LFEC15E-3FN256I
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 195 358400 15400 256-BGA |
|---|---|
| Quantity | 1,981 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 195 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 15400 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 358400 |
Overview of LFEC15E-3FN256I – EC Field Programmable Gate Array (FPGA) IC 195 358400 15400 256-BGA
The LFEC15E-3FN256I is a Lattice EC family field programmable gate array providing a mid-range logic density and flexible I/O capability in a compact 256-ball fpBGA (17 × 17 mm) package. It integrates approximately 15,400 logic elements and embedded memory to support mainstream embedded and industrial applications that require configurable logic, on-chip RAM, and a high I/O count.
This device is positioned for designs that need a balance of integration, I/O capacity and industrial operating range, delivering on-chip resources and system-level features derived from the LatticeECP/EC family architecture.
Key Features
- Logic Capacity Approximately 15,400 logic elements for implementing moderately complex digital designs.
- Embedded Memory Approximately 358,400 bits (≈0.36 Mbits) of on-chip RAM for data buffering, state storage and small memory blocks.
- I/O Density 195 user I/Os to support multiple parallel interfaces, external control signals and board-level interconnect.
- Flexible I/O and Interface Support Family-level I/O flexibility includes support for common signaling standards and dedicated DDR interface logic for memory subsystems (as provided in the LatticeECP/EC family specification).
- Clocking and System Support Device family includes analog PLL resources and system-level features such as boundary-scan and SPI boot interface (per LatticeECP/EC family data).
- Power Supported core voltage range of 1.14 V to 1.26 V, enabling standard 1.2 V power domains common in modern systems.
- Package and Mounting 256-ball fpBGA (17 × 17 mm) package, surface-mount for compact board integration.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for industrial and temperature-challenging environments.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Control Control logic, protocol bridging and signal aggregation in factory automation systems, leveraging the industrial temperature rating and abundant I/Os.
- Embedded Systems Custom peripheral controllers, glue logic and feature integration in embedded appliances where on-chip RAM and moderate logic density reduce external components.
- Communications and Interfaces Interface adaptation and protocol handling for board-level communication links using the device’s flexible I/O and DDR support available in the family.
- Test and Measurement Custom signal processing front-ends and data capture controllers that benefit from the device’s logic capacity and on-chip memory.
Unique Advantages
- Balanced Logic and Memory Mix: ~15,400 logic elements combined with ~0.36 Mbits of embedded RAM provide a practical balance for many mid-range designs without excess cost.
- High I/O Count: 195 I/Os allow complex board-level connectivity and multiple peripheral interfaces without additional I/O expanders.
- Industrial Reliability: −40 °C to 100 °C operating range supports deployments in demanding temperature environments.
- Compact, Surface-Mount Package: 256-ball fpBGA (17 × 17 mm) enables dense PCB designs while maintaining a robust soldered footprint.
- Low-Voltage Core: 1.14 V to 1.26 V supply range aligns with contemporary 1.2 V power rails for efficient system power design.
- Standards-Ready Family Features: Family-level features such as PLLs, DDR interface support and a flexible sysI/O buffer (as documented for the LatticeECP/EC family) simplify system integration.
Why Choose LFEC15E-3FN256I?
The LFEC15E-3FN256I is a practical, industrial-grade FPGA option for designers seeking a mid-range programmable fabric with substantial I/O capability and on-chip memory. Its combination of ~15.4K logic elements, ~0.36 Mbits of embedded RAM, and 195 I/Os in a compact 256-ball fpBGA package makes it well suited for embedded, industrial control and interface adaptation roles.
Selected for teams that need a balanced mix of integration, temperature robustness and family-level system features, this device provides a clear upgrade path within the LatticeECP/EC family and supports efficient implementation using the family’s design ecosystem and documentation.
Request a quote or submit a pricing inquiry to evaluate LFEC15E-3FN256I for your next design.

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