LFEC15E-4FN484C

IC FPGA 352 I/O 484FBGA
Part Description

EC Field Programmable Gate Array (FPGA) IC 352 358400 15400 484-BBGA

Quantity 1,180 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O352Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1920Number of Logic Elements/Cells15400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits358400

Overview of LFEC15E-4FN484C – EC Field Programmable Gate Array (FPGA) IC 352 358400 15400 484-BBGA

The LFEC15E-4FN484C is a commercial-grade EC FPGA from Lattice Semiconductor designed for mainstream programmable-logic applications. It delivers a balanced combination of logic capacity, on-chip memory and I/O density in a 484-ball BGA package for compact, surface-mount implementations.

This device is suited to designs requiring approximately 15,400 logic elements, roughly 358,400 bits of embedded memory, and up to 352 general-purpose I/Os — enabling complex glue logic, interface bridging and memory-interfacing functions in cost-sensitive systems.

Key Features

  • Logic Capacity Approximately 15,400 logic elements provide a mid-range fabric for implementing combinational and sequential logic, state machines and glue logic.
  • Embedded Memory Approximately 358,400 bits (≈350 Kbits) of on-chip RAM for block and distributed memory needs within user designs.
  • I/O Density & Flexibility Up to 352 I/Os with programmable sysI/O buffer support for a wide range of interface standards (including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS).
  • Dedicated DDR Support Implements interfaces up to DDR400 (200 MHz) to support external high-speed memory subsystems.
  • Clocking Up to four analog PLLs for clock multiplication, division and phase shifting to simplify timing and clock-domain management.
  • System-Level Features IEEE 1149.1 boundary-scan support and ispTRACY internal logic analyzer capability for testability and in-system debug.
  • Power and Operating Range Core supply range 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C, enabling designs targeting 1.2 V core systems in commercial environments.
  • Package & Mounting 484-ball FPBGA (23 × 23 mm) surface-mount package for high I/O count in a compact footprint.
  • Compliance RoHS compliant.

Typical Applications

  • Embedded Systems Implements control logic, protocol conversion and custom peripherals where mid-range logic and on-chip memory are required.
  • Memory Interface Bridges Use as a DDR interface controller or translator leveraging the dedicated DDR support and high I/O count.
  • Communications and Networking Suitable for packet handling, interface aggregation and glue logic that require many I/Os and flexible signaling standards.
  • Consumer and Industrial Electronics Integrates custom logic and peripheral interfaces in compact designs benefiting from the 484-BBGA package and commercial temperature rating.

Unique Advantages

  • Balanced Logic and Memory A mid-range logic element count paired with approximately 358 Kbits of embedded memory supports programmable designs without external RAM for many use cases.
  • High I/O Count 352 I/Os in a 484-ball package provide the pin density needed for multi-interface designs and parallel buses.
  • Flexible I/O Standards Programmable I/O buffers accommodate many signaling families, reducing the need for interface translators and simplifying BOM.
  • Integrated Clock Management Multiple PLLs enable flexible clocking schemes for multi-domain designs and high-speed interface timing.
  • Design and Debug Support Built-in boundary-scan and internal logic analysis capabilities simplify bring-up and in-system debug.
  • Compact, Surface-Mount Package The 484-FPBGA (23×23 mm) package delivers high I/O density in a compact form factor for space-constrained boards.

Why Choose LFEC15E-4FN484C?

The LFEC15E-4FN484C positions itself as a versatile, mid-density EC FPGA for mainstream applications where a balance of logic resources, embedded memory and I/O count is required. With approximately 15,400 logic elements, ~358 Kbits of embedded RAM, up to 352 I/Os and integrated clocking and system-level features, it fits a wide range of embedded, communications and consumer designs that target a commercial temperature range.

Designers benefit from Lattice’s ecosystem and tool support for the ECP/EC family, enabling efficient implementation, debugging and migration across densities when project requirements evolve.

Request a quote or submit a purchasing inquiry to receive pricing and availability details for the LFEC15E-4FN484C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up