LFE5UM-85F-8BG756I

IC FPGA 365 I/O 756CABGA
Part Description

ECP5 Field Programmable Gate Array (FPGA) IC 365 3833856 84000 756-FBGA

Quantity 1,597 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package756-CABGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case756-FBGANumber of I/O365Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21000Number of Logic Elements/Cells84000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3833856

Overview of LFE5UM-85F-8BG756I – ECP5 Field Programmable Gate Array (FPGA) IC 365 3833856 84000 756-FBGA

The LFE5UM-85F-8BG756I is an industrial-grade ECP5 family FPGA from Lattice Semiconductor Corporation. It delivers a mid-range programmable fabric with 84,000 logic elements, approximately 3.8 Mbits of embedded RAM, and 365 general-purpose I/O to support I/O‑dense and logic‑intensive designs.

Packaged in a 756‑FBGA (27 × 27) surface-mount package and specified for operation from -40 °C to 100 °C with a core supply range of 1.045 V to 1.155 V, this device targets industrial applications that require reliable field-programmable logic and flexible system interfacing.

Key Features

  • Logic Capacity — 84,000 logic elements to implement complex combinational and sequential logic in a compact FPGA device.
  • Embedded Memory — Approximately 3.8 Mbits of on-chip RAM to support buffering, LUT-based storage, and localized data processing.
  • High I/O Count — 365 I/O pins for dense external interfacing and multiple peripheral connections.
  • Industrial Grade — Device grade listed as Industrial with an operating temperature range of -40 °C to 100 °C suitable for industrial environments.
  • Package & Mounting — 756‑FBGA (supplier package 756‑CABGA, 27 × 27) in a surface-mount package for space-efficient board integration.
  • Power — Core supply operating window of 1.045 V to 1.155 V for predictable power budgeting.
  • Standards & Family Features — ECP5 family data sheet documents family features including programmable I/O cells, flexible clocking and PLL structure, SERDES and DDR memory support, configuration options, and device-level reliability features such as boundary-scan and SEU support.
  • Compliance — RoHS compliant for lead-free, environmentally conscious designs.

Typical Applications

  • Industrial Control — Implement deterministic control logic, protocol bridging and sensor aggregation in harsh-temperature environments.
  • Communications & Networking — Use the device for protocol adaptation, parallel-to-serial interfacing and I/O-rich connectivity blocks.
  • Embedded System Offload — Offload custom datapaths and glue logic from CPUs to reduce system complexity and central processor load.
  • Machine Vision & Preprocessing — Implement front-end preprocessing, buffering and I/O management for vision and imaging pipelines.

Unique Advantages

  • Highly integrated logic fabric: 84,000 logic elements enable consolidation of multiple functions into a single programmable device, reducing BOM and board complexity.
  • Significant on-chip memory: Approximately 3.8 Mbits of embedded RAM provides local storage for buffering, FIFOs, and small lookup tables without external memory.
  • Extensive system I/O: 365 I/O pins accommodate dense peripheral and interface requirements for complex embedded systems.
  • Industrial temperature rating: Specified operation from -40 °C to 100 °C supports deployment in industrial environments.
  • Compact FBGA packaging: 756‑FBGA (27 × 27) surface-mount package saves PCB area while supporting high pin count routing.
  • Predictable power window: Narrow core supply range (1.045 V to 1.155 V) simplifies power-supply design and margining.

Why Choose LFE5UM-85F-8BG756I?

The LFE5UM-85F-8BG756I balances substantial logic capacity, on-chip memory, and a high I/O count in an industrial-grade, compact FBGA package. It is well suited for engineers designing mid-range FPGA-based systems that require dense interfacing, localized memory, and reliable operation across a wide temperature range.

Backed by the ECP5 family architecture documentation, this device is appropriate for teams needing scalable programmable logic with family-level features such as flexible clocking, programmable I/O, and SERDES/DDR support as described in the ECP5 data materials.

Request a quote or submit an inquiry to obtain pricing, lead times, and availability for the LFE5UM-85F-8BG756I.

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