LFEC10E-3QN208C

The LFEC10E-3QN208C is a commercial-grade EC family FPGA delivering programmable logic, embedded memory and flexible I/O in a 208-pin BFQFP/PQFP (28 × 28 mm) package. Designed for mainstream embedded applications, it combines 10,200 logic elements with on-chip RAM and multi-pll clocking to implement control, glue-logic and interface functions where compact form factor and low-voltage operation are important.

Key Features

• Logic Capacity 10,200 logic elements for implementing medium-density logic, state machines and glue logic.
• On‑chip Memory Approximately 276 Kbits (≈0.28 Mbits) of embedded RAM (total RAM bits: 282,624) for FIFOs, buffers and small data stores.
• I/O and Package 147 user I/Os in a 208‑BFQFP package (supplier package: 208‑PQFP, 28 × 28 mm); surface-mount mounting for compact PCB designs.
• Low‑voltage Core Core supply range specified at 1.14 V to 1.26 V, compatible with 1.2 V system rails.
• Clock Management Four analog PLLs for clock multiplication, division and phase shifting to support varied timing requirements.
• Flexible I/O Standards (family‑level) Family I/O support includes LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS via programmable I/O buffers.
• System Integration Features Boundary-scan (IEEE 1149.1), SPI boot flash interface and internal logic analyzer (ispTRACY) capability as part of the family feature set.
• Commercial Temperature Grade Specified operating temperature from 0 °C to 85 °C for standard commercial applications.
• Environment RoHS compliant.

Typical Applications

• Embedded Controllers: Implement compact control logic, protocol handling and peripheral interfacing in space-constrained embedded systems.
• User Interfaces and Displays: Drive custom front-end logic, signal conditioning and simple timing functions for display controllers and HMI subsystems.
• Communications and Interface Bridging: Provide protocol conversion, glue logic and buffering between mixed-voltage subsystems using the device’s flexible I/O.

Unique Advantages

• Balanced Logic and Memory: 10,200 logic elements combined with ~276 Kbits of on-chip RAM supports a wide range of medium-complexity designs without external SRAM for many control and buffer tasks.
• High I/O Count in a Compact Package: 147 I/Os in a 208‑pin PQFP (28 × 28 mm) provides a high pin count without resorting to BGA packages, simplifying assembly and rework.
• Low-Voltage Core Compatibility: Narrow core voltage window (1.14–1.26 V) aligns to 1.2 V system power rails for consistent core operation.
• Clock Flexibility: Four PLLs enable local clock generation and domain creation for multiple subsystems within a single device.
• Design Ecosystem (family): The family is supported by ispLEVER design tools and pre-designed ispLeverCORE IP modules to accelerate development and reduce integration effort.
• Regulatory and Assembly Readiness: Surface-mount PQFP package and RoHS compliance support standard commercial manufacturing flows.

Why Choose LFEC10E-3QN208C?

The LFEC10E-3QN208C positions as a pragmatic, mid-density FPGA option for commercial embedded designs that need a combination of programmable logic, embedded RAM and extensive I/O in a compact, surface-mount PQFP package. Its 10,200 logic elements, roughly 276 Kbits of on-chip RAM and four PLLs make it well suited for control, interface and glue-logic tasks in consumer and general-purpose industrial equipment within the 0 °C to 85 °C operating range.

Backed by family-level design tools and IP, the device offers a predictable migration path and design-flow support for development teams seeking cost-effective, scalable FPGA integration without moving to high-pin-count BGA packages.

Request a quote or submit a procurement inquiry to check availability and pricing for LFEC10E-3QN208C.