LFEC10E-3FN256C

The LFEC10E-3FN256C is a Lattice EC family FPGA device that delivers mainstream FPGA functionality in a compact 256-ball fpBGA package. Built around LUT-based logic with embedded and distributed memory resources, this device targets commercial embedded and system applications that require flexible I/O, on-chip memory and programmable logic in a low-cost form factor.

Designed for applications that need programmable glue logic, memory interfacing and system-level integration, the LFEC10E-3FN256C balances density and I/O capability with a narrow supply-voltage window and commercial operating range.

Key Features

• Logic Capacity  Provides 1,280 logic blocks and 10,200 logic elements for implementing combinational and sequential logic functions.
• On‑Chip Memory  Includes approximately 0.283 Mbits of on-chip RAM (282,624 bits) in a mix of embedded and distributed memory resources.
• I/O and Package  195 user I/Os in a 256-ball fpBGA (256‑FPBGA, 17 × 17 mm) surface-mount package for dense board-level integration.
• Clocking  Four PLLs support clock multiplication, division and phase adjustments for multi-clock designs.
• Power  Operates from a supply range of 1.14 V to 1.26 V, compatible with low-voltage system domains.
• Operating Range  Commercial grade operation from 0 °C to 85 °C.
• Compliance  RoHS compliant for environmental and regulatory conformance.
• Design Ecosystem  Part of the LatticeECP/EC device family supported by ispLEVER design tools and available ispLeverCORE IP to accelerate development.

Typical Applications

• Embedded Systems  Implement control logic, peripheral interfacing and protocol bridging where programmable logic and on‑chip memory reduce external components.
• Memory Interface and Buffering  Use the device’s on-chip RAM and PLLs to implement DDR interfaces, buffering and timing‑sensitive data paths.
• Communications and Networking  Provide interface conversion, framing and glue logic across multiple I/O standards using the device’s high I/O count and flexible logic fabric.
• Consumer and Commercial Electronics  Add configurable features, protocol support and I/O expansion in compact, cost-sensitive designs.

Unique Advantages

• Balanced Logic and Memory  A combination of 10,200 logic elements and ~0.283 Mbits of on‑chip RAM lets you implement integrated functions without extensive external SRAM.
• High I/O Density in a Compact Package  195 I/Os in a 17 × 17 mm 256‑FPBGA provide a space-efficient solution for pin‑intensive designs.
• Low‑Voltage Operation  Narrow 1.14–1.26 V supply range supports low-voltage system designs and standard 1.2 V domains.
• Commercial Temperature Rating  0 °C to 85 °C operation fits typical commercial product requirements without over-specifying for industrial temperature ranges.
• Tool and IP Support  Integration into the Lattice design flow (ispLEVER and ispLeverCORE IP) helps shorten development time and simplify implementation.
• Regulatory Compliance  RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose LFEC10E-3FN256C?

The LFEC10E-3FN256C offers a practical balance of logic density, on‑chip memory and I/O capacity in a compact fpBGA package, making it well suited for commercial embedded and system applications that demand flexible, programmable logic without excessive cost or board area. Its four PLLs, sizable logic resource and support within the Lattice design ecosystem make it a suitable choice for designers implementing memory interfaces, protocol conversion and system glue logic.

Choose this device when you need a commercially rated, RoHS‑compliant FPGA that integrates substantial logic and memory resources with a dense I/O footprint and established toolchain support for efficient development and deployment.

Request a quote or submit an inquiry to receive pricing, availability and support information for the LFEC10E-3FN256C.