LFEC15E-5FN256C

The LFEC15E-5FN256C is a commercial-grade EC-series Field Programmable Gate Array (FPGA) in a 256-ball fpBGA (17×17 mm) package. It provides a flexible FPGA fabric with 15,400 logic elements, extensive I/O, and on-chip memory to address mainstream cost-sensitive embedded and system-level designs.

Built for low-voltage operation, the device accepts a core supply range of 1.14 V to 1.26 V (nominal 1.2 V) and is specified for commercial operating temperatures of 0 °C to 85 °C. The part is RoHS compliant.

Key Features

• Logic Capacity  15,400 logic elements provide significant fabric resources for complex glue logic, protocol bridging, and control functions.
• On‑chip Memory  Total on-chip RAM of 358,400 bits (approximately 0.36 Mbits) supports embedded data buffering and state storage.
• I/O Density  195 user I/Os in the 256-ball fpBGA package accommodate wide bus interfaces and multiple peripheral connections.
• Package & Mounting  256-FPBGA (17×17 mm) surface-mount package delivers a compact, board-friendly footprint for high-density designs.
• Supply & Power  Core voltage range 1.14 V to 1.26 V (nominal 1.2 V) for low-voltage system integration.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C.
• Standards & Compliance  RoHS compliant for environmental and manufacturing compatibility.
• Series-Level System Features  The Lattice ECP/EC family offers system-level capabilities such as programmable I/O support for a wide range of interfaces, PLL-based clocking, SPI boot flash interface and boundary-scan support (series-level features described in the family datasheet).

Typical Applications

• Embedded controllers  Implement control logic, peripheral aggregation, and custom state machines using the on-chip logic and memory.
• High‑density I/O bridging  Use the 195 I/Os in the fpBGA package for protocol bridging, multi‑interface routing, and board-level I/O consolidation.
• Memory-interface subsystems  Leverage the device’s embedded memory and family DDR interface support for designs that require local buffering and external memory coordination.
• Consumer and communications equipment  Integrate custom glue logic and interface adaptation in space-constrained products where low-voltage operation and compact packaging are important.

Unique Advantages

• Substantial logic resources: 15,400 logic elements give designers headroom for moderate to complex functionality without external ASICs.
• Balanced on‑chip memory: Approximately 0.36 Mbits of embedded RAM supports internal buffering and state retention for control and data paths.
• High I/O count in compact package: 195 I/Os in a 17×17 mm 256-FPBGA enable dense board-level connectivity while minimizing PCB area.
• Low-voltage core operation: 1.14 V to 1.26 V supply range aligns with modern low-voltage system architectures.
• Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for broad commercial deployments and manufacturing requirements.
• Family-level design support: The Lattice ECP/EC family provides design tools and pre‑designed IP to accelerate implementation and migration.

Why Choose LFEC15E-5FN256C?

The LFEC15E-5FN256C delivers a practical balance of logic capacity, I/O density, and embedded memory in a compact 256-ball fpBGA package and low-voltage core. It is positioned for mainstream, cost-conscious designs that require substantial programmable logic and flexible interfacing while maintaining a small board footprint.

Designers benefit from family-level tool and IP support to streamline development and scale to other members of the Lattice ECP/EC family as project requirements evolve.

Request a quote for LFEC15E-5FN256C to check availability, lead times, and pricing or to discuss project requirements with the product team.