LFEC15E-3FN484I

IC FPGA 352 I/O 484FBGA
Part Description

EC Field Programmable Gate Array (FPGA) IC 352 358400 15400 484-BBGA

Quantity 1,008 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O352Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1920Number of Logic Elements/Cells15400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits358400

Overview of LFEC15E-3FN484I – EC Field Programmable Gate Array (FPGA) IC 352 358400 15400 484-BBGA

The LFEC15E-3FN484I is an industrial-grade EC FPGA from Lattice Semiconductor Corporation, delivered in a 484-ball BGA package (484-FPBGA, 23 × 23 mm) with surface-mount mounting. The device implements a mid-range LatticeECP/EC FPGA fabric that combines approximately 15,400 logic elements, around 0.36 Mbits of on-chip embedded memory, and a 352-pin I/O capacity to address designs that require substantial I/O, moderate logic density, and system-level integration.

With a 1.14 V to 1.26 V core supply window and an extended operating temperature range of −40 °C to 100 °C, this part is suited for industrial applications where stable power and thermal performance are required.

Key Features

  • Core Logic  Approximately 15,400 logic elements provide mid-range logic density for control, glue-logic, and protocol implementation within the LatticeECP/EC family architecture.
  • Embedded Memory  Approximately 358,400 bits (≈0.36 Mbits) of on-chip RAM to support frame buffers, FIFOs, and small data stores without external memory for many control and interface functions.
  • I/O Capacity  352 user I/Os in a 484-ball FPBGA footprint enable broad external interfacing and parallel connectivity for peripherals, sensors, and high-pin-count buses.
  • Power  Core supply specified from 1.14 V to 1.26 V for regulated-power system designs.
  • Clocking and Timing  Family-level architecture includes multiple PLLs (4 PLLs indicated for the LFEC15 family) to support clock management, frequency synthesis, and phase alignment in system designs.
  • System-Level Support  LatticeECP/EC family features include IEEE 1149.1 boundary scan and SPI boot flash interface, providing standard board-level test and configuration options.
  • Package & Mounting  484-BBGA (supplier: 484-FPBGA, 23 × 23 mm) with surface-mount mounting for high-density PCB designs.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial-environment deployments.
  • RoHS Compliant  Manufactured to meet RoHS requirements for restricted substances.

Typical Applications

  • Industrial Control & Automation  Use the LFEC15E-3FN484I for logic-intensive control, sensor aggregation, and I/O-rich automation modules that require industrial temperature operation.
  • Communications & Networking  High I/O count and integrated clocking resources make this device suitable for protocol bridging, interface adaptation, and mid-range packet processing tasks.
  • Embedded System Glue Logic  Mid-range logic density and on-chip memory enable consolidation of glue logic, peripheral interfacing, and small buffering functions onto a single FPGA.

Unique Advantages

  • Balanced Logic and I/O Density:  Approximately 15,400 logic elements paired with 352 I/Os provides a practical balance for designs that need both compute and connectivity without moving to larger device families.
  • On-Chip Memory for Compact Designs:  Around 0.36 Mbits of embedded RAM reduces dependence on external SRAM for many control and buffering use cases, simplifying BOM and board layout.
  • Industrial Temperature Range:  Guaranteed operation from −40 °C to 100 °C supports deployment in harsher environments than commercial-grade components.
  • Standard System Interfaces:  Family-level support for IEEE 1149.1 boundary scan and SPI boot flash interface eases board bring-up, programming, and test integration.
  • Design Ecosystem Support:  The LatticeECP/EC family is supported by Lattice design flows and IP modules, enabling quicker development cycles and reuse of proven IP where applicable.

Why Choose LFEC15E-3FN484I?

The LFEC15E-3FN484I positions itself as a capable mid-range EC FPGA option for industrial system designers who require a combination of moderate logic resources, significant I/O capacity, and on-chip memory in a compact 484-ball BGA package. Its operating voltage window and industrial temperature rating make it appropriate for robust embedded applications where consistent power and thermal performance are important.

Backed by the LatticeECP/EC family architecture and design tool support, the LFEC15E-3FN484I is a practical choice for teams looking to consolidate interface logic, implement custom control functions, or prototype system-level FPGA implementations with accessible design resources and family-level scalability.

Request a quote or submit an inquiry to receive pricing and availability for the LFEC15E-3FN484I and to discuss how it fits into your next industrial or embedded FPGA design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up