LFEC10E-5QN208C
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 147 282624 10200 208-BFQFP |
|---|---|
| Quantity | 1,614 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1280 | Number of Logic Elements/Cells | 10200 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFEC10E-5QN208C – EC Field Programmable Gate Array (FPGA) IC 147 282624 10200 208-BFQFP
The LFEC10E-5QN208C is a commercial-grade Field Programmable Gate Array (FPGA) in the LatticeECP/EC family, provided in a 208-BFQFP surface-mount package (supplier device package: 208-PQFP, 28×28). It delivers approximately 10,200 logic elements and roughly 282,624 bits of on‑chip RAM, making it suitable for mid-density, cost-sensitive FPGA designs.
Designed for mainstream embedded and interface applications, the device pairs a flexible digital fabric with a broad I/O complement (147 I/Os), support for dedicated DDR memory interfaces, and family-level tooling and IP support intended to streamline development and integration.
Key Features
- Core Logic Approximately 10,200 logic elements provide a mid-density FPGA fabric for control, glue logic, and moderate-complexity digital functions.
- Embedded Memory Approximately 282,624 total on-chip RAM bits for distributed and block memory needs in embedded designs.
- I/O Flexibility 147 I/Os with family-level support for a wide range of signaling standards (including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and RSDS) to interface with modern peripherals and memory devices.
- Clocking Up to four analog PLLs per device (family specification) for clock multiply/divide and phase shifting in synchronous designs.
- DDR Memory Support Family-level dedicated DDR memory interface logic supports interfaces up to DDR400 (200 MHz), useful for systems requiring external DRAM.
- Power Core supply range of 1.14 V to 1.26 V, compatible with the family’s 1.2 V nominal VCC architecture.
- Package & Mounting 208‑pin BFQFP package (surface mount) with supplier-referenced 208‑PQFP (28×28) package option.
- Commercial Temperature Range Rated for operation from 0 °C to 85 °C for commercial applications.
- Compliance RoHS compliant.
- Development Ecosystem Family documentation references ispLEVER tool support and pre-designed ispLeverCORE IP modules to aid design implementation and migration across family densities.
Typical Applications
- Embedded Control & Logic Mid-density FPGA fabric is well-suited for control logic, protocol handling, and system glue in commercial embedded products.
- Memory Interface & Buffering Dedicated DDR interface support and on-chip RAM enable memory controllers, buffering, and data path staging for systems using external DRAM.
- Connectivity & Interface Bridging Broad I/O support allows implementation of interface translators, bus bridges, and peripheral interface logic across multiple signaling standards.
- Provider of System-Level Functions Use in cost-sensitive applications that require a balance of logic density, on-chip memory, and versatile I/O in a compact PQFP package.
Unique Advantages
- Balanced Mid-Density Integration: Approximately 10,200 logic elements combined with ~282,624 bits of embedded RAM reduces external component count for many designs.
- Flexible I/O Standards: 147 I/Os with family-level support for common voltage and high-speed differential standards simplify system interfacing.
- DDR Interface Capability: Family-level DDR400 (200 MHz) support enables direct integration with common external DRAM devices for memory‑intensive applications.
- Compact Surface-Mount Packaging: 208-BFQFP / 208-PQFP (28×28) packaging provides a compact footprint for space-constrained commercial products.
- Commercial Temperature Rating: Rated 0 °C to 85 °C to match commercial product deployment and testing regimes.
- Development & IP Support: Documented support for ispLEVER tools and ispLeverCORE IP modules helps accelerate bring-up and reduce design risk.
Why Choose LFEC10E-5QN208C?
The LFEC10E-5QN208C offers a practical combination of logic capacity, embedded memory, and versatile I/O in a compact 208‑pin PQFP/BFQFP package for commercial embedded systems. Its specification set—approximately 10,200 logic elements, ~282,624 bits of RAM, 147 I/Os, DDR memory interface support, and a 1.14–1.26 V core supply range—addresses a broad set of mid-density FPGA use cases where cost, integration, and I/O flexibility matter.
This device is appropriate for designers and product teams building cost-sensitive, mainstream FPGA solutions who benefit from Lattice family-level tools and IP resources to speed development and scale across device densities within the LatticeECP/EC family.
Request a quote or submit a product inquiry today to evaluate LFEC10E-5QN208C for your next FPGA-based design.