LFEC15E-4FN256C

IC FPGA 195 I/O 256FBGA
Part Description

EC Field Programmable Gate Array (FPGA) IC 195 358400 15400 256-BGA

Quantity 1,529 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O195Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1920Number of Logic Elements/Cells15400
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits358400

Overview of LFEC15E-4FN256C – EC Field Programmable Gate Array (FPGA) IC, 195 I/O, ~358,400 bits RAM, 15,400 logic elements, 256-BGA

The LFEC15E-4FN256C is a commercial-grade EC family FPGA from Lattice Semiconductor Corporation, delivering a balanced mid-range logic capacity and flexible I/O in a compact 256-ball fpBGA package. Built on the LatticeECP/EC family architecture, it targets mainstream embedded designs that require moderate logic density, embedded memory, and a broad set of I/O options.

This device combines 15,400 logic elements with approximately 358,400 bits of on-chip RAM and 195 user I/Os, providing a practical platform for applications that need integration and interface flexibility within a surface-mount 256-FPBGA (17 × 17 mm) footprint.

Key Features

  • Logic Capacity  15,400 logic elements suitable for mid-range designs requiring balanced logic resources.
  • Embedded Memory  Approximately 358,400 bits of on-chip RAM, supporting both distributed and block memory configurations for data buffering and state storage.
  • I/O and Package  195 user I/Os in a 256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package for dense, board-level integration.
  • Power Supply  Core voltage range 1.14 V to 1.26 V (nominal 1.2 V) to match modern FPGA power requirements.
  • Clocking  Four PLLs available for clock multiplication, division and phase shifting to support complex clocking schemes.
  • Flexible I/O Standards  Family-level support includes a wide range of interfaces and standards (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and others), enabling compatibility with common system buses and signaling requirements.
  • System Integration  Support for IEEE 1149.1 boundary scan and SPI boot flash interface, plus internal debug capabilities referenced for the family to assist system bring-up and development.
  • Operating Conditions  Commercial grade device rated for 0 °C to 85 °C operation and designed for surface-mount assembly.
  • Compact, Low-Cost Targeting  Part of the LatticeECP/EC family designed to provide mainstream FPGA features in space- and cost-constrained designs.

Typical Applications

  • Embedded Systems  Integration of control logic and custom interfaces where moderate logic capacity and on-chip memory simplify board design.
  • Communications and Networking  Protocol adaptation, packet processing staging, and interface bridging utilizing flexible I/O and on-chip RAM.
  • Industrial and Automation Control  Machine control and sensor interface tasks that benefit from programmable logic, multiple I/Os, and deterministic hardware behavior.
  • Prototyping and Product Development  Mid-range FPGA resource set that supports design validation, IP integration and iterative development workflows.

Unique Advantages

  • Balanced Resource Mix: Combines 15,400 logic elements with substantial on-chip RAM to support logic-intensive control and buffering without external memory in many designs.
  • High I/O Density in a Compact Package: 195 I/Os in a 256-FPBGA (17 × 17 mm) package reduce board area while maintaining interface flexibility.
  • Flexible Clock and Interface Support: Four PLLs and broad family-level I/O standard support enable diverse clocking schemes and signal interoperability.
  • Designed for Mainstream Applications: LatticeECP/EC family positioning provides cost-conscious feature integration for embedded and networking applications.
  • Development Ecosystem: Family-level design tools and IP (referenced for LatticeECP/EC series) streamline implementation and speed time to market.
  • Commercial Temperature Rating: Specified for 0 °C to 85 °C operation to match typical commercial embedded deployments.

Why Choose LFEC15E-4FN256C?

The LFEC15E-4FN256C is positioned for designers who need a compact, commercially rated FPGA with mid-range logic capacity, practical on-chip memory, and a wide set of I/Os in a 256-ball fpBGA footprint. Its balance of logic elements, embedded RAM, and clocking resources supports a broad set of mainstream embedded tasks while keeping board area and BOM complexity low.

This device is well suited for development teams and product engineers looking for an established family platform with available design tools and IP to accelerate implementation, scale across similar densities, and deliver robust, scalable solutions for communications, industrial, and embedded markets.

Request a quote or submit an inquiry to discuss availability, pricing, and lead times for LFEC15E-4FN256C. Our team can help match the device to your design requirements and volume needs.

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