LFEC15E-4F484I
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 352 358400 15400 484-BBGA |
|---|---|
| Quantity | 1,950 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 352 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 15400 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 358400 |
Overview of LFEC15E-4F484I – EC Field Programmable Gate Array (FPGA) IC, 352 I/O, 15,400 logic elements, 484‑BBGA
The LFEC15E-4F484I is an EC Field Programmable Gate Array (FPGA) IC manufactured by Lattice Semiconductor Corporation. It integrates 15,400 logic elements and approximately 0.36 Mbits of embedded memory to support mid-density programmable logic designs.
Packaged in a 484‑BBGA (supplier package: 484‑FPBGA 23×23) surface-mount device, the device operates from a 1.14 V to 1.26 V supply and is specified for industrial temperature use from -40 °C to 100 °C. It is RoHS compliant.
Key Features
- Logic Capacity 1,920 LABs/CLBs providing 15,400 logic elements for mid-density logic integration and custom digital implementation.
- Embedded Memory 358,400 bits of on-chip RAM (approximately 0.36 Mbits) to support storage and buffering within the FPGA fabric.
- I/O Density 352 I/O pins to enable extensive external interfacing and connectivity for peripherals and subsystems.
- Package and Mounting 484‑BBGA package (supplier device package: 484‑FPBGA 23×23) in a surface-mount form factor for compact board-level integration.
- Power Supports a core supply range of 1.14 V to 1.26 V, allowing predictable power budgeting for the FPGA core.
- Industrial Temperature Range Specified for operation from -40 °C to 100 °C and categorized as Industrial grade for applications requiring extended temperature performance.
- Compliance RoHS compliant, meeting lead-free and restricted substances requirements for modern assembly processes.
Unique Advantages
- Mid-density programmable logic: 15,400 logic elements enable consolidation of custom logic without moving to larger device classes.
- On-chip memory: Approximately 0.36 Mbits of embedded RAM reduces external memory dependencies for many control and buffering tasks.
- High pin count for connectivity: 352 I/O pins support multiple interfaces and peripherals from a single FPGA package.
- Industrial temperature support: Rated from -40 °C to 100 °C to meet temperature demands of industrial deployments.
- Compact surface-mount package: 484‑BBGA (484‑FPBGA 23×23) provides a dense footprint for space-constrained board designs.
- Standards-friendly compliance: RoHS compliance aligns with lead-free manufacturing requirements.
Why Choose LFEC15E-4F484I?
The LFEC15E-4F484I delivers a balanced combination of logic capacity, embedded RAM, and high I/O count in a compact 484‑BBGA surface-mount package. Its industrial temperature rating and defined supply range make it suitable for designs that require predictable behavior across extended environmental conditions.
Offered by Lattice Semiconductor Corporation, this FPGA is appropriate for teams seeking a mid-density programmable solution with on-chip memory and extensive I/O in a compact form factor, while maintaining compliance with RoHS requirements.
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