LFE5UM-85F-8BG756I
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 365 3833856 84000 756-FBGA |
|---|---|
| Quantity | 1,597 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 756-CABGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 756-FBGA | Number of I/O | 365 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21000 | Number of Logic Elements/Cells | 84000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFE5UM-85F-8BG756I – ECP5 Field Programmable Gate Array (FPGA) IC 365 3833856 84000 756-FBGA
The LFE5UM-85F-8BG756I is an industrial-grade ECP5 family FPGA from Lattice Semiconductor Corporation. It delivers a mid-range programmable fabric with 84,000 logic elements, approximately 3.8 Mbits of embedded RAM, and 365 general-purpose I/O to support I/O‑dense and logic‑intensive designs.
Packaged in a 756‑FBGA (27 × 27) surface-mount package and specified for operation from -40 °C to 100 °C with a core supply range of 1.045 V to 1.155 V, this device targets industrial applications that require reliable field-programmable logic and flexible system interfacing.
Key Features
- Logic Capacity — 84,000 logic elements to implement complex combinational and sequential logic in a compact FPGA device.
- Embedded Memory — Approximately 3.8 Mbits of on-chip RAM to support buffering, LUT-based storage, and localized data processing.
- High I/O Count — 365 I/O pins for dense external interfacing and multiple peripheral connections.
- Industrial Grade — Device grade listed as Industrial with an operating temperature range of -40 °C to 100 °C suitable for industrial environments.
- Package & Mounting — 756‑FBGA (supplier package 756‑CABGA, 27 × 27) in a surface-mount package for space-efficient board integration.
- Power — Core supply operating window of 1.045 V to 1.155 V for predictable power budgeting.
- Standards & Family Features — ECP5 family data sheet documents family features including programmable I/O cells, flexible clocking and PLL structure, SERDES and DDR memory support, configuration options, and device-level reliability features such as boundary-scan and SEU support.
- Compliance — RoHS compliant for lead-free, environmentally conscious designs.
Typical Applications
- Industrial Control — Implement deterministic control logic, protocol bridging and sensor aggregation in harsh-temperature environments.
- Communications & Networking — Use the device for protocol adaptation, parallel-to-serial interfacing and I/O-rich connectivity blocks.
- Embedded System Offload — Offload custom datapaths and glue logic from CPUs to reduce system complexity and central processor load.
- Machine Vision & Preprocessing — Implement front-end preprocessing, buffering and I/O management for vision and imaging pipelines.
Unique Advantages
- Highly integrated logic fabric: 84,000 logic elements enable consolidation of multiple functions into a single programmable device, reducing BOM and board complexity.
- Significant on-chip memory: Approximately 3.8 Mbits of embedded RAM provides local storage for buffering, FIFOs, and small lookup tables without external memory.
- Extensive system I/O: 365 I/O pins accommodate dense peripheral and interface requirements for complex embedded systems.
- Industrial temperature rating: Specified operation from -40 °C to 100 °C supports deployment in industrial environments.
- Compact FBGA packaging: 756‑FBGA (27 × 27) surface-mount package saves PCB area while supporting high pin count routing.
- Predictable power window: Narrow core supply range (1.045 V to 1.155 V) simplifies power-supply design and margining.
Why Choose LFE5UM-85F-8BG756I?
The LFE5UM-85F-8BG756I balances substantial logic capacity, on-chip memory, and a high I/O count in an industrial-grade, compact FBGA package. It is well suited for engineers designing mid-range FPGA-based systems that require dense interfacing, localized memory, and reliable operation across a wide temperature range.
Backed by the ECP5 family architecture documentation, this device is appropriate for teams needing scalable programmable logic with family-level features such as flexible clocking, programmable I/O, and SERDES/DDR support as described in the ECP5 data materials.
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