.045 V (specified as 1.045 V to 1.045 V in product data).
• Operating Range – Industrial temperature grade with an operating range of −40 °C to 100 °C.
• Clocking and Timing (family) – ECP5 family architecture includes sysCLOCK PLLs, a hierarchical clock distribution network and clock dividers for flexible timing and system synchronization.
• Memory and DSP (family) – Family-level support for sysMEM memory blocks, memory cascading and sysDSP slices for DSP-oriented datapaths, as described in the ECP5 datasheet.
• I/O and Interface Support (family) – Programmable I/O cells with on-chip I/O buffer banks, DDR memory support and SERDES/PCS building blocks available across the ECP5 family.
• Configuration and System Features (family) – ECP5 family documentation describes device configuration options, on-chip oscillator and boundary-scan testability.

Typical Applications

• Industrial control systems – Use the industrial temperature rating, high I/O count and configurable logic to implement control, sensor aggregation and custom interfacing functions.
• Embedded processing and DSP – Combine approximately 3.83 Mbits of embedded memory with sysDSP slices (ECP5 family) for medium‑complexity signal processing and data buffering.
• Memory interface bridging – Family support for DDR memory features and memory block modes enables protocol bridging and local memory management tasks.
• High-density I/O applications – 259 user I/Os and programmable I/O cells provide flexibility for industrial communications, multiplexing and peripheral control.

Unique Advantages

• High logic density: 84,000 logic elements provide ample resources for implementing complex control, glue-logic and mid-size FPGA designs.
• Significant on-chip memory: Approximately 3.83 Mbits of embedded RAM reduces reliance on external memory for many buffering and local storage needs.
• Extensive I/O resource: 259 user I/Os accommodate multi‑interface designs and dense peripheral integration without immediate need for external I/O expanders.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in industrial environments.
• Compact BGA package: 554-ball 23×23 package provides a high pin count in a compact footprint for space-constrained PCBs.
• Family-level system features: ECP5 family architecture includes PLLs, DDR support, SERDES and programmable I/O capabilities to address a range of system-level needs.

Why Choose LFE5UM-85F-6BG554I?

The LFE5UM-85F-6BG554I targets embedded and industrial applications that require a substantial combination of logic resources, embedded memory and I/O in a compact BGA package. Its 84,000 logic elements, approximately 3.83 Mbits of on-chip RAM and 259 I/Os make it suitable for designs that must integrate multiple interfaces, onboard buffering and custom datapaths while operating across an industrial temperature range.

As part of the ECP5 family, this device benefits from documented family-level features—clocking resources, DDR memory support, programmable I/O cells, SERDES/PCS and DSP-oriented slices—allowing designers to map system requirements to a well-documented FPGA architecture.

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