LFE5UM5G-85F-8BG554I

IC FPGA 259 I/O 554CABGA
Part Description

ECP5-5G Field Programmable Gate Array (FPGA) IC 259 3833856 84000 554-FBGA

Quantity 1,609 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package554-CABGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case554-FBGANumber of I/O259Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs21000Number of Logic Elements/Cells84000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3833856

Overview of LFE5UM5G-85F-8BG554I – ECP5-5G Field Programmable Gate Array, 554-FBGA, Industrial

The LFE5UM5G-85F-8BG554I is an ECP5-5G family Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor, provided in a 554-FBGA package. It combines a high-density programmable logic fabric with on-chip memory and extensive I/O to support complex, configurable digital systems.

Designed for industrial environments, this device delivers 84,000 logic elements, approximately 3.83 Mbits of embedded memory, and up to 259 I/O pins while operating across a 1.045 V to 1.155 V supply range and a −40 °C to 100 °C temperature window.

Key Features

  • Programmable Logic Capacity  84,000 logic elements for implementing complex custom logic and state machines.
  • Embedded Memory  Approximately 3.83 Mbits of on-chip RAM to support buffering, look-up tables, and local data storage.
  • I/O Density  Up to 259 general-purpose I/O pins to interface with sensors, peripherals, and external devices.
  • Power and Supply  Recommended operating supply range of 1.045 V to 1.155 V for core power management.
  • Industrial Temperature Grade  Specified operating temperature range from −40 °C to 100 °C for reliable operation in industrial applications.
  • Package & Mounting  554-FBGA package (supplier device package: 554-CABGA, 23 × 23 mm) with surface-mount mounting for compact board integration.
  • ECP5-5G Family Architecture  Family-level features documented in the ECP5 and ECP5-5G datasheet include SERDES and physical coding sublayer, DDR memory support, programmable I/O cells, PLL clocking resources, and DSP-oriented slices—enabling a variety of serial, memory, timing, and signal-processing architectures.
  • RoHS Compliant  Conforms to RoHS requirements for environmental compliance.

Typical Applications

  • Industrial Control  Dense programmable logic and extended temperature range make the device suitable for industrial automation, motion control, and PLC offload logic.
  • High-speed Serial Systems  Family SERDES architecture supports designs that require serial data lanes and protocol bridging.
  • Memory Interfaces  On-chip memory and documented DDR support enable buffering and interface logic for external memory subsystems.
  • Embedded Signal Processing  DSP-oriented slices in the family architecture allow implementation of custom filtering, aggregation, and real-time processing tasks.

Unique Advantages

  • High logic density: 84,000 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing BOM and board complexity.
  • Substantial embedded memory: Approximately 3.83 Mbits of on-chip RAM supports local buffering and accelerates data-path implementations.
  • Large I/O count: 259 I/O pins enable broad peripheral connectivity and flexible interfacing without external bridging logic.
  • Industrial operating range: Specified for −40 °C to 100 °C to meet demanding environmental requirements in industrial deployments.
  • Compact package footprint: 554-FBGA (554-CABGA 23×23 mm) surface-mount package balances pin count and board space for dense designs.
  • Family-level feature set: ECP5-5G family documentation covers SERDES, DDR memory support, PLLs, and programmable I/O—facilitating system-level design choices aligned with the device capabilities.

Why Choose LFE5UM5G-85F-8BG554I?

The LFE5UM5G-85F-8BG554I positions itself as a high-density, industrial-grade FPGA option within the ECP5-5G family, offering a balance of programmable logic, embedded memory, and extensive I/O in a compact 554-FBGA package. Its specified operating voltage and temperature range make it a practical choice for industrial and communications-oriented designs that require robust, reconfigurable hardware.

Engineers selecting this part gain a documented family architecture that includes SERDES, DDR memory support, DSP-capable resources, and programmable I/O structures—providing a clear pathway for implementing complex interfaces and data-paths while leveraging manufacturer documentation for design integration.

Request a quote or submit a purchase inquiry referencing part number LFE5UM5G-85F-8BG554I to receive pricing and availability information.

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