LFEC10E-4FN256I

The LFEC10E-4FN256I is a Lattice EC family FPGA in a 256-ball fpBGA package engineered for mainstream, cost-sensitive embedded designs. It delivers approximately 10,200 logic elements, roughly 0.283 Mbits of on-chip embedded memory, and a 195-pin I/O count in a compact 17 × 17 mm package.

Targeted at industrial applications, this surface-mount FPGA operates from a low-voltage supply (1.14 V to 1.26 V) and supports an extended operating temperature range of −40 °C to 100 °C, making it suitable for deployed systems that require robust temperature tolerance and flexible I/O integration.

Key Features

• Logic Capacity  Approximately 10,200 logic elements for implementing control, glue logic, and moderate-density programmable functions.
• Embedded Memory  Approximately 0.283 Mbits of on-chip RAM to store configuration data, buffers, and small data structures without external SRAM.
• I/O Density  195 user I/Os delivered on a 256-ball fpBGA (17 × 17 mm) package for high pin-count designs in a compact footprint.
• Package & Mounting  256-FPBGA (17 × 17) supplier device package; surface-mount assembly suitable for modern PCB manufacturing.
• Power  Operates from a narrow core supply range of 1.14 V to 1.26 V to match low-voltage system designs.
• Temperature Grade  Industrial operating range from −40 °C to 100 °C for reliable operation across demanding environments.
• Family Capabilities (from LatticeECP/EC)  Family-level features include flexible I/O buffer options, dedicated DDR memory interface logic, up to four PLLs, and support for density migration within the product family.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Implement control logic, protocol bridging, and I/O aggregation where industrial temperature range and robust I/O counts are required.
• Embedded Systems  Provide glue logic, interface adaptation and on-board processing in cost-sensitive embedded products.
• Memory Interface Designs  Use the family’s dedicated DDR interface support for systems requiring on-board DRAM connectivity and managed memory access.
• Communication and Networking  Support moderate-density packet processing, custom protocol handling, and multi‑I/O interfacing in compact form factors.

Unique Advantages

• Balanced Capacity and Cost: ~10,200 logic elements and modest embedded memory provide a capable programmable fabric for mainstream designs without excessive overhead.
• High I/O Count in Small Footprint: 195 I/Os in a 17 × 17 mm 256-FPBGA pack dense connectivity into compact boards.
• Industrial Temperature Support: −40 °C to 100 °C operating range allows deployment in demanding environments.
• Low-Voltage Core: 1.14 V–1.26 V supply range aligns with modern low-power system rails.
• Family Ecosystem: Leveraging LatticeECP/EC family capabilities enables design migration and access to family-level features and development tools.
• RoHS Compliant: Meets common environmental compliance expectations for commercial and industrial products.

Why Choose LFEC10E-4FN256I?

The LFEC10E-4FN256I positions itself as a practical, industrial-grade FPGA option for designers who need a balance of logic density, onboard memory, and a high I/O count in a compact surface-mount package. Its low-voltage operation and extended temperature range make it suitable for embedded and industrial deployments where space, thermal tolerance, and reliable I/O matter.

Customers designing cost-sensitive, mainstream systems benefit from the LatticeECP/EC family ecosystem and density-migration options, enabling design scalability and reuse while keeping BOM and board area under control.

Request a quote or submit a pricing inquiry to receive availability and ordering information for the LFEC10E-4FN256I.