LFE5UM-85F-7BG381C

The LFE5UM-85F-7BG381C is a member of the Lattice ECP5 FPGA family, providing a dense, configurable logic platform in a compact 381-FBGA package. It delivers 84,000 logic elements and approximately 3.83 Mbits of on-chip RAM with 205 programmable I/O pins, enabling complex digital designs with substantial embedded memory and I/O capacity.

Designed for commercial-temperature applications, this surface-mount FPGA operates from a core supply range of 1.045 V to 1.155 V and is RoHS compliant. The ECP5 family architecture (as documented in the device datasheet) includes programmable I/O cells, clocking resources, SERDES and DDR support, DSP-oriented resources and flexible memory structures to address a broad set of design requirements.

Key Features

• Core Logic — 84,000 logic elements for implementing complex programmable logic and control functions.
• Embedded Memory — Approximately 3.83 Mbits of total on-chip RAM, supporting single, dual and pseudo‑dual port modes and memory cascading as described in the ECP5 family documentation.
• Programmable I/O — 205 I/O pins in a 381‑FBGA (381‑CABGA 17×17) package; programmable I/O cells and on-chip I/O buffers for flexible interfacing.
• SerDes and High-Speed Interfaces — ECP5 family architecture includes SERDES blocks and a physical coding sublayer to support high-speed serial link implementations and protocol bridging.
• DSP and Arithmetic Resources — Family-level sysDSP slices and DSP-oriented building blocks for efficient implementation of arithmetic and signal-processing functions.
• Clocking and Timing — Integrated PLLs, clock distribution networks and clock dividers as part of the ECP5 family feature set to support varied clocking schemes.
• Memory & DDR Support — DDR memory support and DQS grouping/delay control features enable external memory interfacing strategies described in the datasheet.
• Package and Mounting — 381‑FBGA surface‑mount package (381‑CABGA, 17×17) for compact board-level integration.
• Power and Temperature — Core supply range 1.045 V to 1.155 V; commercial operating temperature 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• High-speed serial interfaces and protocol bridging — SERDES blocks and physical coding sublayer in the ECP5 family support serial link implementations and protocol conversion tasks.
• DDR memory controllers and memory interfacing — DDR support, DQS grouping and calibrated delay/control features facilitate reliable external memory interfacing.
• Digital signal processing — sysDSP slices and on-chip RAM enable DSP algorithms and arithmetic-intensive workloads within the FPGA fabric.
• I/O expansion and protocol glue logic — 205 programmable I/Os and flexible I/O buffer banks let the device act as a configurable interface hub or glue logic component.

Unique Advantages

• High integration density: 84,000 logic elements and ~3.83 Mbits of embedded memory reduce the need for external logic and memory components.
• Rich I/O resource set: 205 I/Os in a compact 381‑FBGA package provide extensive interfacing options without increasing board footprint.
• Family-level IP and architecture: ECP5 family features such as programmable I/O, PLLs, SERDES and sysDSP provide a versatile architectural foundation for diverse designs.
• Compact surface-mount package: 381‑CABGA (17×17) package supports dense board-level integration for space-constrained applications.
• Commercial-grade operation: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
• Controlled core voltage range: Defined core supply range (1.045 V to 1.155 V) supports consistent power planning and design margining.

Why Choose LFE5UM-85F-7BG381C?

The LFE5UM-85F-7BG381C delivers a balance of logic density, embedded memory and flexible I/O in a single, compact FPGA package. Its ECP5 family architecture—documented in the device datasheet—provides integrated clocking, SERDES, DSP-oriented resources and DDR support to address demanding interface, processing and memory tasks within commercial-temperature designs.

This part is suited to engineers and designers seeking a high-density, RoHS‑compliant FPGA with significant on-chip RAM and a large I/O complement for applications such as high-speed serial bridging, DDR interfacing, DSP functions and general-purpose programmable logic. The combination of device-level features and package density offers a scalable platform for production designs where integration and predictable electrical requirements are priorities.

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