LFE5UM5G-85F-8BG756I
| Part Description |
ECP5-5G Field Programmable Gate Array (FPGA) IC 365 3833856 84000 756-FBGA |
|---|---|
| Quantity | 775 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 756-CABGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 756-FBGA | Number of I/O | 365 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 21000 | Number of Logic Elements/Cells | 84000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3833856 |
Overview of LFE5UM5G-85F-8BG756I – ECP5-5G FPGA, 756-FBGA, Industrial Grade
The LFE5UM5G-85F-8BG756I is an ECP5-5G family field programmable gate array (FPGA) from Lattice Semiconductor Corporation, supplied in a 756-pin FBGA package (756-CABGA, 27×27). It delivers a high-density programmable fabric with a combination of logic, embedded memory, and abundant I/O for compact, industrial designs.
Targeted at applications that require significant on-chip logic and I/O integration, this device combines 84,000 logic elements with a large I/O count and industrial operating range to support complex control, interface and processing tasks while fitting surface-mount PCB assembly flows.
Key Features
- Core Logic 84,000 logic elements provide capacity for substantial custom logic, finite-state machines, and glue-logic integration in a single device.
- Embedded Memory Approximately 3.83 Mbits of on-chip RAM to store buffers, FIFOs, and working data close to logic for reduced external memory dependence.
- I/O Capability 365 I/O pins support dense peripheral and bus connectivity for multi-interface designs and extensive sensor or actuator wiring.
- Power Supply Supported core voltage range from 1.045 V to 1.155 V, enabling precise power budgeting and predictable supply requirements.
- Package & Mounting 756-pin FBGA (supplier package 756-CABGA, 27×27) in a surface-mount form factor for compact PCB layouts and automated assembly.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, meeting broad environmental conditions typical of industrial deployments.
- Standards & Family Architecture Based on the ECP5-5G family architecture with documented features such as programmable I/O, PLLs, memory blocks, DSP slices and SERDES capabilities as described in the family data sheet.
- RoHS Compliant Device is RoHS compliant for regulatory and manufacturing requirements.
Typical Applications
- High-density interface bridging Use the large I/O count and logic capacity to implement protocol conversion, bus bridging, and multi-interface aggregation in compact industrial systems.
- Embedded signal processing Combine logic and on-chip RAM to implement data pre-processing, filtering, and deterministic control functions without immediate reliance on external memory.
- Memory-interface and SERDES clients Family-level support for DDR interfaces and SERDES blocks (as documented in the ECP5-5G datasheet) makes the device suitable for designs requiring high-speed I/O links and DDR memory front-ends.
- Industrial control and automation Industrial temperature rating and robust I/O count enable motor control, sensor aggregation, and machine control tasks in factory and process environments.
Unique Advantages
- High on-chip integration: 84,000 logic elements and embedded RAM reduce the need for multiple external components, simplifying BOM and PCB area.
- Extensive I/O: 365 I/Os enable direct connection to many peripherals and interfaces, minimizing external multiplexing or bridge devices.
- Industrial-grade operation: Rated from −40 °C to 100 °C to support deployments in demanding environmental conditions.
- Compact, assembly-friendly package: 756-FBGA (27×27) surface-mount package balances pin count with a small PCB footprint for space-constrained designs.
- Predictable power envelope: Narrow core voltage window (1.045 V–1.155 V) aids supply design and power sequencing.
- Standards-backed architecture: Device is part of the ECP5-5G family with documented features including programmable I/O, PLLs, sysMEM and SERDES capabilities referenced in the family datasheet.
Why Choose LFE5UM5G-85F-8BG756I?
This FPGA is positioned for engineers who need substantial programmable logic, significant I/O density, and industrial temperature performance in a compact surface-mount package. With 84,000 logic elements, approximately 3.83 Mbits of embedded memory, and 365 I/Os, it supports complex interface, control, and signal-processing tasks while reducing external component count.
As a member of the ECP5-5G family from Lattice Semiconductor, the device is documented within the family data materials that describe architecture elements such as programmable I/O, memory blocks, DSP slices and SERDES functions—providing design teams with the technical reference material needed to integrate this FPGA into production hardware with predictable electrical and environmental characteristics.
Request a quote or submit a procurement inquiry to receive pricing, lead-time, and availability information for the LFE5UM5G-85F-8BG756I.

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