LFEC10E-3QN208I
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 147 282624 10200 208-BFQFP |
|---|---|
| Quantity | 1,140 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 147 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1280 | Number of Logic Elements/Cells | 10200 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFEC10E-3QN208I – EC Field Programmable Gate Array (FPGA) – 10,200 logic elements, 282,624-bit RAM, 147 I/Os, 208-BFQFP
The LFEC10E-3QN208I is an industrial-grade EC family FPGA from Lattice Semiconductor Corporation, offering 10,200 logic elements in a 208-pin BFQFP surface-mount package. Built on the LatticeECP/EC family architecture, it combines LUT-based logic, embedded and distributed memory, and programmable I/O to address mainstream FPGA applications where cost, integration and flexibility matter.
This device targets cost-sensitive embedded and industrial designs that need a compact, highly integrated programmable logic solution with on-chip RAM, a sizable I/O count, and a wide operating temperature range.
Key Features
- Logic Capacity — 10,200 logic elements suitable for medium-density designs and functional integration.
- Logic Blocks — 1,280 logic blocks (PFUs/PFFs) providing structured routing and placement resources for synthesis and implementation.
- On-Chip Memory — 282,624 total RAM bits (approximately 0.283 Mbits) of embedded memory for data buffering, state storage, and small lookup tables.
- I/O Density — 147 user I/Os to support multiple interfaces and external peripherals within a single device.
- Voltage Supply — Core operating range of 1.14 V to 1.26 V, supporting the family’s 1.2 V power architecture.
- Clocking — Family supports up to four analog PLLs for clock multiply/divide and phase control (LatticeECP/EC family capability).
- Flexible I/O Standards — Family-level sysI/O buffer support for a broad range of interfaces including common LVCMOS and differential standards (as provided by the LatticeECP/EC family specification).
- Package & Mounting — 208-BFQFP (208-PQFP 28×28 supplier package) in a surface-mount format to fit compact board layouts.
- Industrial Temperature Range — Rated for −40 °C to 100 °C operation, suitable for industrial environments.
- RoHS Compliant — Meets RoHS requirements for regulated materials.
Typical Applications
- Industrial Control — Realize custom control logic, I/O aggregation and protocol bridging for automation and machine control within the device’s industrial temperature range.
- Embedded Systems — Implement system glue logic, peripheral interfaces and on-chip buffering using the device’s logic elements and embedded RAM.
- Communications & Interfaces — Support medium-density I/O and clocking requirements for protocol adaptation, transceiver control or interface translation.
- Consumer & Commercial Electronics — Integrate custom user logic, local control and interface consolidation in cost-sensitive product designs.
Unique Advantages
- Balanced Logic and Memory: 10,200 logic elements combined with 282,624 bits of on-chip RAM enable a range of mid-size designs without external SRAM for many control and data buffering tasks.
- Generous I/O Count: 147 I/Os provide flexibility to connect multiple peripherals and interfaces directly to the FPGA, reducing external glue logic.
- Industrial Robustness: Rated for −40 °C to 100 °C operation and supplied in a surface-mount 208-pin BFQFP package for reliable deployment in industrial applications.
- Family-Level Clocking and I/O Flexibility: Benefits from the LatticeECP/EC family architecture, including multiple PLLs and programmable I/O options to support diverse interface standards.
- Compact, Low-BOM Integration: The combination of logic, embedded memory and I/O density helps reduce PCB area and external component count for streamlined designs.
Why Choose LFEC10E-3QN208I?
The LFEC10E-3QN208I positions itself as a practical, industrial-grade programmable logic device that balances logic capacity, embedded memory and I/O density in a compact 208-pin BFQFP package. It is suited to engineers who require a mid-density FPGA with family-level features—LUT-based logic, embedded/distributed memory and PLLs—delivered in a form factor that supports robust industrial operation.
For projects that need scalability within the LatticeECP/EC family, predictable supply-voltage requirements and a moderate on-chip memory footprint, the LFEC10E-3QN208I delivers a clear, verifiable specification set to simplify design planning and BOM decisions.
Request a quote or submit an inquiry to obtain pricing, availability and technical support for LFEC10E-3QN208I. Our team can provide lead-time information and help evaluate the device for your design requirements.