LFEC10E-5FN256C

IC FPGA 195 I/O 256FBGA
Part Description

EC Field Programmable Gate Array (FPGA) IC 195 282624 10200 256-BGA

Quantity 1,112 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O195Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells10200
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFEC10E-5FN256C – EC Field Programmable Gate Array (FPGA) IC 195 I/O, ~0.28 Mbits RAM, 10,200 Logic Elements, 256-BGA

The LFEC10E-5FN256C is a commercial-grade EC family FPGA offering 10,200 logic elements and approximately 0.28 Mbits of on‑chip RAM. As a member of the LatticeECP/EC family, this device provides a mainstream FPGA fabric optimized for low-cost, high‑integration applications that require flexible I/O and embedded memory.

With 195 I/O pins in a 256-ball fpBGA package and a low-voltage supply range, the device targets applications that need substantial logic density and I/O connectivity in a compact surface-mount package while operating over a commercial temperature range.

Key Features

  • Logic Capacity — 10,200 logic elements suitable for mid-density FPGA designs and logic consolidation.
  • On‑chip Memory — Total on-chip RAM of 282,624 bits (approximately 0.28 Mbits) to support buffering, state machines and local data storage.
  • I/O Density — 195 I/O pins available for flexible interfacing to peripherals, buses and external memory.
  • Power — Low-voltage operation with a supply range of 1.14 V to 1.26 V to match modern low-voltage systems.
  • Package and Mounting — 256-ball fpBGA (17 × 17 mm) surface-mount package (256-FPBGA) for compact board integration.
  • Operating Temperature — Commercial operating range of 0 °C to 85 °C for typical commercial electronics environments.
  • RoHS Compliance — RoHS‑compliant manufacturing.
  • Family Architecture — Part of the LatticeECP/EC family, which provides a cost-optimized FPGA fabric with support for distributed and embedded memory, clock PLLs and mainstream I/O standards.

Typical Applications

  • Communications and Interface Bridge — Use available I/O and on‑chip memory to implement protocol bridging, data buffering and interface conversion in compact systems.
  • Embedded Control — Consolidate control logic and peripheral interfaces for consumer and industrial equipment using the device’s logic capacity and I/O count.
  • Video and Signal Processing Glue Logic — Support pre- and post-processing stages or control logic where moderate on-chip RAM and programmable logic are required.
  • Prototype and Development Platforms — Mid-density FPGA resources and a compact BGA package make this device suitable for proof-of-concept and time-to-market designs.

Unique Advantages

  • Balanced Logic and Memory: 10,200 logic elements combined with ~0.28 Mbits of on‑chip RAM provides a practical balance for mid-range designs without excessive BOM cost.
  • High I/O Count in a Compact Package: 195 I/Os in a 17 × 17 mm 256-FPBGA enable dense external connectivity while saving PCB area.
  • Low-Voltage Operation: 1.14 V to 1.26 V supply range supports integration with modern low-voltage power rails.
  • Commercial Temperature Range: Rated 0 °C to 85 °C for reliable operation in standard commercial electronics applications.
  • RoHS Compliant: Environmentally compliant manufacturing supports regulatory requirements for many global markets.
  • Family Ecosystem: Belongs to the LatticeECP/EC family, enabling design reuse and access to family-level resources and tool support.

Why Choose LFEC10E-5FN256C?

The LFEC10E-5FN256C is positioned for engineers who need a commercially rated, mid-density FPGA with a strong balance of logic, memory and I/O in a compact fpBGA package. Its on‑chip RAM and sizeable I/O complement make it well suited for control, interface and moderate buffering tasks in cost-sensitive designs.

Choosing this device provides a scalable path within the LatticeECP/EC family and enables efficient implementation of designs that require moderate logic capacity, flexible connectivity and low-voltage operation backed by a family-level toolchain and resources.

Request a quote or submit a purchase inquiry to get pricing and availability for the LFEC10E-5FN256C.

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