LFEC10E-4FN256C
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 195 282624 10200 256-BGA |
|---|---|
| Quantity | 612 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 195 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1280 | Number of Logic Elements/Cells | 10200 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFEC10E-4FN256C – EC FPGA, 256‑BGA, 195 I/O
The LFEC10E-4FN256C is an EC family Field Programmable Gate Array (FPGA) in a 256‑ball fpBGA package, engineered for mainstream commercial embedded designs. It combines programmable logic, on‑chip RAM and flexible I/O in a compact surface‑mount footprint, making it suitable for a broad range of commercial and consumer applications that require configurable logic and high I/O density.
Built on the LatticeECP/EC family architecture, the device targets cost‑sensitive systems that benefit from a low‑voltage core, integrated memory resources and up to four analog PLLs for clock management and system timing.
Key Features
- Logic Capacity Approximately 10,200 logic elements providing substantial programmable logic for glue logic, protocol bridging and control functions.
- On‑Chip Memory Approximately 282,624 bits (≈0.283 Mbits) of embedded RAM to support buffering, FIFOs and small data stores without external memory.
- I/O Density 195 user I/Os to support wide peripheral connectivity and multi‑lane interfaces in a single device.
- Package & Mounting 256‑ball fpBGA (17 × 17 mm) package, surface‑mount, optimized for space‑constrained board designs.
- Power Supply Core supply range 1.14 V to 1.26 V for low‑voltage system integration.
- Commercial Temperature Range Specified for 0 °C to 85 °C operation for commercial applications.
- Clock and Timing Family supports up to four analog PLLs for clock multiplication, division and phase shifting to simplify timing architectures.
- Flexible I/O Support Family architecture provides programmable I/O buffer support for a wide range of interface needs (as defined by the LatticeECP/EC family).
- Standards & Compliance RoHS‑compliant construction.
Typical Applications
- Embedded Systems Compact programmable logic for control, interface glue and subsystem integration in commercial and consumer products.
- Interface & Protocol Bridging High I/O count and flexible I/O buffers allow implementation of protocol translators, bus bridges and peripheral interfaces.
- Memory Interface Support On‑chip memory and family DDR support enable buffering and controller logic for external memory subsystems.
- Communications & Peripherals Use as a configurable peripheral controller or packet preprocessing block where moderate logic and RAM are required.
Unique Advantages
- Balanced Logic and Memory: Approximately 10,200 logic elements paired with ~282,624 bits of embedded RAM deliver a cohesive platform for mixed logic and storage needs.
- High I/O Count in a Small Package: 195 I/Os in a 256‑ball fpBGA (17×17 mm) enable dense connectivity while conserving board area.
- Low‑Voltage Core: A narrow core voltage range (1.14–1.26 V) supports power‑aware designs and modern low‑voltage system rails.
- Commercial Grade for Broad Deployment: Rated 0 °C to 85 °C for standard commercial product environments.
- Clocking Flexibility: Up to four analog PLLs (family capability) simplify system clocking, allowing local clock generation and phase adjustments.
- RoHS Compliance: Manufactured to meet current lead‑free environmental requirements.
Why Choose LFEC10E-4FN256C?
The LFEC10E-4FN256C provides a balanced mix of programmable logic, embedded RAM and high I/O density in a compact fpBGA package—ideal for commercial embedded designs where board space, interface count and cost are key considerations. With family features for flexible I/O standards and multiple PLLs for clock management, the device fits designs that require configurable logic, memory buffering and robust timing control.
Choose LFEC10E-4FN256C for scalable designs that benefit from an established FPGA family architecture and vendor ecosystem, enabling streamlined integration and reliable commercial‑grade operation.
Request a quote or submit a procurement inquiry to receive pricing, availability and lead‑time details for LFEC10E-4FN256C.

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