LFE5UM-85F-6BG756I

IC FPGA 365 I/O 756CABGA
Part Description

ECP5 Field Programmable Gate Array (FPGA) IC 365 3833856 84000 756-FBGA

Quantity 806 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package756-CABGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case756-FBGANumber of I/O365Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21000Number of Logic Elements/Cells84000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3833856

Overview of LFE5UM-85F-6BG756I – ECP5 Field Programmable Gate Array (FPGA) IC 365 3833856 84000 756-FBGA

The LFE5UM-85F-6BG756I is an industrial-grade FPGA from the Lattice ECP5 family designed for cost- and power-conscious programmable logic applications. It provides a mid-density fabric with a large I/O complement and on-chip memory suitable for embedded logic, interface bridging, and system control functions.

Key hardware characteristics include approximately 84,000 logic elements (21,000 LABs), about 3.83 Mbits of embedded RAM, 365 I/Os, a 756-FBGA (27 × 27 mm) package, a supply voltage window of 1.045 V to 1.155 V, and an industrial operating temperature range of −40 °C to 100 °C.

Key Features

  • Logic Capacity  Approximately 84,000 logic elements (21,000 LABs) to implement complex combinational and sequential functions.
  • On-chip Memory  Approximately 3.83 Mbits of embedded RAM for frame buffering, small look-up tables, and state storage without external memory.
  • High I/O Count  365 user I/Os supplied in a 756-FBGA package to support dense interfacing and multi-channel connectivity.
  • Industrial Operating Range  Rated for −40 °C to 100 °C operation, suitable for industrial environments and elevated-temperature electronics.
  • Power and Voltage  Dedicated core supply window of 1.045 V to 1.155 V for predictable power-domain design and rail planning.
  • Packaging and Mounting  756-CABGA (27 × 27 mm) surface-mount package offering a compact form factor for space-constrained PCBs.
  • Family-Level System Features  ECP5 family architecture provides advanced on-chip structures such as a comprehensive clocking structure (including PLLs), programmable I/O cells, SERDES/PCS capabilities, and dedicated DSP/memory resources as detailed in the ECP5 family datasheet.
  • Regulatory  RoHS compliant.

Typical Applications

  • Industrial Control and Automation  Industrial-grade temperature rating and robust I/O count make the device suitable for control logic, sensor aggregation, and protocol bridging in factory and process automation.
  • Communications and Connectivity  Large I/O complement and family SERDES/PCS building blocks support protocol adaptation, custom interface logic, and deterministic packet handling in networking equipment.
  • Embedded and Edge Processing  Substantial logic resources and on-chip RAM enable hardware acceleration, packet buffering, and control-plane functions in embedded systems and edge devices.

Unique Advantages

  • Balanced Logic and Memory  A combination of ~84,000 logic elements and ~3.83 Mbits of embedded RAM allows designers to implement both complex control logic and local data storage without immediate reliance on external memory.
  • High-Density I/O in a Compact Package  365 I/Os in a 27 × 27 mm 756-CABGA package support high-pin-count designs while keeping PCB footprint modest.
  • Industrial Temperature Rating  Specified −40 °C to 100 °C operation addresses many industrial and deployed-environment use cases where extended temperature range is required.
  • Tight Core Voltage Window  A defined core supply range (1.045 V–1.155 V) simplifies power budgeting and helps ensure consistent device behavior across assemblies.
  • Family-Level System Resources  Built on the ECP5 family architecture with documented clocking, I/O, SERDES, and DSP/memory blocks, enabling integration of system-level functions using family-provided primitives.
  • RoHS Compliant  Meets RoHS requirements for lead-free manufacturing and assembly processes.

Why Choose LFE5UM-85F-6BG756I?

The LFE5UM-85F-6BG756I positions itself as a mid-density, industrial-grade FPGA that combines a sizable logic fabric, substantial embedded memory, and a large I/O count in a compact 756-FBGA package. Its defined core voltage and extended operating temperature range make it appropriate for designs that require predictable power behavior and deployment in harsher environments.

This part is suited to developers and procurement teams building industrial control systems, communications interfaces, and embedded processing functions that benefit from on-chip memory and ample I/O. The device leverages the documented ECP5 family architecture to provide system-focused resources such as clocking, programmable I/O, and SERDES/PCS building blocks for streamlined implementation.

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