LFE5UM5G-85F-8BG756C
| Part Description |
ECP5-5G Field Programmable Gate Array (FPGA) IC 365 3833856 84000 756-FBGA |
|---|---|
| Quantity | 1,579 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 756-CABGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 756-FBGA | Number of I/O | 365 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21000 | Number of Logic Elements/Cells | 84000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFE5UM5G-85F-8BG756C – ECP5-5G Field Programmable Gate Array (FPGA) IC 365 3833856 84000 756-FBGA
The LFE5UM5G-85F-8BG756C is a commercial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor’s ECP5-5G family. It combines a programmable fabric with on-chip memory, dedicated DSP resources and high-speed I/O capabilities described in the ECP5/ECP5-5G datasheet.
Packaged in a 756-ball FBGA (756-CABGA, 27×27) and intended for surface-mount assembly, this device targets designs that require a balance of logic density, embedded RAM and flexible I/O in a compact footprint.
Key Features
- Logic Capacity — 21,000 CLBs and 84,000 logic elements for implementing control, glue logic and moderate-density programmable functions.
- Embedded Memory — Total on-chip RAM of 3,833,856 bits (approximately 3.83 Mbits) for data buffering, FIFOs and small memory-mapped structures.
- I/O Resources — 365 general-purpose I/O pins to support parallel interfaces, bus connections and multiple peripheral signals.
- Clocking and Timing — Family-level architecture includes PLLs, clock distribution and clock divider features as documented in the ECP5/ECP5-5G datasheet.
- SERDES and High-Speed Interfaces — The datasheet details SERDES blocks and physical coding sublayer support for serial link implementations.
- Memory Interfaces — Device-level support for DDR memory interfaces and related DQS calibration elements as described in the datasheet.
- Package and Mounting — 756-FBGA (supplier device package 756-CABGA, 27×27); surface-mount package for board-level integration.
- Power and Supply — Core operating voltage range of 1.045 V to 1.155 V.
- Temperature and Grade — Commercial grade with operating temperature range 0 °C to 85 °C.
- Compliance — RoHS-compliant construction.
Typical Applications
- High-speed serial links — Leverage the device’s SERDES and PCS features from the ECP5-5G family for serial data transport and protocol bridging.
- Memory interface controllers — Use built-in DDR support and on-chip RAM for implementing external memory controllers and data buffering.
- Signal processing and control — Utilize embedded logic and DSP-oriented slices (as described in the family datasheet) for real-time processing, filtering or control tasks.
- Flexible I/O aggregation — Take advantage of 365 I/O pins to aggregate multiple peripheral interfaces and custom bus connections on a single device.
Unique Advantages
- Balanced logic and memory — 84,000 logic elements combined with approximately 3.83 Mbits of embedded RAM provide a balanced platform for control, buffering and mid-density logic functions.
- Significant I/O count — 365 I/O pins enable complex multi-interface designs while minimizing the need for additional multiplexing logic.
- Compact, board-friendly package — 756-FBGA (27×27) surface-mount packaging supports high-density PCBs and space-constrained assemblies.
- Family-level timing and SERDES features — The ECP5/ECP5-5G family architecture includes PLLs, clock distribution, DDR support and SERDES blocks to address timing, memory and serial connectivity needs.
- Commercial temperature range — Rated for 0 °C to 85 °C operation to suit standard commercial applications.
- Regulatory-friendly — RoHS-compliant manufacturing reduces environmental handling concerns in procurement and assembly.
Why Choose LFE5UM5G-85F-8BG756C?
The LFE5UM5G-85F-8BG756C provides a practical combination of logic density, embedded RAM and extensive I/O in a compact 756-FBGA package. As a member of the ECP5-5G family, it benefits from a documented architecture that covers programmable I/O, clocking, SERDES and memory support, enabling designers to integrate mid-range FPGA capabilities without excessive board-level complexity.
This device is well suited to teams building applications that require moderate logic resources, significant I/O routing and on-chip memory, and who need a commercial-grade FPGA solution with clear supply voltage and temperature specifications.
Request a quote or submit an inquiry to receive pricing, availability and lead-time information for the LFE5UM5G-85F-8BG756C.

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