LFE5UM5G-85F-8BG554C

The Lattice Semiconductor LFE5UM5G-85F-8BG554C is an ECP5-5G family Field Programmable Gate Array (FPGA) packaged in a 554‑FBGA (554‑CABGA, 23×23) surface‑mount device. It integrates a mid‑range programmable logic fabric with on‑chip memory and a high I/O count to support designs that require flexible digital logic, embedded RAM, and diverse I/O connectivity.

Family documentation describes architecture elements such as programmable I/O cells, clocking (PLLs and clock distribution), DDR memory support, SERDES/PCS blocks, and sysDSP and memory blocks—capabilities reflected in the ECP5‑5G family datasheet.

Key Features

• Programmable Logic Capacity — 84,000 logic elements (cells) for implementing mid‑range FPGA designs and custom logic functions.
• Embedded Memory — Approximately 3.83 Mbits of on‑chip RAM to support buffering, FIFOs, and block‑memory functions.
• High I/O Density — 259 user I/O pins to accommodate multiple peripheral interfaces and parallel buses.
• Power Supply — Core supply range specified at 1.045 V to 1.155 V for system power budgeting and regulator selection.
• Package and Mounting — 554‑FBGA (supplier package: 554‑CABGA, 23×23) in a surface‑mount format for compact board integration.
• Operating Grade and Temperature — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Family‑Level System Features — Datasheet coverage for programmable I/O cells, clocking (sysCLOCK PLL and clock distribution), DDR memory support, SERDES/PCS blocks, and sysDSP and sysMEM resources.
• Environmental Compliance — RoHS‑compliant construction.

Typical Applications

• High‑density digital logic — Implement custom datapaths, glue logic, and protocol conversion using the device’s 84,000 logic elements and embedded memory.
• Memory interface and buffering — Use the on‑chip RAM and family DDR support for memory controllers, buffering, and data staging.
• High‑I/O aggregation — Consolidate multiple peripheral interfaces and parallel buses with the 259 available I/Os.
• High‑speed serial and PHY functions — Leverage family SERDES and PCS capabilities described in the datasheet for serial link implementations.

Unique Advantages

• Balanced logic and memory capacity: 84,000 logic elements combined with approximately 3.83 Mbits of embedded RAM enables complex logic plus substantial on‑chip data storage without external RAM for many use cases.
• High I/O count in a compact package: 259 I/Os in a 554‑FBGA (23×23) footprint supports dense board layouts while providing board‑level interface flexibility.
• Power supply clarity: Defined core supply range (1.045–1.155 V) simplifies regulator selection and power sequencing design.
• Family architecture support: ECP5‑5G family features such as programmable I/O, PLLs, DDR support, SERDES, and sysDSP enable a wide variety of system functions described in the family datasheet.
• Commercial temperature classification: Rated for 0 °C to 85 °C operation for standard commercial applications and environments.
• RoHS compliance: Meets common environmental standard requirements for lead‑free assembly.

Why Choose LFE5UM5G-85F-8BG554C?

The LFE5UM5G-85F-8BG554C brings a balanced combination of logic density, embedded memory, and I/O capacity in a 554‑FBGA surface‑mount package. Its documented family architecture—covering programmable I/O, clocking, DDR memory support, SERDES, and DSP/memory resources—makes it a practical option for designers implementing mid‑range FPGA functions that require a mix of logic, memory, and high I/O density within a defined commercial temperature envelope.

This device is suited for teams who need a verified family feature set and straightforward electrical parameters (including a clear core voltage range and operating temperature) to plan power delivery, signal routing, and system integration while leveraging the ECP5‑5G family architecture described in the datasheet.

If you would like pricing details, availability, or to request a quote for LFE5UM5G-85F-8BG554C, please submit a quote request or inquiry to begin the procurement process.