LFEC1E-3QN208C

IC FPGA 112 I/O 208QFP
Part Description

EC Field Programmable Gate Array (FPGA) IC 112 18432 1500 208-BFQFP

Quantity 413 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O112Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs192Number of Logic Elements/Cells1500
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of LFEC1E-3QN208C – EC Field Programmable Gate Array (FPGA) IC 112 I/Os, 18,432 bits RAM, 1,500 Logic Elements, 208-BFQFP

The LFEC1E-3QN208C is an EC-family field programmable gate array (FPGA) from Lattice Semiconductor designed for mainstream, cost-sensitive digital designs. It provides a compact, surface-mount FPGA implementation with a balance of logic capacity, on-chip memory and I/O to support embedded control, interface bridging and general-purpose programmable logic tasks.

Built on the LatticeECP/EC architecture, the device targets applications that require flexible I/O, low-voltage core operation and commercial-temperature operation while minimizing board space and overall system BOM.

Key Features

  • Core Logic — Approximately 1,500 logic elements and 192 logic blocks provide the configurable fabric for glue logic, state machines and control functions.
  • On-chip Memory — Total RAM of 18,432 bits (~18 Kbits) suitable for small FIFOs, register files and buffering in control and interface applications.
  • I/O Capacity & Flexibility — 112 I/Os available in the 208-pin package to support multiple parallel interfaces, GPIO and peripheral connections.
  • Power Rail — Core voltage supply range from 1.14 V to 1.26 V (nominal 1.2 V), enabling integration into low-voltage systems.
  • Clocking — Family documentation indicates integrated PLL support; the LFEC1-class device includes 2 PLLs for clock management and deskewing.
  • Package & Mounting — 208-BFQFP (208-pin PQFP, 28 × 28 mm) surface-mount package for compact board-level integration.
  • Operating Range — Commercial temperature grade: 0 °C to 85 °C, suitable for consumer and many industrial/business environments where commercial-grade components are specified.
  • Compliance — RoHS compliant, meeting common environmental requirements for lead-free assembly.
  • System-Level Support (Family) — LatticeECP/EC family-level features include SPI boot flash interface, IEEE 1149.1 boundary scan and support in the ispLEVER tool suite for synthesis and place-and-route workflows.

Typical Applications

  • Embedded Control — Implement real-time control logic, glue logic and protocol translators for consumer and commercial equipment.
  • Interface & I/O Expansion — Provide parallel and serial I/O aggregation, bus bridging and custom peripheral interfacing using the device’s 112 I/Os.
  • Memory Interface & Buffering — Use on-chip RAM and clocking resources for temporary buffering and data path alignment in systems that require compact memory handling.
  • Prototyping & Low-Cost FPGA Designs — Ideal for developers targeting low-cost, small-package FPGA implementations in evaluation and production of mainstream applications.

Unique Advantages

  • Right-sized Logic Capacity: ~1,500 logic elements provide a practical balance of capability and cost for modest FPGA designs without excessive device overhead.
  • Generous I/O Count: 112 I/Os in a 208-pin PQFP package simplify board routing and reduce the need for external I/O expanders.
  • Low-Voltage Core Operation: 1.14 V–1.26 V supply range aligns with modern low-voltage system architectures and reduces core power consumption.
  • Compact Surface-Mount Package: 208-BFQFP (28 × 28 mm) provides a small footprint solution for space-constrained PCBs while maintaining robust pin density.
  • Design Ecosystem: Supported by the LatticeECP/EC family tools and features (boundary scan, SPI boot), easing integration into established development flows.
  • RoHS Compliance: Meets common lead-free assembly requirements for commercial products.

Why Choose LFEC1E-3QN208C?

The LFEC1E-3QN208C offers a pragmatic FPGA option for designers who need a compact, low-voltage, commercially graded programmable device with a solid mix of logic, memory and I/O. Its LatticeECP/EC lineage provides family-level system features and toolchain support that streamline development and deployment for mainstream applications.

This device is well suited to customers building cost-conscious embedded systems, interface controllers and I/O-rich applications that benefit from a surface-mount 208-pin package, commercial operating range and integrated clocking capabilities.

Request a quote or contact sales to discuss availability, pricing and how the LFEC1E-3QN208C can fit into your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up