LFEC10E-4QN208I
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 147 282624 10200 208-BFQFP |
|---|---|
| Quantity | 247 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1280 | Number of Logic Elements/Cells | 10200 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFEC10E-4QN208I – EC Field Programmable Gate Array (FPGA) IC, 147 I/O, 208-BFQFP
The LFEC10E-4QN208I is a LatticeECP/EC family FPGA delivering mainstream FPGA functionality in a compact 208-pin PQFP footprint. It combines a programmable logic fabric with embedded memory and flexible I/O to address cost-sensitive, performance-oriented embedded designs.
Targeted at industrial and general-purpose applications, the device is optimized for designs that require approximately 10,200 logic elements, substantial on-chip RAM, and a wide range of I/O standards while operating over an industrial temperature range.
Key Features
- Logic Capacity Approximately 10,200 logic elements (≈10.2K LUTs), providing fabric for mid-range FPGA designs.
- Embedded Memory Approximately 0.28 Mbits of embedded memory (276 Kbits EBR / 282,624 total RAM bits) for on-chip data buffering and state storage.
- DSP and Multiply Resources Part of the LatticeECP/EC family architecture that includes dedicated sysDSP resources for high-performance multiply and accumulate functions.
- I/O Density and Flexibility 147 user I/Os with a programmable sysI/O buffer supporting LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS interface standards.
- Clocking Up to four PLLs for clock multiply/divide and phase control to support complex clocking domains.
- DDR Memory Support On-family support for dedicated DDR interfaces up to DDR400 (200 MHz) for external memory systems.
- Power and Supply Nominal core voltage range of 1.14 V to 1.26 V.
- Package and Mounting 208-BFQFP package (supplier package: 208-PQFP, 28 × 28 mm) designed for surface-mount assembly.
- Operating Range Industrial-grade operation from −40 °C to 100 °C.
- Design Ecosystem Supported by the ispLEVER design tool suite and available ispLeverCORE IP blocks to accelerate development and integration.
Typical Applications
- Industrial Control Programmable logic and robust operating range enable motor control, factory automation interfaces, and machine I/O aggregation.
- Communications and Networking Flexible I/O standards and DDR memory interface support make the device suitable for protocol bridging, packet processing, and interface expansion.
- Signal Processing / DSP On-chip DSP resources and abundant logic elements support embedded filtering, transforms, and real-time data processing tasks.
- Embedded System Glue Logic Use as a configurable interface and control hub for peripherals, sensors, and system management functions.
Unique Advantages
- Balanced Logic and Memory ~10,200 logic elements combined with ~0.28 Mbits of embedded memory provides a practical balance for mid-size designs without external SRAM for many use cases.
- Flexible I/O Support Wide programmable I/O standards reduce the need for level translators and simplify board-level interfacing across multiple voltage domains.
- Clocking and Timing Control Multiple PLLs enable reliable clock domain creation and phase control for multi-clock systems.
- Industrial Temperature Rating Operation from −40 °C to 100 °C meets the thermal requirements of many industrial applications.
- Compact Surface-Mount Package 208-pin PQFP footprint provides high I/O count in a compact form factor for space-constrained designs.
- Tool and IP Support Compatibility with the ispLEVER tool suite and pre-designed IP blocks accelerates development and reduces time to market.
Why Choose LFEC10E-4QN208I?
The LFEC10E-4QN208I offers a practical mid-range FPGA option that combines roughly 10,200 logic elements, substantial on-chip RAM, flexible high-density I/O, and multiple PLLs in a surface-mount 208-pin PQFP package. Its industrial temperature rating and supply range make it suitable for demanding embedded and industrial systems.
This device is well suited to engineers who need a scalable, cost-conscious FPGA for control, communications, and signal-processing tasks, and who benefit from an established design ecosystem and pre-built IP to accelerate system integration.
If you would like pricing or availability, request a quote or submit a request for pricing and technical support for the LFEC10E-4QN208I.

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