LFE5UM-85F-7BG756I

The LFE5UM-85F-7BG756I is an ECP5 family Field Programmable Gate Array (FPGA) IC offering a mid-to-high logic density FPGA fabric optimized for embedded and industrial designs. It integrates a large logic array with on-chip memory, extensive I/O, and a compact high-pin-count package to address a range of system-level interface and processing tasks.

Designed for industrial-grade deployments, this device combines 84,000 logic elements and approximately 3.83 Mbits of embedded memory with 365 user I/Os, a low-voltage core supply range, and a 27 × 27 756‑CABGA package for dense board-level integration.

Key Features

• Logic Capacity — 84,000 logic elements provide substantial programmable fabric for glue logic, protocol bridging, and custom hardware acceleration.
• Embedded Memory — Approximately 3.83 Mbits of on-chip RAM for buffer, lookup-table, and small memory-mapped storage needs.
• I/O and Package — 365 user I/Os in a 756‑FBGA package (supplier device package: 756‑CABGA, 27 × 27) to support wide parallel interfaces and high pin-count routing.
• Power — Core supply operating range of 1.045 V to 1.155 V for defined low-voltage operation and predictable power budgeting.
• Industrial Temperature & Grade — Rated for industrial use with operating temperature from −40 °C to 100 °C to meet harsher environmental requirements.
• Mounting & Compliance — Surface-mount device with RoHS compliance for modern manufacturing and regulatory requirements.
• Family-Level Architecture — ECP5 family features referenced in the product datasheet include programmable I/O cells, SERDES and physical coding sublayer support, DDR memory interface capabilities, sysDSP slices, sysCLOCK PLLs and flexible clock distribution — enabling common high-speed I/O and signal-processing use cases.

Typical Applications

• Industrial control and automation — Implement custom control logic, protocol conversion, and deterministic I/O handling within industrial systems that require extended temperature operation.
• High-speed serial connectivity — Use the device’s SERDES and flexible I/O for serial link interfacing and protocol bridging tasks.
• Memory interface and buffering — Leverage on-chip RAM and DDR support for buffering, frame storage, and temporary data staging between system components.
• Embedded signal processing — Employ the programmable fabric and sysDSP capabilities for dedicated signal-processing functions and custom accelerators.

Unique Advantages

• High logic density: 84,000 logic elements enable complex designs and multi-function implementations on a single device, reducing board-level component count.
• Generous I/O in a compact footprint: 365 I/Os in a 27 × 27 756‑CABGA package provide high connectivity without excessive PCB area.
• Industrial robustness: Industrial-grade qualification and an operating range of −40 °C to 100 °C support deployment in demanding environments.
• Defined low-voltage core: Narrow core supply window (1.045 V–1.155 V) assists in precise power-supply design and thermal planning.
• On-chip resources for system integration: Approximately 3.83 Mbits of embedded memory plus family-level support for SERDES, DDR interfaces, and DSP slices simplify integration of memory buffering, serial links, and signal-processing blocks.
• Manufacturing-friendly package and compliance: Surface-mount 756‑FBGA packaging combined with RoHS compliance aligns with modern assembly and environmental standards.

Why Choose LFE5UM-85F-7BG756I?

The LFE5UM-85F-7BG756I positions itself as a versatile FPGA solution within the ECP5 family for designers who need substantial logic capacity, embedded memory, and high I/O density in an industrial-grade package. Its combination of 84,000 logic elements, ~3.83 Mbits of on-chip RAM, and 365 I/Os in a compact 756‑CABGA footprint supports consolidation of interface, control, and processing functions onto a single device.

This device is suited to engineering teams building industrial systems, connectivity modules, or embedded platforms that require predictable low-voltage operation, wide operating temperature range, and the architectural building blocks described in the ECP5 family datasheet for clocking, SERDES, DDR interfacing, and DSP-style processing.

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