LFEC15E-3FN256C
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 195 358400 15400 256-BGA |
|---|---|
| Quantity | 454 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 195 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 15400 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 358400 |
Overview of LFEC15E-3FN256C – EC FPGA, ~15.4K Logic Elements, 256‑BGA
The LFEC15E-3FN256C is a commercial-grade EC Field Programmable Gate Array (FPGA) from Lattice Semiconductor designed for mid-density embedded applications. Built on the LatticeECP/EC family architecture, it delivers a balanced combination of logic capacity, on-chip memory and a flexible I/O complement for a wide range of commercial embedded designs.
Key hardware attributes include approximately 15,400 logic elements, roughly 358 Kbits of embedded RAM, up to 195 user I/Os and a compact 256-ball fpBGA (17 × 17 mm) package. The device operates from a 1.14 V to 1.26 V core supply and is rated for 0 °C to 85 °C operation; it is RoHS compliant.
Key Features
- Logic Capacity Approximately 15,400 logic elements suitable for mid-range designs that require substantial combinational and sequential logic resources.
- Configurable Logic Fabric Part of the LatticeECP/EC family architecture, delivering mainstream FPGA fabric features such as LUT-based logic and placement/routing optimizations.
- Embedded and Distributed Memory Approximately 358 Kbits of on-chip RAM distributed between block and distributed memory resources for buffering, FIFOs and state storage.
- I/O Density and Flexibility Up to 195 I/Os in a 256-ball fpBGA package to support rich peripheral and subsystem interfacing options.
- Dedicated DDR Memory Support Family-level support for dedicated DDR memory interfaces to simplify system memory integration.
- Clocking and Timing Family includes multiple PLL resources for clock multiply/divide and phase shifting for system-level clock management.
- Package and Mounting 256-ball fpBGA (17 × 17 mm) surface-mount package suitable for compact board designs.
- Commercial Grade and Compliance Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.
Typical Applications
- Commercial Embedded Systems Control, protocol bridging and custom logic acceleration in mid-range embedded products where moderate logic density and on-chip RAM are required.
- Communications and Networking Interface glue logic, packet processing and protocol adaptation using the device's abundant I/O and embedded memory resources.
- Memory Interface Bridging Systems requiring DDR memory support can leverage the family-level DDR interface logic to integrate external memory subsystems.
- Prototyping and System Integration Platform-level designs and proof-of-concept implementations benefiting from configurable logic, PLLs and flexible I/O.
Unique Advantages
- Balanced Mid‑Range Capacity: Approximately 15,400 logic elements and ~358 Kbits of embedded memory provide a strong fit for designs that outgrow small FPGAs but do not require top-end densities.
- High I/O Count in a Compact Package: 195 I/Os in a 256-ball fpBGA (17 × 17 mm) enables dense connectivity without a large PCB footprint.
- Low-Voltage Core: Operates from 1.14 V to 1.26 V, aligning with modern low-voltage system architectures.
- System-Level Integration: On-chip memory, PLLs and family DDR interface support reduce external component count and simplify board-level integration.
- Commercial Reliability and Compliance: Commercial temperature rating and RoHS compliance support standard commercial product lifecycles and regulatory needs.
- Design Ecosystem: Part of the LatticeECP/EC family with available design tools and IP flows for efficient implementation and migration within the family.
Why Choose LFEC15E-3FN256C?
The LFEC15E-3FN256C sits in a practical performance tier for commercial embedded applications that require substantial logic resources, meaningful on-chip RAM and a high I/O count in a compact package. Its family-level features—memory resources, clocking, and DDR interface support—help streamline system design and reduce external component requirements.
This device is well suited to engineers and product teams targeting mid-density FPGA implementations where integration, I/O flexibility and established design tool support are priorities. Its combination of logic capacity, embedded RAM and packaging makes it a durable choice for scalable commercial designs within the LatticeECP/EC ecosystem.
Request a quote or submit a pricing and availability inquiry for the LFEC15E-3FN256C to start your design evaluation and procurement process.

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