LFE5UM-85F-6BG756C

The LFE5UM-85F-6BG756C is an ECP5 family FPGA from Lattice Semiconductor Corporation offering a balanced combination of programmable logic, embedded memory, and I/O capacity in a 756‑FBGA package. It implements the ECP5 architecture and related on‑chip resources described in the ECP5 family data sheet, providing a platform suited to designs that require flexible logic, DSP functionality and multi‑lane serial or parallel I/O.

Key device attributes include 84,000 logic elements, approximately 3.83 Mbits of embedded memory, 365 I/O pins, a 1.045–1.155 V core supply window, and commercial operating range (0 °C to 85 °C), all in a surface‑mount 756‑CABGA (27×27) package.

Key Features

• Core Logic — 84,000 logic elements provide the programmable fabric required for custom logic, control paths, and accelerator functions within the ECP5 architecture.
• Embedded Memory — Approximately 3.83 Mbits of on‑chip RAM for FIFOs, buffers, and local storage to support dataflow and state machines.
• I/O Capacity — 365 user I/O pins delivered from multiple I/O banks, enabling wide parallel interfaces and mixed I/O connectivity in a single device.
• Power — Core supply operating range of 1.045 V to 1.155 V for the device core; suitable for designs that target the ECP5 family power domain.
• Package & Mounting — 756‑FBGA package (supplier device package: 756‑CABGA 27×27) with surface‑mount mounting type for compact board integration.
• Temperature & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Family Architecture & Peripherals — Built on the ECP5 family architecture (see family data sheet) with documented features such as programmable I/O cells, clocking structures including PLLs, sysDSP slices, DDR memory support and SERDES/PCS blocks.
• Environmental Compliance — RoHS‑compliant for lead‑free manufacturing and regulatory alignment.

Typical Applications

• High‑density logic and control — Implement control systems, glue logic, and custom state machines using the 84,000 logic elements and embedded memory.
• Signal processing and acceleration — Utilize the ECP5 family’s documented sysDSP slices for DSP‑oriented tasks and data manipulation.
• Memory interface and buffering — Leverage on‑chip RAM and DDR memory support in designs that require local buffering and memory interfacing.
• High‑speed I/O and protocol bridging — Support multi‑lane serial or parallel connectivity using the device’s SERDES and abundant I/O resources.

Unique Advantages

• Balanced integration: Combines a large logic element count with multiple megabits of embedded RAM and extensive I/O to consolidate functions into a single FPGA.
• Flexible I/O and SERDES support: 365 I/O pins and family SERDES/PCS capability enable diverse interface implementations without adding external bridge chips.
• Comprehensive clocking and DSP resources: ECP5 family clocking (including PLLs) and sysDSP slices support deterministic timing and on‑chip signal processing.
• Compact system footprint: 756‑FBGA (27×27) packaging provides high pin count in a surface‑mount form factor suitable for space‑constrained boards.
• Commercial temperature and RoHS compliance: Clear operating range (0 °C to 85 °C) and RoHS status simplify procurement and regulatory planning for standard commercial products.

Why Choose LFE5UM-85F-6BG756C?

The LFE5UM-85F-6BG756C brings together the ECP5 family architecture and a device‑level feature set tailored for designs that require substantial logic capacity, multi‑megabit embedded memory, and wide I/O. Its documented family features—programmable I/O, clocking/PLL structures, sysDSP slices, DDR support, and SERDES—offer designers the architectural building blocks needed to implement complex functional blocks on a single FPGA.

This device is well suited for commercial applications where a balance of logic density, memory, and I/O throughput is required, and where a surface‑mount 756‑FBGA package supports compact, manufacturable board designs. Designers can rely on the ECP5 family documentation for integration and configuration guidance.

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