LFEC10E-3FN484I

The LFEC10E-3FN484I is an industrial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor’s LatticeECP/EC family. It delivers a general-purpose FPGA fabric with high logic density and substantial on-chip memory, targeted at embedded and industrial applications that require flexible I/O and low-voltage operation.

With 10,200 logic elements and approximately 0.283 Mbits of on-chip RAM, this device is suited for designs that need significant programmable logic, broad I/O count, and operation across a wide industrial temperature range.

Key Features

• Core Logic: 10,200 logic elements provide a high-density programmable fabric for implementing complex control, glue logic, and data processing functions.
• Memory: Total on-chip memory of approximately 0.283 Mbits (282,624 bits) to support embedded buffers, state machines, and small data stores.
• I/O Capacity: 288 I/Os to support extensive peripheral connectivity and parallel interfaces in a compact package.
• Package & Mounting: 484-ball BBGA package (484-FPBGA, 23 × 23 mm) with surface-mount assembly for space-efficient system integration.
• Power: Low-voltage core supply range of 1.14 V to 1.26 V suitable for low-power system designs.
• Temperature Range & Grade: Industrial grade with operating temperature from −40 °C to 100 °C for reliable operation in demanding environments.
• PLLs and Clocking: Family-level support includes multiple analog PLLs for clock management and phase control; LFEC10-class devices provide up to four PLLs.
• System-Level Support: Family features include boundary-scan (IEEE 1149.1), SPI boot flash interface, and vendor design tools and IP to streamline implementation.
• Compliance: RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Industrial Control: Implement control logic, timing, and interface functions in factory automation and process control systems using industrial temperature capability and high I/O count.
• Embedded Systems: Provide glue logic, protocol bridging, and custom peripheral interfaces for embedded platforms that require moderate logic density and on-chip memory.
• Communications & Networking: Support packet buffering, interface aggregation, and protocol handling where many I/Os and programmable logic accelerate system integration.
• Prototyping & System Integration: Use as a platform for validating system-level functions and integrating multiple digital interfaces in a single device.

Unique Advantages

• High Logic Density: 10,200 logic elements enable compact implementation of complex functions without multiple devices.
• Substantial On-Chip Memory: Approximately 0.283 Mbits of RAM reduces external memory dependence for many control and buffering tasks.
• Large I/O Count: 288 I/Os simplify board-level routing and reduce the need for external I/O expanders.
• Industrial Robustness: −40 °C to 100 °C operating range supports deployment in challenging environments.
• Compact, Surface-Mount Package: 484-ball BBGA (23 × 23 mm) balances pin count and board footprint for dense system designs.
• Design Ecosystem: Part of the LatticeECP/EC family with vendor tools and IP resources to accelerate development and reduce time-to-market.

Why Choose LFEC10E-3FN484I?

The LFEC10E-3FN484I is positioned as a high-density, industrial-grade general-purpose FPGA that combines substantial programmable logic, on-chip memory, and a large I/O complement in a compact BBGA package. Its low-voltage core and wide operating temperature range make it suitable for embedded and industrial applications where space, power, and environmental robustness matter.

Designers who need a scalable FPGA platform with vendor-supported design tools and IP can leverage this device to consolidate functions, reduce bill-of-materials, and simplify board-level integration while maintaining industry-standard compliance and manufacturability.

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