LFEC10E-4FN256C

IC FPGA 195 I/O 256FBGA
Part Description

EC Field Programmable Gate Array (FPGA) IC 195 282624 10200 256-BGA

Quantity 612 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O195Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1280Number of Logic Elements/Cells10200
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFEC10E-4FN256C – EC FPGA, 256‑BGA, 195 I/O

The LFEC10E-4FN256C is an EC family Field Programmable Gate Array (FPGA) in a 256‑ball fpBGA package, engineered for mainstream commercial embedded designs. It combines programmable logic, on‑chip RAM and flexible I/O in a compact surface‑mount footprint, making it suitable for a broad range of commercial and consumer applications that require configurable logic and high I/O density.

Built on the LatticeECP/EC family architecture, the device targets cost‑sensitive systems that benefit from a low‑voltage core, integrated memory resources and up to four analog PLLs for clock management and system timing.

Key Features

  • Logic Capacity  Approximately 10,200 logic elements providing substantial programmable logic for glue logic, protocol bridging and control functions.
  • On‑Chip Memory  Approximately 282,624 bits (≈0.283 Mbits) of embedded RAM to support buffering, FIFOs and small data stores without external memory.
  • I/O Density  195 user I/Os to support wide peripheral connectivity and multi‑lane interfaces in a single device.
  • Package & Mounting  256‑ball fpBGA (17 × 17 mm) package, surface‑mount, optimized for space‑constrained board designs.
  • Power Supply  Core supply range 1.14 V to 1.26 V for low‑voltage system integration.
  • Commercial Temperature Range  Specified for 0 °C to 85 °C operation for commercial applications.
  • Clock and Timing  Family supports up to four analog PLLs for clock multiplication, division and phase shifting to simplify timing architectures.
  • Flexible I/O Support  Family architecture provides programmable I/O buffer support for a wide range of interface needs (as defined by the LatticeECP/EC family).
  • Standards & Compliance  RoHS‑compliant construction.

Typical Applications

  • Embedded Systems  Compact programmable logic for control, interface glue and subsystem integration in commercial and consumer products.
  • Interface & Protocol Bridging  High I/O count and flexible I/O buffers allow implementation of protocol translators, bus bridges and peripheral interfaces.
  • Memory Interface Support  On‑chip memory and family DDR support enable buffering and controller logic for external memory subsystems.
  • Communications & Peripherals  Use as a configurable peripheral controller or packet preprocessing block where moderate logic and RAM are required.

Unique Advantages

  • Balanced Logic and Memory:  Approximately 10,200 logic elements paired with ~282,624 bits of embedded RAM deliver a cohesive platform for mixed logic and storage needs.
  • High I/O Count in a Small Package:  195 I/Os in a 256‑ball fpBGA (17×17 mm) enable dense connectivity while conserving board area.
  • Low‑Voltage Core:  A narrow core voltage range (1.14–1.26 V) supports power‑aware designs and modern low‑voltage system rails.
  • Commercial Grade for Broad Deployment:  Rated 0 °C to 85 °C for standard commercial product environments.
  • Clocking Flexibility:  Up to four analog PLLs (family capability) simplify system clocking, allowing local clock generation and phase adjustments.
  • RoHS Compliance:  Manufactured to meet current lead‑free environmental requirements.

Why Choose LFEC10E-4FN256C?

The LFEC10E-4FN256C provides a balanced mix of programmable logic, embedded RAM and high I/O density in a compact fpBGA package—ideal for commercial embedded designs where board space, interface count and cost are key considerations. With family features for flexible I/O standards and multiple PLLs for clock management, the device fits designs that require configurable logic, memory buffering and robust timing control.

Choose LFEC10E-4FN256C for scalable designs that benefit from an established FPGA family architecture and vendor ecosystem, enabling streamlined integration and reliable commercial‑grade operation.

Request a quote or submit a procurement inquiry to receive pricing, availability and lead‑time details for LFEC10E-4FN256C.

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