LFE5UM-85F-6BG381C
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 205 3833856 84000 381-FBGA |
|---|---|
| Quantity | 1,254 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 381-CABGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 381-FBGA | Number of I/O | 205 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21000 | Number of Logic Elements/Cells | 84000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFE5UM-85F-6BG381C – ECP5 Field Programmable Gate Array (FPGA) IC 205 3833856 84000 381-FBGA
The LFE5UM-85F-6BG381C is an ECP5-family FPGA from Lattice Semiconductor, offering mid-range programmable logic capacity in a compact 381-ball FBGA package. It combines programmable logic, on-chip memory, and flexible I/O in a surface-mount 17 × 17 mm CABGA footprint for commercial embedded and communications applications.
Designed for systems that require significant logic density, embedded RAM and a broad I/O count, this device targets applications where integration and form factor matter while operating within a commercial temperature range.
Key Features
- Logic Capacity — Approximately 84,000 logic elements suitable for mid-density FPGA designs and moderate compute pipelines.
- Embedded Memory — Approximately 3.8 Mbits of on-chip RAM to support frame buffers, packet buffering, and local data storage without external memory for many use cases.
- I/O Resources — 205 general-purpose I/Os to support a mix of peripheral interfaces and high-pin-count designs.
- Clocking and Timing — ECP5 family documentation includes clock management features such as sysCLOCK PLLs and clock distribution networks for flexible timing architectures.
- High-speed Interfaces — ECP5 family features SERDES and DDR memory support as described in the family datasheet, enabling interface bridging and higher-bandwidth links when required.
- Package and Mounting — 381-ball FBGA (supplier package: 381-CABGA, 17×17 mm) in a surface-mount form factor to minimize PCB area.
- Power Supply — Core supply range specified from 1.045 V to 1.155 V; suitable for designs targeting low-voltage core operation.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature.
- Compliance — RoHS-compliant component.
Typical Applications
- Communication and Networking Equipment — Use the device for interface bridging, protocol conversion and mid-range packet processing leveraging its logic density and SERDES/DDR capabilities (ECP5 family).
- Video and Imaging Subsystems — On-chip RAM and plentiful I/O make it suitable for buffering, preprocessing and format conversion tasks in commercial AV equipment.
- Test & Measurement — Implement custom data acquisition, signal conditioning logic and deterministic processing pipelines using the FPGA’s logic and memory resources.
- Embedded Systems and Prototyping — Ideal for developers needing a compact, reprogrammable platform with substantial I/O for add-on peripherals and sensors.
Unique Advantages
- Substantial Logic Density: Approximately 84,000 logic elements provide a balance of capacity and cost for mid-range designs.
- Integrated On-Chip Memory: Approximately 3.8 Mbits of embedded RAM reduces the need for external memory in many buffering and storage use cases.
- High I/O Count: 205 I/Os enable connectivity to multiple peripherals and parallel interfaces without immediate external I/O expanders.
- Compact, Surface-Mount Package: 381-CABGA (17×17) package minimizes PCB footprint while providing high pin density.
- Narrow Core Voltage Window: Core supply specified between 1.045 V and 1.155 V supports consistent low-voltage operation when integrated into modern power rails.
- Commercial Temperature Rating and RoHS Compliance: Suited for a wide set of commercial products while meeting RoHS environmental requirements.
Why Choose LFE5UM-85F-6BG381C?
The LFE5UM-85F-6BG381C positions itself as a versatile, mid-density FPGA solution within the Lattice ECP5 family. It provides a practical mix of logic elements, embedded memory and a high I/O count in a compact 381-FBGA package, making it appropriate for commercial embedded designs, communications equipment, and imaging or test systems that require integration and flexibility.
Backed by the ECP5 family documentation, this device is a suitable option for designers seeking a scalable FPGA platform with documented clocking, memory and SERDES features. Its combination of resources and package size supports compact board layouts and efficient system integration for product lines operating in commercial environments.
Request a quote or submit an inquiry to start procurement for the LFE5UM-85F-6BG381C and evaluate how this ECP5-family FPGA meets your design requirements.

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