LFE5UM-85F-7BG554I

The LFE5UM-85F-7BG554I is an industrial-grade Field Programmable Gate Array (FPGA) from the Lattice ECP5 family. It provides a mid-range combination of programmable logic, on-chip memory and I/O density in a compact 554‑FBGA (23×23) surface-mount package.

With 84,000 logic elements, approximately 3.83 Mbits of embedded memory and 259 I/Os, this device targets applications that require substantial logic integration, flexible I/O, and operation across an extended temperature range.

Key Features

• Core Density: 84,000 logic elements for implementing complex digital logic and control functions.
• Embedded Memory: Total on-chip RAM of 3,833,856 bits (approximately 3.83 Mbits) to support buffering, FIFOs and local storage.
• I/O Resources: 259 programmable I/Os to support broad peripheral and interface connectivity.
• Family Architecture: Part of the ECP5 family; datasheet documentation describes routing, clocking structures, SERDES capability and DDR memory support within the family architecture.
• Dedicated DSP and Memory Blocks: Family-level sysDSP slices and sysMEM memory blocks are documented for signal-processing and embedded memory use.
• Package and Mounting: 554‑FBGA package (supplier device package: 554‑CABGA, 23×23) with surface-mount mounting type for compact board integration.
• Power Supply Range: Recommended operating voltage range from 1.045 V to 1.155 V.
• Industrial Temperature Grade: Rated for operation from −40 °C to 100 °C.
• Regulatory: RoHS compliant.

Typical Applications

• Industrial Control: FPGA logic density and industrial temperature rating make it suitable for control systems and automation where reliability and I/O capacity are required.
• Communications & Networking: ECP5 family capabilities such as SERDES and DDR memory support (documented in the family datasheet) enable implementations for connectivity and protocol bridging.
• Signal Processing: On-chip DSP and memory resources support processing tasks, filtering, and other compute-heavy functions within embedded systems.
• Embedded Systems & Prototyping: Compact 554‑FBGA package and broad I/O count provide a flexible platform for integrating custom logic in space-constrained designs.

Unique Advantages

• High Logic Integration: 84,000 logic elements enable dense implementation of control, datapath and glue logic, reducing external components.
• Substantial On‑Chip Memory: Approximately 3.83 Mbits of embedded RAM supports local buffering and state storage without adding external memory.
• Extensive I/O: 259 I/Os allow direct interfacing to many peripherals and external devices, simplifying board-level routing and design.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact, Manufacturable Package: 554‑FBGA (23×23) surface-mount package balances density and PCB footprint for production designs.
• Well‑Documented Family Architecture: ECP5 family datasheet includes detailed coverage of routing, clocking, SERDES and memory features for architecture-level design planning.

Why Choose LFE5UM-85F-7BG554I?

The LFE5UM-85F-7BG554I delivers a practical balance of logic density, embedded memory and I/O capability in a single industrial-grade FPGA package. Its specification set—84,000 logic elements, approximately 3.83 Mbits of on-chip RAM, 259 I/Os and a 554‑FBGA package—makes it suitable for designers who need a compact, integrated platform for mid-range programmable systems.

This device is appropriate for engineering teams building industrial controls, communications interfaces, or signal-processing modules that require documented architecture-level features from the ECP5 family and operation across an extended temperature range.

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