LFEC10E-3QN208I

IC FPGA 147 I/O 208QFP
Part Description

EC Field Programmable Gate Array (FPGA) IC 147 282624 10200 208-BFQFP

Quantity 1,140 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O147Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells10200
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFEC10E-3QN208I – EC Field Programmable Gate Array (FPGA) – 10,200 logic elements, 282,624-bit RAM, 147 I/Os, 208-BFQFP

The LFEC10E-3QN208I is an industrial-grade EC family FPGA from Lattice Semiconductor Corporation, offering 10,200 logic elements in a 208-pin BFQFP surface-mount package. Built on the LatticeECP/EC family architecture, it combines LUT-based logic, embedded and distributed memory, and programmable I/O to address mainstream FPGA applications where cost, integration and flexibility matter.

This device targets cost-sensitive embedded and industrial designs that need a compact, highly integrated programmable logic solution with on-chip RAM, a sizable I/O count, and a wide operating temperature range.

Key Features

  • Logic Capacity — 10,200 logic elements suitable for medium-density designs and functional integration.
  • Logic Blocks — 1,280 logic blocks (PFUs/PFFs) providing structured routing and placement resources for synthesis and implementation.
  • On-Chip Memory — 282,624 total RAM bits (approximately 0.283 Mbits) of embedded memory for data buffering, state storage, and small lookup tables.
  • I/O Density — 147 user I/Os to support multiple interfaces and external peripherals within a single device.
  • Voltage Supply — Core operating range of 1.14 V to 1.26 V, supporting the family’s 1.2 V power architecture.
  • Clocking — Family supports up to four analog PLLs for clock multiply/divide and phase control (LatticeECP/EC family capability).
  • Flexible I/O Standards — Family-level sysI/O buffer support for a broad range of interfaces including common LVCMOS and differential standards (as provided by the LatticeECP/EC family specification).
  • Package & Mounting — 208-BFQFP (208-PQFP 28×28 supplier package) in a surface-mount format to fit compact board layouts.
  • Industrial Temperature Range — Rated for −40 °C to 100 °C operation, suitable for industrial environments.
  • RoHS Compliant — Meets RoHS requirements for regulated materials.

Typical Applications

  • Industrial Control — Realize custom control logic, I/O aggregation and protocol bridging for automation and machine control within the device’s industrial temperature range.
  • Embedded Systems — Implement system glue logic, peripheral interfaces and on-chip buffering using the device’s logic elements and embedded RAM.
  • Communications & Interfaces — Support medium-density I/O and clocking requirements for protocol adaptation, transceiver control or interface translation.
  • Consumer & Commercial Electronics — Integrate custom user logic, local control and interface consolidation in cost-sensitive product designs.

Unique Advantages

  • Balanced Logic and Memory: 10,200 logic elements combined with 282,624 bits of on-chip RAM enable a range of mid-size designs without external SRAM for many control and data buffering tasks.
  • Generous I/O Count: 147 I/Os provide flexibility to connect multiple peripherals and interfaces directly to the FPGA, reducing external glue logic.
  • Industrial Robustness: Rated for −40 °C to 100 °C operation and supplied in a surface-mount 208-pin BFQFP package for reliable deployment in industrial applications.
  • Family-Level Clocking and I/O Flexibility: Benefits from the LatticeECP/EC family architecture, including multiple PLLs and programmable I/O options to support diverse interface standards.
  • Compact, Low-BOM Integration: The combination of logic, embedded memory and I/O density helps reduce PCB area and external component count for streamlined designs.

Why Choose LFEC10E-3QN208I?

The LFEC10E-3QN208I positions itself as a practical, industrial-grade programmable logic device that balances logic capacity, embedded memory and I/O density in a compact 208-pin BFQFP package. It is suited to engineers who require a mid-density FPGA with family-level features—LUT-based logic, embedded/distributed memory and PLLs—delivered in a form factor that supports robust industrial operation.

For projects that need scalability within the LatticeECP/EC family, predictable supply-voltage requirements and a moderate on-chip memory footprint, the LFEC10E-3QN208I delivers a clear, verifiable specification set to simplify design planning and BOM decisions.

Request a quote or submit an inquiry to obtain pricing, availability and technical support for LFEC10E-3QN208I. Our team can provide lead-time information and help evaluate the device for your design requirements.

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