LFEC15E-4FN484C
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 352 358400 15400 484-BBGA |
|---|---|
| Quantity | 1,180 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 352 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1920 | Number of Logic Elements/Cells | 15400 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 358400 |
Overview of LFEC15E-4FN484C – EC Field Programmable Gate Array (FPGA) IC 352 358400 15400 484-BBGA
The LFEC15E-4FN484C is a commercial-grade EC FPGA from Lattice Semiconductor designed for mainstream programmable-logic applications. It delivers a balanced combination of logic capacity, on-chip memory and I/O density in a 484-ball BGA package for compact, surface-mount implementations.
This device is suited to designs requiring approximately 15,400 logic elements, roughly 358,400 bits of embedded memory, and up to 352 general-purpose I/Os — enabling complex glue logic, interface bridging and memory-interfacing functions in cost-sensitive systems.
Key Features
- Logic Capacity Approximately 15,400 logic elements provide a mid-range fabric for implementing combinational and sequential logic, state machines and glue logic.
- Embedded Memory Approximately 358,400 bits (≈350 Kbits) of on-chip RAM for block and distributed memory needs within user designs.
- I/O Density & Flexibility Up to 352 I/Os with programmable sysI/O buffer support for a wide range of interface standards (including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS).
- Dedicated DDR Support Implements interfaces up to DDR400 (200 MHz) to support external high-speed memory subsystems.
- Clocking Up to four analog PLLs for clock multiplication, division and phase shifting to simplify timing and clock-domain management.
- System-Level Features IEEE 1149.1 boundary-scan support and ispTRACY internal logic analyzer capability for testability and in-system debug.
- Power and Operating Range Core supply range 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C, enabling designs targeting 1.2 V core systems in commercial environments.
- Package & Mounting 484-ball FPBGA (23 × 23 mm) surface-mount package for high I/O count in a compact footprint.
- Compliance RoHS compliant.
Typical Applications
- Embedded Systems Implements control logic, protocol conversion and custom peripherals where mid-range logic and on-chip memory are required.
- Memory Interface Bridges Use as a DDR interface controller or translator leveraging the dedicated DDR support and high I/O count.
- Communications and Networking Suitable for packet handling, interface aggregation and glue logic that require many I/Os and flexible signaling standards.
- Consumer and Industrial Electronics Integrates custom logic and peripheral interfaces in compact designs benefiting from the 484-BBGA package and commercial temperature rating.
Unique Advantages
- Balanced Logic and Memory A mid-range logic element count paired with approximately 358 Kbits of embedded memory supports programmable designs without external RAM for many use cases.
- High I/O Count 352 I/Os in a 484-ball package provide the pin density needed for multi-interface designs and parallel buses.
- Flexible I/O Standards Programmable I/O buffers accommodate many signaling families, reducing the need for interface translators and simplifying BOM.
- Integrated Clock Management Multiple PLLs enable flexible clocking schemes for multi-domain designs and high-speed interface timing.
- Design and Debug Support Built-in boundary-scan and internal logic analysis capabilities simplify bring-up and in-system debug.
- Compact, Surface-Mount Package The 484-FPBGA (23×23 mm) package delivers high I/O density in a compact form factor for space-constrained boards.
Why Choose LFEC15E-4FN484C?
The LFEC15E-4FN484C positions itself as a versatile, mid-density EC FPGA for mainstream applications where a balance of logic resources, embedded memory and I/O count is required. With approximately 15,400 logic elements, ~358 Kbits of embedded RAM, up to 352 I/Os and integrated clocking and system-level features, it fits a wide range of embedded, communications and consumer designs that target a commercial temperature range.
Designers benefit from Lattice’s ecosystem and tool support for the ECP/EC family, enabling efficient implementation, debugging and migration across densities when project requirements evolve.
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