LFEC15E-3FN256C

IC FPGA 195 I/O 256FBGA
Part Description

EC Field Programmable Gate Array (FPGA) IC 195 358400 15400 256-BGA

Quantity 454 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O195Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1920Number of Logic Elements/Cells15400
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits358400

Overview of LFEC15E-3FN256C – EC FPGA, ~15.4K Logic Elements, 256‑BGA

The LFEC15E-3FN256C is a commercial-grade EC Field Programmable Gate Array (FPGA) from Lattice Semiconductor designed for mid-density embedded applications. Built on the LatticeECP/EC family architecture, it delivers a balanced combination of logic capacity, on-chip memory and a flexible I/O complement for a wide range of commercial embedded designs.

Key hardware attributes include approximately 15,400 logic elements, roughly 358 Kbits of embedded RAM, up to 195 user I/Os and a compact 256-ball fpBGA (17 × 17 mm) package. The device operates from a 1.14 V to 1.26 V core supply and is rated for 0 °C to 85 °C operation; it is RoHS compliant.

Key Features

  • Logic Capacity  Approximately 15,400 logic elements suitable for mid-range designs that require substantial combinational and sequential logic resources.
  • Configurable Logic Fabric  Part of the LatticeECP/EC family architecture, delivering mainstream FPGA fabric features such as LUT-based logic and placement/routing optimizations.
  • Embedded and Distributed Memory  Approximately 358 Kbits of on-chip RAM distributed between block and distributed memory resources for buffering, FIFOs and state storage.
  • I/O Density and Flexibility  Up to 195 I/Os in a 256-ball fpBGA package to support rich peripheral and subsystem interfacing options.
  • Dedicated DDR Memory Support  Family-level support for dedicated DDR memory interfaces to simplify system memory integration.
  • Clocking and Timing  Family includes multiple PLL resources for clock multiply/divide and phase shifting for system-level clock management.
  • Package and Mounting  256-ball fpBGA (17 × 17 mm) surface-mount package suitable for compact board designs.
  • Commercial Grade and Compliance  Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.

Typical Applications

  • Commercial Embedded Systems  Control, protocol bridging and custom logic acceleration in mid-range embedded products where moderate logic density and on-chip RAM are required.
  • Communications and Networking  Interface glue logic, packet processing and protocol adaptation using the device's abundant I/O and embedded memory resources.
  • Memory Interface Bridging  Systems requiring DDR memory support can leverage the family-level DDR interface logic to integrate external memory subsystems.
  • Prototyping and System Integration  Platform-level designs and proof-of-concept implementations benefiting from configurable logic, PLLs and flexible I/O.

Unique Advantages

  • Balanced Mid‑Range Capacity:  Approximately 15,400 logic elements and ~358 Kbits of embedded memory provide a strong fit for designs that outgrow small FPGAs but do not require top-end densities.
  • High I/O Count in a Compact Package:  195 I/Os in a 256-ball fpBGA (17 × 17 mm) enables dense connectivity without a large PCB footprint.
  • Low-Voltage Core:  Operates from 1.14 V to 1.26 V, aligning with modern low-voltage system architectures.
  • System-Level Integration:  On-chip memory, PLLs and family DDR interface support reduce external component count and simplify board-level integration.
  • Commercial Reliability and Compliance:  Commercial temperature rating and RoHS compliance support standard commercial product lifecycles and regulatory needs.
  • Design Ecosystem:  Part of the LatticeECP/EC family with available design tools and IP flows for efficient implementation and migration within the family.

Why Choose LFEC15E-3FN256C?

The LFEC15E-3FN256C sits in a practical performance tier for commercial embedded applications that require substantial logic resources, meaningful on-chip RAM and a high I/O count in a compact package. Its family-level features—memory resources, clocking, and DDR interface support—help streamline system design and reduce external component requirements.

This device is well suited to engineers and product teams targeting mid-density FPGA implementations where integration, I/O flexibility and established design tool support are priorities. Its combination of logic capacity, embedded RAM and packaging makes it a durable choice for scalable commercial designs within the LatticeECP/EC ecosystem.

Request a quote or submit a pricing and availability inquiry for the LFEC15E-3FN256C to start your design evaluation and procurement process.

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