LFEC1E-3Q208I

The LFEC1E-3Q208I is an EC field-programmable gate array (FPGA) IC provided in a 208-BFQFP package. It delivers 1500 logic elements, approximately 18,432 bits of on-chip RAM and 112 general-purpose I/O pins for implementing custom digital functions and interfaces.

Designed and graded for industrial applications, this device supports a low-voltage supply range of 1.14 V to 1.26 V and an operating temperature range of -40 °C to 100 °C, making it suitable for embedded designs that require programmable logic in thermally demanding environments.

Key Features

• Programmable Logic Capacity — 1500 logic elements to implement custom digital logic, state machines, and glue-logic functions.
• Embedded Memory — Approximately 18,432 bits of total on-chip RAM to support small data buffers, FIFOs, or lookup tables.
• Flexible I/O — 112 I/O pins for interfacing with peripherals, sensors, and other system components.
• Low-Voltage Operation — Supply voltage range from 1.14 V to 1.26 V to match low-voltage system domains.
• Industrial Temperature Rating — Rated for operation from -40 °C to 100 °C to meet industrial environmental requirements.
• Package and Mounting — 208-BFQFP (supplier device package: 208-PQFP 28×28) in a surface-mount form factor for compact board-level integration.
• Environmental Compliance — RoHS compliant to support environmentally conscious manufacturing.

Typical Applications

• Industrial Control and Automation — Use the 1500 logic elements and 112 I/Os to implement custom control logic, protocol bridging, and interface adaptation in industrial equipment rated for -40 °C to 100 °C.
• Embedded System Glue Logic — Consolidate multiple discrete functions into programmable logic to simplify PCB layouts and reduce component count.
• Sensor and Peripheral Interfaces — Leverage abundant I/O and on-chip RAM for buffering and timing-sensitive interfacing with sensors and external peripherals.

Unique Advantages

• Compact, high-pin-count package: The 208-BFQFP surface-mount package provides a high I/O count in a compact footprint to maximize functionality in constrained board space.
• Industrial robustness: Qualified for -40 °C to 100 °C operation, supporting deployment in thermally demanding embedded systems.
• Low-voltage compatibility: Operates within a 1.14 V to 1.26 V supply range to integrate with modern low-voltage domains.
• On-chip memory for local buffering: Approximately 18,432 bits of RAM enable small data storage and timing management without external memory.
• Wide I/O flexibility: 112 I/Os provide flexibility for multiple peripheral connections and custom interface implementations.
• RoHS compliant: Meets environmental compliance requirements for lead-free manufacturing processes.

Why Choose LFEC1E-3Q208I?

The LFEC1E-3Q208I positions itself as a flexible, industrial-grade FPGA option for embedded designs requiring moderate logic density, ample I/O, and on-chip memory in a surface-mount 208-BFQFP package. Its low-voltage operation and extended temperature range make it suitable for industrial control, interface consolidation, and embedded glue-logic applications.

Designers and procurement teams seeking a programmable logic device with clear thermal and electrical bounds will find the LFEC1E-3Q208I a practical choice for reducing board complexity while meeting industrial environmental requirements.

If you would like pricing, availability, or to request a quote for the LFEC1E-3Q208I, please submit a quote request or contact sales for further assistance.