LFEC10E-5QN208C

IC FPGA 147 I/O 208QFP
Part Description

EC Field Programmable Gate Array (FPGA) IC 147 282624 10200 208-BFQFP

Quantity 1,614 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O147Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells10200
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFEC10E-5QN208C – EC Field Programmable Gate Array (FPGA) IC 147 282624 10200 208-BFQFP

The LFEC10E-5QN208C is a commercial-grade Field Programmable Gate Array (FPGA) in the LatticeECP/EC family, provided in a 208-BFQFP surface-mount package (supplier device package: 208-PQFP, 28×28). It delivers approximately 10,200 logic elements and roughly 282,624 bits of on‑chip RAM, making it suitable for mid-density, cost-sensitive FPGA designs.

Designed for mainstream embedded and interface applications, the device pairs a flexible digital fabric with a broad I/O complement (147 I/Os), support for dedicated DDR memory interfaces, and family-level tooling and IP support intended to streamline development and integration.

Key Features

  • Core Logic  Approximately 10,200 logic elements provide a mid-density FPGA fabric for control, glue logic, and moderate-complexity digital functions.
  • Embedded Memory  Approximately 282,624 total on-chip RAM bits for distributed and block memory needs in embedded designs.
  • I/O Flexibility  147 I/Os with family-level support for a wide range of signaling standards (including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and RSDS) to interface with modern peripherals and memory devices.
  • Clocking  Up to four analog PLLs per device (family specification) for clock multiply/divide and phase shifting in synchronous designs.
  • DDR Memory Support  Family-level dedicated DDR memory interface logic supports interfaces up to DDR400 (200 MHz), useful for systems requiring external DRAM.
  • Power  Core supply range of 1.14 V to 1.26 V, compatible with the family’s 1.2 V nominal VCC architecture.
  • Package & Mounting  208‑pin BFQFP package (surface mount) with supplier-referenced 208‑PQFP (28×28) package option.
  • Commercial Temperature Range  Rated for operation from 0 °C to 85 °C for commercial applications.
  • Compliance  RoHS compliant.
  • Development Ecosystem  Family documentation references ispLEVER tool support and pre-designed ispLeverCORE IP modules to aid design implementation and migration across family densities.

Typical Applications

  • Embedded Control & Logic  Mid-density FPGA fabric is well-suited for control logic, protocol handling, and system glue in commercial embedded products.
  • Memory Interface & Buffering  Dedicated DDR interface support and on-chip RAM enable memory controllers, buffering, and data path staging for systems using external DRAM.
  • Connectivity & Interface Bridging  Broad I/O support allows implementation of interface translators, bus bridges, and peripheral interface logic across multiple signaling standards.
  • Provider of System-Level Functions  Use in cost-sensitive applications that require a balance of logic density, on-chip memory, and versatile I/O in a compact PQFP package.

Unique Advantages

  • Balanced Mid-Density Integration: Approximately 10,200 logic elements combined with ~282,624 bits of embedded RAM reduces external component count for many designs.
  • Flexible I/O Standards: 147 I/Os with family-level support for common voltage and high-speed differential standards simplify system interfacing.
  • DDR Interface Capability: Family-level DDR400 (200 MHz) support enables direct integration with common external DRAM devices for memory‑intensive applications.
  • Compact Surface-Mount Packaging: 208-BFQFP / 208-PQFP (28×28) packaging provides a compact footprint for space-constrained commercial products.
  • Commercial Temperature Rating: Rated 0 °C to 85 °C to match commercial product deployment and testing regimes.
  • Development & IP Support: Documented support for ispLEVER tools and ispLeverCORE IP modules helps accelerate bring-up and reduce design risk.

Why Choose LFEC10E-5QN208C?

The LFEC10E-5QN208C offers a practical combination of logic capacity, embedded memory, and versatile I/O in a compact 208‑pin PQFP/BFQFP package for commercial embedded systems. Its specification set—approximately 10,200 logic elements, ~282,624 bits of RAM, 147 I/Os, DDR memory interface support, and a 1.14–1.26 V core supply range—addresses a broad set of mid-density FPGA use cases where cost, integration, and I/O flexibility matter.

This device is appropriate for designers and product teams building cost-sensitive, mainstream FPGA solutions who benefit from Lattice family-level tools and IP resources to speed development and scale across device densities within the LatticeECP/EC family.

Request a quote or submit a product inquiry today to evaluate LFEC10E-5QN208C for your next FPGA-based design.

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