LFE5UM5G-85F-8BG756C

IC FPGA 365 I/O 756CABGA
Part Description

ECP5-5G Field Programmable Gate Array (FPGA) IC 365 3833856 84000 756-FBGA

Quantity 1,579 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package756-CABGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case756-FBGANumber of I/O365Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21000Number of Logic Elements/Cells84000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3833856

Overview of LFE5UM5G-85F-8BG756C – ECP5-5G Field Programmable Gate Array (FPGA) IC 365 3833856 84000 756-FBGA

The LFE5UM5G-85F-8BG756C is a commercial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor’s ECP5-5G family. It combines a programmable fabric with on-chip memory, dedicated DSP resources and high-speed I/O capabilities described in the ECP5/ECP5-5G datasheet.

Packaged in a 756-ball FBGA (756-CABGA, 27×27) and intended for surface-mount assembly, this device targets designs that require a balance of logic density, embedded RAM and flexible I/O in a compact footprint.

Key Features

  • Logic Capacity — 21,000 CLBs and 84,000 logic elements for implementing control, glue logic and moderate-density programmable functions.
  • Embedded Memory — Total on-chip RAM of 3,833,856 bits (approximately 3.83 Mbits) for data buffering, FIFOs and small memory-mapped structures.
  • I/O Resources — 365 general-purpose I/O pins to support parallel interfaces, bus connections and multiple peripheral signals.
  • Clocking and Timing — Family-level architecture includes PLLs, clock distribution and clock divider features as documented in the ECP5/ECP5-5G datasheet.
  • SERDES and High-Speed Interfaces — The datasheet details SERDES blocks and physical coding sublayer support for serial link implementations.
  • Memory Interfaces — Device-level support for DDR memory interfaces and related DQS calibration elements as described in the datasheet.
  • Package and Mounting — 756-FBGA (supplier device package 756-CABGA, 27×27); surface-mount package for board-level integration.
  • Power and Supply — Core operating voltage range of 1.045 V to 1.155 V.
  • Temperature and Grade — Commercial grade with operating temperature range 0 °C to 85 °C.
  • Compliance — RoHS-compliant construction.

Typical Applications

  • High-speed serial links — Leverage the device’s SERDES and PCS features from the ECP5-5G family for serial data transport and protocol bridging.
  • Memory interface controllers — Use built-in DDR support and on-chip RAM for implementing external memory controllers and data buffering.
  • Signal processing and control — Utilize embedded logic and DSP-oriented slices (as described in the family datasheet) for real-time processing, filtering or control tasks.
  • Flexible I/O aggregation — Take advantage of 365 I/O pins to aggregate multiple peripheral interfaces and custom bus connections on a single device.

Unique Advantages

  • Balanced logic and memory — 84,000 logic elements combined with approximately 3.83 Mbits of embedded RAM provide a balanced platform for control, buffering and mid-density logic functions.
  • Significant I/O count — 365 I/O pins enable complex multi-interface designs while minimizing the need for additional multiplexing logic.
  • Compact, board-friendly package — 756-FBGA (27×27) surface-mount packaging supports high-density PCBs and space-constrained assemblies.
  • Family-level timing and SERDES features — The ECP5/ECP5-5G family architecture includes PLLs, clock distribution, DDR support and SERDES blocks to address timing, memory and serial connectivity needs.
  • Commercial temperature range — Rated for 0 °C to 85 °C operation to suit standard commercial applications.
  • Regulatory-friendly — RoHS-compliant manufacturing reduces environmental handling concerns in procurement and assembly.

Why Choose LFE5UM5G-85F-8BG756C?

The LFE5UM5G-85F-8BG756C provides a practical combination of logic density, embedded RAM and extensive I/O in a compact 756-FBGA package. As a member of the ECP5-5G family, it benefits from a documented architecture that covers programmable I/O, clocking, SERDES and memory support, enabling designers to integrate mid-range FPGA capabilities without excessive board-level complexity.

This device is well suited to teams building applications that require moderate logic resources, significant I/O routing and on-chip memory, and who need a commercial-grade FPGA solution with clear supply voltage and temperature specifications.

Request a quote or submit an inquiry to receive pricing, availability and lead-time information for the LFE5UM5G-85F-8BG756C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up