LFEC10E-3F256I

The LFEC10E-3F256I is an EC-family Field Programmable Gate Array optimized for mainstream and industrial embedded applications. It provides a flexible, general-purpose FPGA fabric with 10,200 logic elements and abundant on-chip memory, packaged in a 256-ball fpBGA (17 × 17 mm) for space-efficient surface-mount designs.

Designed for system-level integration, this device targets applications that require moderate logic density, flexible I/O and robust operating conditions, while offering voltage and temperature ranges suited to industrial deployments.

Key Features

• Core Logic: Approximately 10,200 logic elements to implement mid-density logic, control and glue-logic functions.
• On-chip Memory: Total RAM bits = 282,624 (approximately 0.277 Mbits) of embedded memory for buffers, FIFOs and small frame storage.
• I/O Capability: 195 user I/Os provided on the 256-ball fpBGA package to support multiple external interfaces and peripherals.
• Clocking: Four PLLs for clock multiply/divide and phase shifting to enable flexible clocking schemes and domain crossing.
• Flexible I/O Buffer Options: Family-level I/O support includes common standards such as LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and other differential options for broad interface compatibility.
• Memory Interface Support: Family datasheet documents dedicated DDR memory interface capability (up to DDR400/200 MHz) for designs requiring external memory bandwidth.
• Package & Mounting: 256‑ball fpBGA (17 × 17 mm), surface-mount package for compact board layouts; supplier device package listed as 256‑FPBGA.
• Power & Voltage: Supply voltage range 1.14 V to 1.26 V, aligning with the family’s 1.2 V core operation.
• Industrial Grade Temperature: Rated operating temperature from −40 °C to 100 °C for industrial environment suitability.
• System Support: Supports IEEE 1149.1 boundary scan and includes SPI boot flash interface and internal logic-analysis capability referenced in the family datasheet.
• Design Ecosystem: Supported by the family design tool suite and available ispLeverCORE IP modules (family-level resources documented in the datasheet).
• Compliance: RoHS compliant.

Typical Applications

• Industrial Control: Mid-density logic and wide I/O count make the device suitable for motor control, PLC interface logic and factory automation glue logic.
• High‑Speed Interfaces: Use as protocol bridging, serializer/deserializer support or custom interface logic where mixed single-ended and differential I/O standards are required.
• Memory Controller/Buffering: Implement DDR interface logic and on-board buffering for systems requiring external DRAM access and data staging.
• Embedded System Integration: Consolidate peripheral interfacing, control state machines and custom accelerators in space-constrained surface-mount designs.

Unique Advantages

• Balanced Logic and Memory: 10,200 logic elements paired with approximately 0.277 Mbits of embedded RAM supports a wide range of mid-density application needs without external FPGA fabric.
• High I/O Density in Compact Package: 195 I/Os in a 256-ball fpBGA (17 × 17 mm) enables complex I/O routing while preserving board space.
• Industrial Temperature Rating: −40 °C to 100 °C operation provides robustness for harsh or temperature-variable environments.
• Flexible Clocking: Four PLLs enable multi-domain clocking and phase adjustments for timing-critical designs.
• Design Ecosystem Support: Family-level design tools and pre-designed IP reduce development time and simplify integration into existing workflows.
• Low-Voltage Operation: Narrow VCC range (1.14–1.26 V) aligns with low-voltage system designs and simplifies power rail planning.

Why Choose LFEC10E-3F256I?

The LFEC10E-3F256I delivers a practical balance of logic capacity, embedded memory and flexible I/O in a compact industrial-grade package. It is well suited for engineers building mid-density FPGA solutions that require dependable operation across temperature extremes, a high I/O count, and straightforward integration with DDR memory and common interface standards.

Backed by the family’s documented design tools and system-level features, this device offers a scalable option for production embedded designs and industrial applications where predictable performance and board-space efficiency matter.

Request a quote or submit a request for pricing and availability to get started with LFEC10E-3F256I for your next design.