LFEC10E-3F484I

IC FPGA 288 I/O 484FBGA
Part Description

EC Field Programmable Gate Array (FPGA) IC 288 282624 10200 484-BBGA

Quantity 938 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O288Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells10200
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFEC10E-3F484I – EC Field Programmable Gate Array (FPGA) IC, 10,200 logic elements · 288 I/Os · 484‑ball BGA

The LFEC10E-3F484I is an EC family Field Programmable Gate Array (FPGA) optimized for mainstream embedded designs. It combines a mid-range logic capacity with substantial on-chip memory and flexible I/O to address applications requiring moderate logic density and high pin count.

Built on the LatticeECP/EC family architecture, this device is suited for industrial applications and designs that benefit from integrated memory, multiple PLLs, and a compact 484-ball BGA package while operating across an extended temperature range.

Key Features

  • Logic Capacity — 10,200 logic elements (cells) provide mid-range programmable logic density for control, glue-logic, and data-path implementations.
  • On‑chip Memory — Total on-chip RAM of 282,624 bits (approximately 0.28 Mbits) to support embedded data buffering, FIFOs and state storage.
  • I/O Density — 288 I/O pins to support high-pin-count interfaces, board-level bridging and multi‑channel connectivity.
  • Power Supply — Core voltage supply range 1.14 V to 1.26 V to match system power rails and enable stable core operation.
  • Clocking — Family-level support includes up to four analog PLLs per device for clock management, multiplication, division and phase shifting.
  • Memory Interface Support — Family documentation includes dedicated DDR memory interface capability (up to DDR400), enabling direct connection to common DDR SDRAM devices.
  • Flexible I/O Standards — Family-level programmable I/O buffers support a wide range of interfaces including LVCMOS, LVTTL, SSTL, HSTL, PCI and LVDS signaling options.
  • Package & Mounting — 484-ball FPBGA (23 × 23 mm) in a surface-mount package for compact board integration.
  • Industrial Grade Operation — Rated operating temperature from −40 °C to 100 °C for deployment in industrial environments.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Industrial Control — Deterministic logic, substantial I/O and industrial temperature range suit motor control, factory automation interfaces and machine-control subsystems.
  • Memory Interface & Buffering — On‑chip RAM and family DDR support enable memory controller, bridge and buffering functions for systems using external DRAM.
  • Communications & Networking — High I/O count and programmable I/O standards allow protocol bridging, packet preprocessing and multi-channel I/O aggregation.
  • Embedded Systems — Mid-range logic density and embedded memory are appropriate for custom SoC glue logic, peripheral aggregation and control-plane processing.

Unique Advantages

  • Balanced Logic and Memory — 10,200 logic elements paired with approximately 0.28 Mbits of on‑chip RAM delivers a practical balance for mid-complexity designs without external FPGA fabric.
  • High I/O Count — 288 I/Os simplify board-level interconnection and reduce the need for external multiplexing or additional I/O expanders.
  • Industrial Temperature Range — −40 °C to 100 °C rating supports robust operation in demanding environments.
  • Compact, High‑Density Package — 484-ball FPBGA (23 × 23 mm) minimizes PCB footprint while providing extensive I/O and routing options.
  • Power‑Efficient Core Voltage — Narrow core supply window (1.14 V–1.26 V) that aligns with modern low-voltage power architectures.
  • Family Ecosystem — Part of the LatticeECP/EC family, which includes design tools and pre‑designed IP to accelerate development and time-to-prototype.

Why Choose LFEC10E-3F484I?

The LFEC10E-3F484I positions itself for engineers needing a mid-density FPGA with substantial I/O, embedded memory and industrial temperature capability. Its combination of 10,200 logic elements, approximately 0.28 Mbits of on-chip RAM and 288 I/Os makes it a practical choice for embedded control, memory interfacing and communications tasks where a compact BGA package is required.

Being part of the LatticeECP/EC family means access to family-level features such as flexible I/O standards, multiple PLLs and a development ecosystem that supports faster design integration and migration within the family.

Request a quote or submit an inquiry to get pricing, lead time and availability for the LFEC10E-3F484I. Our team can provide the next steps to integrate this FPGA into your design.

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