LFEC15E-3F484C
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 352 358400 15400 484-BBGA |
|---|---|
| Quantity | 1,188 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 352 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 15400 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 358400 |
Overview of LFEC15E-3F484C – EC Field Programmable Gate Array (FPGA) IC 352 358400 15400 484-BBGA
The LFEC15E-3F484C is a Lattice EC family FPGA optimized to deliver mainstream FPGA features and low-cost integration for commercial applications. It combines a mid-range logic fabric with on-chip memory, flexible I/O and multi-PLL clocking to support system glue logic, high-density I/O interfacing and DDR memory support in cost-sensitive designs.
Key Features
- Logic Capacity — 15,400 logic elements providing a mid-range FPGA fabric for implementing control, glue logic and moderate complexity designs.
- Fabric Resources — 1,920 PFUs/PFFs as defined for this device family, enabling structured placement and routing for predictable design scaling.
- On-chip Memory — Approximately 358 Kbits of embedded RAM to support buffers, FIFOs and small local data storage.
- I/O Density and Flexibility — 352 user I/Os with programmable sysI/O buffer support for a wide range of interface standards as provided by the family (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL, RSDS).
- Clocking — Up to four analog PLLs per device for clock multiplication, division and phase shifting.
- Dedicated Memory Interface — Family-level support for dedicated DDR memory interfaces (up to DDR400) for systems requiring external DRAM.
- Package and Mounting — 484-ball BGA package (supplier package: 484-FPBGA, 23 × 23 mm) in a surface-mount form factor suitable for compact, high-I/O PCBs.
- Power and Temperature — Nominal supply range 1.14 V to 1.26 V; commercial operating temperature 0 °C to 85 °C.
- Standards and Tools — IEEE 1149.1 boundary-scan support and ispLEVER design tool ecosystem with pre-designed IP modules for accelerated development.
- Compliance — RoHS compliant.
Typical Applications
- System Glue Logic and Control: Implement interface bridging, protocol conversion and control logic where mid-range logic resources and many I/Os are required.
- Memory Interface Controllers: Use the device’s dedicated DDR memory support to implement DDR400-compatible interfaces for external DRAM subsystems.
- High-Density I/O Systems: Deploy in communications and embedded platforms that require dozens to hundreds of programmable I/Os for sensors, transceivers and peripheral interfaces.
- Cost-Sensitive Commercial Products: Integrate into products that prioritize mainstream FPGA functionality and low overall BOM cost within a commercial temperature range.
Unique Advantages
- Balanced Integration: A combination of ~15,400 logic elements and ~358 Kbits of on-chip RAM enables compact implementations without extensive external logic.
- High I/O Count in a Compact Package: 352 I/Os in a 484-ball BGA (23 × 23 mm) reduce board routing complexity while supporting dense system designs.
- Flexible Interface Support: Family-level programmable I/O options support a broad range of signaling standards to simplify multi-protocol designs.
- Clocking Versatility: Up to four PLLs provide on-device clock management for multi-domain systems and timing optimization.
- Design Ecosystem: Compatibility with ispLEVER tool flow and available ispLeverCORE IP helps accelerate development and reduce time-to-market.
- Regulatory and Assembly Ready: Surface-mount BGA packaging and RoHS compliance facilitate modern PCB assembly and regulatory conformity for commercial products.
Why Choose LFEC15E-3F484C?
The LFEC15E-3F484C occupies a practical midpoint between entry-level and high-end FPGAs, offering a balance of logic capacity, on-chip memory and extensive I/O in a compact BGA package. Its commercial-grade operating range and support for DDR interfaces and flexible I/O standards make it suitable for a wide range of mainstream, cost-sensitive embedded and communications applications.
Backed by the Lattice design ecosystem and family-level documentation, this device is a solid option for engineers seeking predictable resource scaling, multi-clock domain capability and reduced BOM complexity in production-focused designs.
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