LFEC15E-4FN256I

The LFEC15E-4FN256I is an industrial-grade EC (EConomy) FPGA from Lattice Semiconductor Corporation, offering a balanced combination of logic density, on-chip memory and flexible I/O in a compact 256-ball fpBGA package. Built on the LatticeECP/EC family architecture, this device targets mainstream embedded designs that require programmable logic, on-chip memory and broad interface support within an industrial temperature range.

With 15,400 logic elements, approximately 358,400 bits of on-chip RAM and 195 I/O pins, the LFEC15E-4FN256I is suited for applications that need moderate logic capacity, substantial embedded memory and a wide range of I/O signaling options while maintaining a small board footprint.

Key Features

• Logic Capacity  Approximately 15,400 logic elements suitable for mid-range programmable logic integration.
• On-chip Memory  Approximately 358,400 bits of embedded RAM to support frame buffers, small data stores and control structures.
• I/O Flexibility  195 I/O pins accessible from the 256-ball fpBGA (17 × 17 mm) package for diverse interface requirements.
• Power Supply  Core voltage range of 1.14 V to 1.26 V consistent with the device family’s 1.2 V core architecture.
• Industrial Temperature Grade  Qualified for operation from −40 °C to 100 °C for use in industrial environments.
• Package and Mounting  256-ball fpBGA (256-FPBGA, 17×17 mm) in a surface-mount footprint for compact board designs.
• Family-level System Support  LatticeECP/EC family features include dedicated DSP/multiply-accumulate blocks, embedded block RAM, programmable I/O buffer standards, multiple PLLs and system-level functions such as SPI boot flash interface and boundary-scan support.

Typical Applications

• Industrial Control and Automation  Industrial-grade temperature range and a flexible I/O set allow implementation of control logic, sensor aggregation and protocol bridging in factory or process environments.
• Communications and Networking  Multiple I/Os and embedded memory support packet buffering, protocol handling and interface conversion in cost-sensitive networking modules.
• Memory Interface and Bridge Functions  Family-level dedicated DDR interface support and on-chip RAM make the device suitable for memory controller logic and data path bridging.

Unique Advantages

• Balanced Logic and Memory  Combines approximately 15,400 logic elements with ~358 Kbits of on-chip RAM to implement control, buffering and data-path logic without external SRAM in many designs.
• High I/O Count in a Compact Package  195 I/Os in a 256-ball fpBGA (17 × 17 mm) package reduces PCB area while providing extensive external connectivity.
• Industrial Temperature Operation  Rated from −40 °C to 100 °C to support deployment in industrial-grade systems and harsher operating environments.
• Flexible System Integration  LatticeECP/EC family capabilities—programmable I/O standards, multiple PLLs and SPI boot support—help integrate the FPGA into complex system architectures.
• Compact Surface-Mount Form Factor  Surface-mount 256-FPBGA package supports modern assembly processes and dense board layouts.

Why Choose LFEC15E-4FN256I?

The LFEC15E-4FN256I is positioned as a mid-density, industrial-grade EC FPGA that delivers a practical mix of logic elements, embedded RAM and a high number of I/Os in a small fpBGA package. This combination is appropriate for engineers designing embedded systems that require programmable logic, on-chip memory and broad connectivity while meeting industrial temperature requirements.

Customers seeking scalability within the LatticeECP/EC family benefit from the device’s family-level architecture and system-oriented features—such as programmable I/O options, PLLs and SPI boot support—allowing designs to grow or migrate across densities while leveraging the same toolchain and IP ecosystem.

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