LFEC10E-3FN256I

The LFEC10E-3FN256I is a Lattice EC family Field Programmable Gate Array (FPGA) offered in a 256‑ball fpBGA (17×17 mm) package. It provides approximately 10,200 logic elements and about 282,624 bits of embedded memory, together with 195 general‑purpose I/O pins—making it suitable for cost‑sensitive, mainstream and industrial embedded designs that require dense I/O and on‑chip memory.

Designed for industrial operation, the device supports a 1.14 V to 1.26 V core supply and an extended operating temperature range from −40 °C to 100 °C, enabling deployment in demanding environments.

Key Features

• Logic Capacity  Approximately 10,200 logic elements provide fabric for medium‑complexity designs and custom logic integration.
• Embedded Memory  Approximately 276 Kbits of embedded block RAM (282,624 bits) for data buffering, small frame buffers, and state storage.
• I/O Density  195 I/O pins in the 256‑ball fpBGA package enable rich external connectivity and support for multiple interfaces.
• Programmable I/O Standards  Flexible I/O buffer architecture supports a broad set of common standards (for example, LVCMOS and LVDS) to simplify interface integration.
• Clocking  Up to four analog PLLs per device provide clock multiplication, division and phase shifting options for system timing requirements.
• Power  Core voltage operation between 1.14 V and 1.26 V aligns with standard low‑voltage FPGA supply rails.
• Package  256‑ball fpBGA (17×17 mm) package offers a compact footprint for board area‑constrained applications while delivering 195 I/Os.
• Industrial Temperature Grade  Rated for −40 °C to 100 °C operation for reliable performance in industrial environments.
• Compliance  RoHS compliant construction supports environmental and regulatory requirements.
• Design Ecosystem  Supported by Lattice design tools and IP (ispLEVER and ispLeverCORE modules referenced for the family) to accelerate development and integration.

Typical Applications

• Industrial Control and Automation  Industrial temperature rating and flexible I/O make the device suitable for control logic, protocol bridging, and I/O aggregation in factory and process automation.
• Embedded Systems  On‑chip memory and mid‑range logic capacity enable embedded controllers, protocol translators, and glue‑logic for product platforms.
• Memory Interface and Buffering  Embedded RAM and PLL resources support designs that require local buffering and timing control for external memory interfaces.
• Communication Interfaces  High I/O count and programmable I/O standards support interface conversion, protocol termination, and board‑level multiplexing tasks.

Unique Advantages

• Balanced integration:  Combines ~10,200 logic elements with substantial on‑chip memory (≈276 Kbits) and 195 I/Os to reduce external components and simplify board design.
• Industrial readiness:  Rated for −40 °C to 100 °C operation and supplied RoHS compliant for deployment in demanding environments and regulated markets.
• Compact packaging:  256‑ball fpBGA (17×17 mm) delivers high I/O density in a small footprint for space‑constrained designs.
• Flexible clocking:  Up to four analog PLLs provide on‑device clock management to meet diverse timing and synchronization needs.
• Broad I/O support:  Programmable I/O buffers support common interface standards, simplifying integration with a wide range of peripherals and buses.
• Toolchain and IP support:  Family support within Lattice design tools and pre‑designed IP blocks helps accelerate development and reduce time to market.

Why Choose LFEC10E-3FN256I?

The LFEC10E-3FN256I positions itself as a versatile, industrial‑grade FPGA option for designers who need a balance of logic capacity, embedded memory, and high I/O count in a compact package. Its operating voltage range, industrial temperature rating, and RoHS compliance make it suitable for embedded and industrial solutions where reliability and integration matter.

For teams targeting cost‑sensitive mainstream applications, the device’s combination of on‑chip memory, PLL resources and extensive I/O simplifies system architecture, reduces BOM complexity, and leverages the Lattice family tool and IP ecosystem to accelerate development and migration across densities in the same device family.

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