LFEC10E-4FN484I

The LFEC10E-4FN484I is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation's LatticeECP/EC family. It provides a mid-range logic fabric with 10,200 logic elements and flexible on‑chip memory, packaged in a 484‑ball BGA for compact, high‑pin‑count designs.

Designed for industrial applications, this device targets use cases that require high I/O density, moderate embedded memory, and reliable operation across a wide temperature range. The part benefits from the LatticeECP/EC family architecture and tool support for efficient implementation of mainstream FPGA functions.

Key Features

• Core Logic  10,200 logic elements provide a balanced fabric for integration of control, glue logic, and custom processing blocks.
• On‑chip Memory  Approximately 0.283 Mbits (282,624 bits) of total embedded RAM for distributed and block memory usage.
• I/O and Connectivity  288 user I/Os deliver high pin count for interfacing multiple peripherals, buses, and sensors.
• Power  Core supply range from 1.14 V to 1.26 V, enabling compatibility with low‑voltage system rails.
• Package & Mounting  484‑BBGA (484‑FPBGA, 23×23 mm) surface‑mount package provides a high-density board footprint with robust ball grid connectivity.
• Thermal and Environmental  Rated for industrial operation from −40 °C to 100 °C and RoHS compliant for regulatory conformance.
• Family Architecture  Based on the LatticeECP/EC family architecture that includes LUT-based logic, embedded and distributed memory, PLLs and support for mainstream I/Os as described in the family data.

Typical Applications

• Industrial Control and Automation  High I/O count and industrial temperature rating suit control logic, sensor aggregation, and protocol bridging in factory and process environments.
• Communications Interfaces  Use the device to implement bus bridging, custom PHY interfaces, and multi‑lane I/O functions that require numerous I/O signals and on‑chip memory.
• Embedded System Glue Logic  Integrate peripheral controllers, format conversion, and system orchestration logic where a compact, high‑pin‑count FPGA is needed.
• Prototyping and Low‑Cost Production  The mid‑density logic and embedded memory make it suitable for prototyping systems destined for cost‑sensitive production runs.

Unique Advantages

• High‑density logic in a compact package: 10,200 logic elements in a 484‑ball BGA enable substantial integration without a large PCB footprint.
• Substantial on‑chip RAM: Approximately 0.283 Mbits of embedded memory supports buffering, FIFOs, and local data storage to reduce external memory requirements.
• Extensive I/O capacity: 288 I/Os allow direct connection to numerous peripherals and interfaces, simplifying board design and reducing external multiplexing.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsher environments common to industrial equipment.
• Low‑voltage core operation: 1.14 V to 1.26 V core supply aligns with modern low‑voltage system architectures.
• RoHS compliant: Manufactured to meet RoHS requirements for environmental and regulatory needs.

Why Choose LFEC10E-4FN484I?

The LFEC10E-4FN484I combines a mid‑range logic fabric with ample I/O and embedded memory in a dense 484‑BBGA package, making it well suited for industrial and embedded applications that require reliable operation across a wide temperature range. Its specifications provide a practical balance of integration, I/O density, and memory for designers consolidating logic and interface functions.

As part of the LatticeECP/EC family, the device aligns with the family architecture and tool ecosystem described in the datasheet, helping teams leverage available design flows and IP to accelerate development and scale designs as requirements evolve.

Request a quote or submit an inquiry for LFEC10E-4FN484I to receive pricing, availability, and lead‑time information tailored to your project needs.