LFEC15E-3F484I

The LFEC15E-3F484I is a Field Programmable Gate Array (FPGA) IC offering sizeable logic capacity and on-chip memory in a compact BGA package. With 15,400 logic elements, approximately 0.36 Mbits of embedded memory, and 352 I/O, it targets embedded and industrial applications that require reconfigurable logic, high I/O density, and operation across a broad temperature range.

Key Features

• Logic Capacity  15,400 logic elements provide the programmable fabric for custom logic, glue, and control functions.
• Embedded Memory  Approximately 0.36 Mbits of on-chip RAM (358,400 bits) for buffers, FIFOs, and small data stores.
• I/O Density  352 general-purpose I/O pins to support multiple peripherals, buses, and parallel interfaces.
• Power Supply  Operates from a supply voltage range of 1.14 V to 1.26 V to match targeted core-power domains.
• Package & Mounting  484-BBGA package case; supplier device package listed as 484-FPBGA (23×23). Surface-mount mounting type for compact PCB integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Used for programmable control logic, I/O aggregation, and protocol bridging where wide temperature operation and many I/Os are required.
• Embedded Systems  Implements custom data paths, peripheral interfaces, and system glue logic leveraging on-chip memory and abundant logic elements.
• Communications & Networking  Provides configurable I/O and logic resources for protocol handling, aggregation, and interface adaptation.

Unique Advantages

• High Logic Density: 15,400 logic elements enable integration of complex logic functions without external discrete gates.
• Substantial I/O Count: 352 I/Os reduce the need for external I/O expanders and simplify board-level connectivity.
• Embedded Memory on Chip: Approximately 0.36 Mbits of RAM supports buffering and small data storage close to logic for lower latency.
• Industrial Temperature Capability: −40 °C to 100 °C rating supports operation in demanding environments.
• Compact BGA Package: 484-ball BGA in a 23×23 supplier package enables high-density PCB designs while maintaining surface-mount assembly.
• RoHS Compliant: Meets environmental compliance requirements for modern electronics manufacturing.

Why Choose LFEC15E-3F484I?

The LFEC15E-3F484I balances programmable logic capacity, on-chip memory, and a high I/O count within a compact BGA package, making it well suited for embedded and industrial designs that need configurable hardware alongside robust environmental performance. Its narrow core voltage range and surface-mount 484-BBGA footprint support modern PCB power and layout practices.

This device is appropriate for design teams seeking a reconfigurable IC with verified industrial temperature operation, significant I/O capability, and RoHS compliance—offering integration and flexibility for medium-complexity system designs.

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