LFEC15E-4FN256C
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 195 358400 15400 256-BGA |
|---|---|
| Quantity | 1,529 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 195 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 15400 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 358400 |
Overview of LFEC15E-4FN256C – EC Field Programmable Gate Array (FPGA) IC, 195 I/O, ~358,400 bits RAM, 15,400 logic elements, 256-BGA
The LFEC15E-4FN256C is a commercial-grade EC family FPGA from Lattice Semiconductor Corporation, delivering a balanced mid-range logic capacity and flexible I/O in a compact 256-ball fpBGA package. Built on the LatticeECP/EC family architecture, it targets mainstream embedded designs that require moderate logic density, embedded memory, and a broad set of I/O options.
This device combines 15,400 logic elements with approximately 358,400 bits of on-chip RAM and 195 user I/Os, providing a practical platform for applications that need integration and interface flexibility within a surface-mount 256-FPBGA (17 × 17 mm) footprint.
Key Features
- Logic Capacity 15,400 logic elements suitable for mid-range designs requiring balanced logic resources.
- Embedded Memory Approximately 358,400 bits of on-chip RAM, supporting both distributed and block memory configurations for data buffering and state storage.
- I/O and Package 195 user I/Os in a 256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package for dense, board-level integration.
- Power Supply Core voltage range 1.14 V to 1.26 V (nominal 1.2 V) to match modern FPGA power requirements.
- Clocking Four PLLs available for clock multiplication, division and phase shifting to support complex clocking schemes.
- Flexible I/O Standards Family-level support includes a wide range of interfaces and standards (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and others), enabling compatibility with common system buses and signaling requirements.
- System Integration Support for IEEE 1149.1 boundary scan and SPI boot flash interface, plus internal debug capabilities referenced for the family to assist system bring-up and development.
- Operating Conditions Commercial grade device rated for 0 °C to 85 °C operation and designed for surface-mount assembly.
- Compact, Low-Cost Targeting Part of the LatticeECP/EC family designed to provide mainstream FPGA features in space- and cost-constrained designs.
Typical Applications
- Embedded Systems Integration of control logic and custom interfaces where moderate logic capacity and on-chip memory simplify board design.
- Communications and Networking Protocol adaptation, packet processing staging, and interface bridging utilizing flexible I/O and on-chip RAM.
- Industrial and Automation Control Machine control and sensor interface tasks that benefit from programmable logic, multiple I/Os, and deterministic hardware behavior.
- Prototyping and Product Development Mid-range FPGA resource set that supports design validation, IP integration and iterative development workflows.
Unique Advantages
- Balanced Resource Mix: Combines 15,400 logic elements with substantial on-chip RAM to support logic-intensive control and buffering without external memory in many designs.
- High I/O Density in a Compact Package: 195 I/Os in a 256-FPBGA (17 × 17 mm) package reduce board area while maintaining interface flexibility.
- Flexible Clock and Interface Support: Four PLLs and broad family-level I/O standard support enable diverse clocking schemes and signal interoperability.
- Designed for Mainstream Applications: LatticeECP/EC family positioning provides cost-conscious feature integration for embedded and networking applications.
- Development Ecosystem: Family-level design tools and IP (referenced for LatticeECP/EC series) streamline implementation and speed time to market.
- Commercial Temperature Rating: Specified for 0 °C to 85 °C operation to match typical commercial embedded deployments.
Why Choose LFEC15E-4FN256C?
The LFEC15E-4FN256C is positioned for designers who need a compact, commercially rated FPGA with mid-range logic capacity, practical on-chip memory, and a wide set of I/Os in a 256-ball fpBGA footprint. Its balance of logic elements, embedded RAM, and clocking resources supports a broad set of mainstream embedded tasks while keeping board area and BOM complexity low.
This device is well suited for development teams and product engineers looking for an established family platform with available design tools and IP to accelerate implementation, scale across similar densities, and deliver robust, scalable solutions for communications, industrial, and embedded markets.
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