LFEC15E-3FN484I
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 352 358400 15400 484-BBGA |
|---|---|
| Quantity | 1,008 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 352 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 15400 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 358400 |
Overview of LFEC15E-3FN484I – EC Field Programmable Gate Array (FPGA) IC 352 358400 15400 484-BBGA
The LFEC15E-3FN484I is an industrial-grade EC FPGA from Lattice Semiconductor Corporation, delivered in a 484-ball BGA package (484-FPBGA, 23 × 23 mm) with surface-mount mounting. The device implements a mid-range LatticeECP/EC FPGA fabric that combines approximately 15,400 logic elements, around 0.36 Mbits of on-chip embedded memory, and a 352-pin I/O capacity to address designs that require substantial I/O, moderate logic density, and system-level integration.
With a 1.14 V to 1.26 V core supply window and an extended operating temperature range of −40 °C to 100 °C, this part is suited for industrial applications where stable power and thermal performance are required.
Key Features
- Core Logic Approximately 15,400 logic elements provide mid-range logic density for control, glue-logic, and protocol implementation within the LatticeECP/EC family architecture.
- Embedded Memory Approximately 358,400 bits (≈0.36 Mbits) of on-chip RAM to support frame buffers, FIFOs, and small data stores without external memory for many control and interface functions.
- I/O Capacity 352 user I/Os in a 484-ball FPBGA footprint enable broad external interfacing and parallel connectivity for peripherals, sensors, and high-pin-count buses.
- Power Core supply specified from 1.14 V to 1.26 V for regulated-power system designs.
- Clocking and Timing Family-level architecture includes multiple PLLs (4 PLLs indicated for the LFEC15 family) to support clock management, frequency synthesis, and phase alignment in system designs.
- System-Level Support LatticeECP/EC family features include IEEE 1149.1 boundary scan and SPI boot flash interface, providing standard board-level test and configuration options.
- Package & Mounting 484-BBGA (supplier: 484-FPBGA, 23 × 23 mm) with surface-mount mounting for high-density PCB designs.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, suitable for industrial-environment deployments.
- RoHS Compliant Manufactured to meet RoHS requirements for restricted substances.
Typical Applications
- Industrial Control & Automation Use the LFEC15E-3FN484I for logic-intensive control, sensor aggregation, and I/O-rich automation modules that require industrial temperature operation.
- Communications & Networking High I/O count and integrated clocking resources make this device suitable for protocol bridging, interface adaptation, and mid-range packet processing tasks.
- Embedded System Glue Logic Mid-range logic density and on-chip memory enable consolidation of glue logic, peripheral interfacing, and small buffering functions onto a single FPGA.
Unique Advantages
- Balanced Logic and I/O Density: Approximately 15,400 logic elements paired with 352 I/Os provides a practical balance for designs that need both compute and connectivity without moving to larger device families.
- On-Chip Memory for Compact Designs: Around 0.36 Mbits of embedded RAM reduces dependence on external SRAM for many control and buffering use cases, simplifying BOM and board layout.
- Industrial Temperature Range: Guaranteed operation from −40 °C to 100 °C supports deployment in harsher environments than commercial-grade components.
- Standard System Interfaces: Family-level support for IEEE 1149.1 boundary scan and SPI boot flash interface eases board bring-up, programming, and test integration.
- Design Ecosystem Support: The LatticeECP/EC family is supported by Lattice design flows and IP modules, enabling quicker development cycles and reuse of proven IP where applicable.
Why Choose LFEC15E-3FN484I?
The LFEC15E-3FN484I positions itself as a capable mid-range EC FPGA option for industrial system designers who require a combination of moderate logic resources, significant I/O capacity, and on-chip memory in a compact 484-ball BGA package. Its operating voltage window and industrial temperature rating make it appropriate for robust embedded applications where consistent power and thermal performance are important.
Backed by the LatticeECP/EC family architecture and design tool support, the LFEC15E-3FN484I is a practical choice for teams looking to consolidate interface logic, implement custom control functions, or prototype system-level FPGA implementations with accessible design resources and family-level scalability.
Request a quote or submit an inquiry to receive pricing and availability for the LFEC15E-3FN484I and to discuss how it fits into your next industrial or embedded FPGA design.