LFEC10E-3FN484C

The LFEC10E-3FN484C is a commercial-grade EC family FPGA in a 484-ball fpBGA (23 × 23 mm) package designed for mainstream, cost-sensitive applications. It provides a general-purpose FPGA fabric with on-chip memory, flexible I/O and system-level support for embedded designs that require a balance of logic capacity, I/O density and low-voltage operation.

Key Features

• Logic Capacity — 10,200 logic elements (cells) to implement mid-range logic and control functions.
• On‑chip Memory — Total RAM of 282,624 bits (approximately 0.277 Mbits) for embedded storage and buffering.
• I/O Density — 288 user I/O pins to support a broad set of external interfaces and peripherals.
• Package & Mounting — 484-BBGA (484-ball fpBGA, 23 × 23 mm) package; surface-mount device suitable for compact board layouts.
• Power Supply — Core voltage range of 1.14 V to 1.26 V optimized for low-voltage FPGA operation.
• Operating Range — Commercial operating temperature range: 0 °C to 85 °C.
• Clocking and Timing — Includes multiple PLLs (up to four PLLs for the LFEC10 devices) for clock multiply/divide and phase adjustments.
• System-level Support — Includes IEEE 1149.1 boundary-scan, SPI boot flash interface and ispTRACY internal logic analyzer capability for development and debug.
• Flexible I/O Buffering — Family-level support for a wide range of interfaces, including LVCMOS (various voltages), LVTTL, SSTL, HSTL, PCI, LVDS and similar signaling standards.
• RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

• Embedded systems — Implement mid-density control, glue logic and protocol handling where a balance of logic and on-chip RAM is required.
• High-density I/O interfaces — Drive multiple parallel and serial interfaces thanks to 288 available I/Os and programmable I/O standards.
• Memory interfaces — Support cost-sensitive designs that require dedicated DDR memory support and flexible memory connectivity.
• Development and prototyping — Useful for system-level prototyping with built-in debug capabilities such as boundary-scan and internal logic analysis.

Unique Advantages

• Balanced mid-range capacity: 10,200 logic elements and ~0.277 Mbits of on-chip RAM provide the resources to implement substantial designs without excessive BOM cost.
• High I/O count in compact package: 288 I/Os in a 23 × 23 mm fpBGA simplifies board routing for designs with many external connections.
• Low-voltage core operation: 1.14 V to 1.26 V supply enables integration into modern low-voltage power architectures.
• Comprehensive system features: Boundary-scan, SPI boot and ispTRACY support speed development, bring-up and in-system debug.
• Flexible interface support: Programmable I/O buffer options cover common signaling standards to interface with diverse peripherals and memory types.
• RoHS compliant: Meets environmental requirements for modern electronics production.

Why Choose LFEC10E-3FN484C?

The LFEC10E-3FN484C delivers a practical mix of logic capacity, embedded memory and high I/O density in a compact fpBGA package, making it well suited for mainstream, cost-sensitive embedded designs and systems requiring multiple interfaces and on-board memory. Its low-voltage core, integrated system features and flexible I/O options support efficient board-level integration and development workflows.

Engineers designing mid-range FPGA-based products will find the LFEC10E-3FN484C appropriate for applications that demand reliable logic resources, significant I/O, and development-friendly capabilities while maintaining a commercial temperature grade and RoHS compliance.

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