LFEC10E-3F484I
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 288 282624 10200 484-BBGA |
|---|---|
| Quantity | 938 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 288 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1280 | Number of Logic Elements/Cells | 10200 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFEC10E-3F484I – EC Field Programmable Gate Array (FPGA) IC, 10,200 logic elements · 288 I/Os · 484‑ball BGA
The LFEC10E-3F484I is an EC family Field Programmable Gate Array (FPGA) optimized for mainstream embedded designs. It combines a mid-range logic capacity with substantial on-chip memory and flexible I/O to address applications requiring moderate logic density and high pin count.
Built on the LatticeECP/EC family architecture, this device is suited for industrial applications and designs that benefit from integrated memory, multiple PLLs, and a compact 484-ball BGA package while operating across an extended temperature range.
Key Features
- Logic Capacity — 10,200 logic elements (cells) provide mid-range programmable logic density for control, glue-logic, and data-path implementations.
- On‑chip Memory — Total on-chip RAM of 282,624 bits (approximately 0.28 Mbits) to support embedded data buffering, FIFOs and state storage.
- I/O Density — 288 I/O pins to support high-pin-count interfaces, board-level bridging and multi‑channel connectivity.
- Power Supply — Core voltage supply range 1.14 V to 1.26 V to match system power rails and enable stable core operation.
- Clocking — Family-level support includes up to four analog PLLs per device for clock management, multiplication, division and phase shifting.
- Memory Interface Support — Family documentation includes dedicated DDR memory interface capability (up to DDR400), enabling direct connection to common DDR SDRAM devices.
- Flexible I/O Standards — Family-level programmable I/O buffers support a wide range of interfaces including LVCMOS, LVTTL, SSTL, HSTL, PCI and LVDS signaling options.
- Package & Mounting — 484-ball FPBGA (23 × 23 mm) in a surface-mount package for compact board integration.
- Industrial Grade Operation — Rated operating temperature from −40 °C to 100 °C for deployment in industrial environments.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Industrial Control — Deterministic logic, substantial I/O and industrial temperature range suit motor control, factory automation interfaces and machine-control subsystems.
- Memory Interface & Buffering — On‑chip RAM and family DDR support enable memory controller, bridge and buffering functions for systems using external DRAM.
- Communications & Networking — High I/O count and programmable I/O standards allow protocol bridging, packet preprocessing and multi-channel I/O aggregation.
- Embedded Systems — Mid-range logic density and embedded memory are appropriate for custom SoC glue logic, peripheral aggregation and control-plane processing.
Unique Advantages
- Balanced Logic and Memory — 10,200 logic elements paired with approximately 0.28 Mbits of on‑chip RAM delivers a practical balance for mid-complexity designs without external FPGA fabric.
- High I/O Count — 288 I/Os simplify board-level interconnection and reduce the need for external multiplexing or additional I/O expanders.
- Industrial Temperature Range — −40 °C to 100 °C rating supports robust operation in demanding environments.
- Compact, High‑Density Package — 484-ball FPBGA (23 × 23 mm) minimizes PCB footprint while providing extensive I/O and routing options.
- Power‑Efficient Core Voltage — Narrow core supply window (1.14 V–1.26 V) that aligns with modern low-voltage power architectures.
- Family Ecosystem — Part of the LatticeECP/EC family, which includes design tools and pre‑designed IP to accelerate development and time-to-prototype.
Why Choose LFEC10E-3F484I?
The LFEC10E-3F484I positions itself for engineers needing a mid-density FPGA with substantial I/O, embedded memory and industrial temperature capability. Its combination of 10,200 logic elements, approximately 0.28 Mbits of on-chip RAM and 288 I/Os makes it a practical choice for embedded control, memory interfacing and communications tasks where a compact BGA package is required.
Being part of the LatticeECP/EC family means access to family-level features such as flexible I/O standards, multiple PLLs and a development ecosystem that supports faster design integration and migration within the family.
Request a quote or submit an inquiry to get pricing, lead time and availability for the LFEC10E-3F484I. Our team can provide the next steps to integrate this FPGA into your design.

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