LFE5UM-85F-7BG381I

The LFE5UM-85F-7BG381I is a member of the Lattice Semiconductor ECP5 FPGA family: a programmable logic device offering a balance of logic capacity, embedded memory and flexible I/O in a compact surface-mount FBGA package. It combines the ECP5 family architecture with on‑chip resources suitable for custom logic, DSP-style processing and serial/parallel I/O tasks.

Designed for industrial-grade applications, this device provides 84,000 logic elements (21,000 CLBs), approximately 3.8 Mbits of embedded RAM, and 205 programmable I/O pins, all in a 381-ball FBGA (381‑CABGA 17×17) package with an operating range from −40 °C to 100 °C.

Key Features

• Logic Capacity — 84,000 logic elements (21,000 CLBs) for implementing complex custom logic and control functions.
• Embedded Memory — Approximately 3.8 Mbits of total on‑chip RAM bits to support buffering, lookup tables and local data storage.
• Programmable I/O — 205 I/O pins to enable broad interfacing options for parallel buses, control signals and external peripherals.
• Package and Mounting — 381-FBGA package (supplier device package: 381‑CABGA, 17×17) in a surface‑mount form factor for compact board designs.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for extended environmental tolerance.
• Low‑Voltage Core — Core supply requirement between 1.045 V and 1.155 V for integration with modern low‑voltage power architectures.
• Family Architecture Highlights — ECP5 family features described in the datasheet include programmable fabric, DSP-style slices, SERDES and flexible clocking and memory interfaces to support a variety of design requirements.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Custom digital logic and control — Implement state machines, control functions and protocol handling using the device’s 84,000 logic elements and large number of I/Os.
• Signal processing and arithmetic — Leverage the family’s DSP-style resources and embedded RAM for local buffering and algorithm acceleration.
• I/O bridging and protocol interfacing — Use 205 programmable I/Os and the ECP5 family’s SERDES and I/O features (as documented in the datasheet) for serial/parallel interface bridging and protocol conversion.
• Memory interface and buffering — Utilize approximately 3.8 Mbits of on‑chip RAM alongside the family’s DDR support for temporary storage and data alignment tasks.

Unique Advantages

• Substantial logic resource density: 84,000 logic elements enable consolidated implementation of complex designs that would otherwise require multiple discrete components.
• Significant on‑chip memory: Approximately 3.8 Mbits of embedded RAM reduces dependence on external memory for many buffering and LUT requirements.
• High I/O count: 205 I/Os provide flexibility for dense board-level connectivity and multiple peripheral interfaces.
• Industrial operating range: −40 °C to 100 °C supports deployment in extended-temperature environments typical of industrial systems.
• Compact FBGA package: 381‑ball (17×17) surface-mount package helps minimize PCB area while preserving routing and thermal characteristics.
• Aligned with ECP5 family capabilities: Family-level architecture features—including DSP slices, configurable clocking, SERDES and programmable I/O—help address diverse design needs without adding external components.

Why Choose LFE5UM-85F-7BG381I?

The LFE5UM-85F-7BG381I positions itself as a versatile, industrial-grade FPGA option within the Lattice ECP5 family, combining sizable logic capacity, meaningful embedded memory and a high I/O count in a compact 381‑FBGA package. Its specifications—84,000 logic elements, approximately 3.8 Mbits of on‑chip RAM, 205 I/Os, and an extended operating temperature range—make it suitable for designs that require integrated logic, local memory and flexible interfacing in constrained board space.

For engineering teams building control systems, protocol bridges, DSP-accelerated functions or memory-buffered designs, this device offers a blend of integration and family-level features described in the ECP5 datasheet to streamline system architecture and reduce BOM complexity.

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