LFEC15E-3FN256I

IC FPGA 195 I/O 256FBGA
Part Description

EC Field Programmable Gate Array (FPGA) IC 195 358400 15400 256-BGA

Quantity 1,981 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O195Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1920Number of Logic Elements/Cells15400
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits358400

Overview of LFEC15E-3FN256I – EC Field Programmable Gate Array (FPGA) IC 195 358400 15400 256-BGA

The LFEC15E-3FN256I is a Lattice EC family field programmable gate array providing a mid-range logic density and flexible I/O capability in a compact 256-ball fpBGA (17 × 17 mm) package. It integrates approximately 15,400 logic elements and embedded memory to support mainstream embedded and industrial applications that require configurable logic, on-chip RAM, and a high I/O count.

This device is positioned for designs that need a balance of integration, I/O capacity and industrial operating range, delivering on-chip resources and system-level features derived from the LatticeECP/EC family architecture.

Key Features

  • Logic Capacity  Approximately 15,400 logic elements for implementing moderately complex digital designs.
  • Embedded Memory  Approximately 358,400 bits (≈0.36 Mbits) of on-chip RAM for data buffering, state storage and small memory blocks.
  • I/O Density  195 user I/Os to support multiple parallel interfaces, external control signals and board-level interconnect.
  • Flexible I/O and Interface Support  Family-level I/O flexibility includes support for common signaling standards and dedicated DDR interface logic for memory subsystems (as provided in the LatticeECP/EC family specification).
  • Clocking and System Support  Device family includes analog PLL resources and system-level features such as boundary-scan and SPI boot interface (per LatticeECP/EC family data).
  • Power  Supported core voltage range of 1.14 V to 1.26 V, enabling standard 1.2 V power domains common in modern systems.
  • Package and Mounting  256-ball fpBGA (17 × 17 mm) package, surface-mount for compact board integration.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for industrial and temperature-challenging environments.
  • Regulatory  RoHS compliant.

Typical Applications

  • Industrial Control  Control logic, protocol bridging and signal aggregation in factory automation systems, leveraging the industrial temperature rating and abundant I/Os.
  • Embedded Systems  Custom peripheral controllers, glue logic and feature integration in embedded appliances where on-chip RAM and moderate logic density reduce external components.
  • Communications and Interfaces  Interface adaptation and protocol handling for board-level communication links using the device’s flexible I/O and DDR support available in the family.
  • Test and Measurement  Custom signal processing front-ends and data capture controllers that benefit from the device’s logic capacity and on-chip memory.

Unique Advantages

  • Balanced Logic and Memory Mix:  ~15,400 logic elements combined with ~0.36 Mbits of embedded RAM provide a practical balance for many mid-range designs without excess cost.
  • High I/O Count:  195 I/Os allow complex board-level connectivity and multiple peripheral interfaces without additional I/O expanders.
  • Industrial Reliability:  −40 °C to 100 °C operating range supports deployments in demanding temperature environments.
  • Compact, Surface-Mount Package:  256-ball fpBGA (17 × 17 mm) enables dense PCB designs while maintaining a robust soldered footprint.
  • Low-Voltage Core:  1.14 V to 1.26 V supply range aligns with contemporary 1.2 V power rails for efficient system power design.
  • Standards-Ready Family Features:  Family-level features such as PLLs, DDR interface support and a flexible sysI/O buffer (as documented for the LatticeECP/EC family) simplify system integration.

Why Choose LFEC15E-3FN256I?

The LFEC15E-3FN256I is a practical, industrial-grade FPGA option for designers seeking a mid-range programmable fabric with substantial I/O capability and on-chip memory. Its combination of ~15.4K logic elements, ~0.36 Mbits of embedded RAM, and 195 I/Os in a compact 256-ball fpBGA package makes it well suited for embedded, industrial control and interface adaptation roles.

Selected for teams that need a balanced mix of integration, temperature robustness and family-level system features, this device provides a clear upgrade path within the LatticeECP/EC family and supports efficient implementation using the family’s design ecosystem and documentation.

Request a quote or submit a pricing inquiry to evaluate LFEC15E-3FN256I for your next design.

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