LFEC10E-4Q208I
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 147 282624 10200 208-BFQFP |
|---|---|
| Quantity | 1,467 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1280 | Number of Logic Elements/Cells | 10200 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFEC10E-4Q208I – EC Field Programmable Gate Array (FPGA) IC, 208-BFQFP
The LFEC10E-4Q208I is a field programmable gate array (FPGA) IC designed for industrial embedded applications. It combines a mid-density logic fabric with on-chip memory and a high count of general-purpose I/O to support control, interface and connectivity functions in temperature-challenging environments.
With 10,200 logic elements, approximately 0.28 Mbits of embedded memory and 147 I/Os in a 208-BFQFP surface-mount package, this device targets designs that require compact integration, flexible I/O routing and low-voltage core operation.
Key Features
- Core Logic 10,200 logic elements provide a mid-density programmable fabric for implementing custom logic, glue-logic and peripheral functions.
- Embedded Memory Approximately 0.28 Mbits (282,624 bits) of on-chip RAM to support buffering, FIFOs and small lookup tables without external memory.
- I/O Capacity 147 general-purpose I/Os enable broad peripheral interfacing and signal routing within a single package.
- Low-Voltage Supply Operates from 1.14 V to 1.26 V core supply, suitable for modern low-voltage system architectures.
- Package & Mounting 208-BFQFP (supplier package: 208-PQFP, 28×28) in a surface-mount form factor for compact PCB layouts.
- Industrial Temperature Range Rated for −40 °C to 100 °C operation for deployment in industrial environments.
- Compliance RoHS compliant, supporting lead-free manufacturing requirements.
Typical Applications
- Industrial Control Implement custom control logic, I/O aggregation and sensor interfacing in automation equipment where industrial temperature range is required.
- Embedded Interfaces Act as an on-board glue and protocol adapter to bridge peripherals and processors using its large I/O complement.
- Signal Processing & Timing Provide real-time logic and buffering with on-chip RAM for small-scale signal processing, filtering or timing functions.
- Industrial Instrumentation Integrate custom measurement logic and control paths into compact surface-mount assemblies for instrumentation hardware.
Unique Advantages
- Mid-density programmable fabric: 10,200 logic elements deliver a balance of capability and compactness for a wide range of embedded tasks without overprovisioning.
- Integrated memory resources: Approximately 0.28 Mbits of embedded RAM reduces dependence on external memory for buffering and small data structures.
- High I/O count in a compact package: 147 I/Os in a 208-BFQFP package simplify board-level integration and reduce the need for external I/O expanders.
- Designed for low-voltage systems: Core supply range of 1.14 V to 1.26 V aligns with modern low-voltage power domains.
- Industrial temperature support: Rated from −40 °C to 100 °C for reliable operation in demanding environments.
- RoHS compliant: Enables compliance with lead-free manufacturing requirements.
Why Choose LFEC10E-4Q208I?
The LFEC10E-4Q208I positions itself as a practical mid-density FPGA solution for engineers who need a compact, low-voltage programmable device with substantial I/O and on-chip memory for industrial embedded designs. Its combination of 10,200 logic elements, approximately 0.28 Mbits of RAM and 147 I/Os in a 208-BFQFP package supports integration of control, interface and buffering functions while meeting industrial temperature requirements.
This device suits development teams and products that demand a scalable programmable component with straightforward board-level integration, RoHS compliance and support for industrial operating ranges, helping reduce component count and simplify system architecture.
Request a quote or submit an inquiry to receive pricing and availability information for LFEC10E-4Q208I and to discuss how it fits your design requirements.

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