LFEC1E-3QN208C
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 112 18432 1500 208-BFQFP |
|---|---|
| Quantity | 413 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 112 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 192 | Number of Logic Elements/Cells | 1500 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of LFEC1E-3QN208C – EC Field Programmable Gate Array (FPGA) IC 112 I/Os, 18,432 bits RAM, 1,500 Logic Elements, 208-BFQFP
The LFEC1E-3QN208C is an EC-family field programmable gate array (FPGA) from Lattice Semiconductor designed for mainstream, cost-sensitive digital designs. It provides a compact, surface-mount FPGA implementation with a balance of logic capacity, on-chip memory and I/O to support embedded control, interface bridging and general-purpose programmable logic tasks.
Built on the LatticeECP/EC architecture, the device targets applications that require flexible I/O, low-voltage core operation and commercial-temperature operation while minimizing board space and overall system BOM.
Key Features
- Core Logic — Approximately 1,500 logic elements and 192 logic blocks provide the configurable fabric for glue logic, state machines and control functions.
- On-chip Memory — Total RAM of 18,432 bits (~18 Kbits) suitable for small FIFOs, register files and buffering in control and interface applications.
- I/O Capacity & Flexibility — 112 I/Os available in the 208-pin package to support multiple parallel interfaces, GPIO and peripheral connections.
- Power Rail — Core voltage supply range from 1.14 V to 1.26 V (nominal 1.2 V), enabling integration into low-voltage systems.
- Clocking — Family documentation indicates integrated PLL support; the LFEC1-class device includes 2 PLLs for clock management and deskewing.
- Package & Mounting — 208-BFQFP (208-pin PQFP, 28 × 28 mm) surface-mount package for compact board-level integration.
- Operating Range — Commercial temperature grade: 0 °C to 85 °C, suitable for consumer and many industrial/business environments where commercial-grade components are specified.
- Compliance — RoHS compliant, meeting common environmental requirements for lead-free assembly.
- System-Level Support (Family) — LatticeECP/EC family-level features include SPI boot flash interface, IEEE 1149.1 boundary scan and support in the ispLEVER tool suite for synthesis and place-and-route workflows.
Typical Applications
- Embedded Control — Implement real-time control logic, glue logic and protocol translators for consumer and commercial equipment.
- Interface & I/O Expansion — Provide parallel and serial I/O aggregation, bus bridging and custom peripheral interfacing using the device’s 112 I/Os.
- Memory Interface & Buffering — Use on-chip RAM and clocking resources for temporary buffering and data path alignment in systems that require compact memory handling.
- Prototyping & Low-Cost FPGA Designs — Ideal for developers targeting low-cost, small-package FPGA implementations in evaluation and production of mainstream applications.
Unique Advantages
- Right-sized Logic Capacity: ~1,500 logic elements provide a practical balance of capability and cost for modest FPGA designs without excessive device overhead.
- Generous I/O Count: 112 I/Os in a 208-pin PQFP package simplify board routing and reduce the need for external I/O expanders.
- Low-Voltage Core Operation: 1.14 V–1.26 V supply range aligns with modern low-voltage system architectures and reduces core power consumption.
- Compact Surface-Mount Package: 208-BFQFP (28 × 28 mm) provides a small footprint solution for space-constrained PCBs while maintaining robust pin density.
- Design Ecosystem: Supported by the LatticeECP/EC family tools and features (boundary scan, SPI boot), easing integration into established development flows.
- RoHS Compliance: Meets common lead-free assembly requirements for commercial products.
Why Choose LFEC1E-3QN208C?
The LFEC1E-3QN208C offers a pragmatic FPGA option for designers who need a compact, low-voltage, commercially graded programmable device with a solid mix of logic, memory and I/O. Its LatticeECP/EC lineage provides family-level system features and toolchain support that streamline development and deployment for mainstream applications.
This device is well suited to customers building cost-conscious embedded systems, interface controllers and I/O-rich applications that benefit from a surface-mount 208-pin package, commercial operating range and integrated clocking capabilities.
Request a quote or contact sales to discuss availability, pricing and how the LFEC1E-3QN208C can fit into your next design.

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