LFEC15E-3FN484C

The LFEC15E-3FN484C is a Field Programmable Gate Array (FPGA) from Lattice Semiconductor designed for mainstream, cost-sensitive applications. It combines a dense FPGA fabric with on-chip memory and a high I/O count to support complex glue-logic, interface bridging and system control functions in commercial-temperature designs.

As part of the LatticeECP/EC family, the device delivers programmable logic, embedded memory and system connectivity while supporting standard FPGA tool flows and system-level features intended to simplify board-level integration.

Key Features

• Logic Capacity  15,400 logic elements (cells) to implement medium-complexity control, glue logic and datapath functions.
• On-chip Memory  Total on-chip RAM of 358,400 bits (approximately 0.36 Mbits) for FIFOs, buffering and small embedded data structures.
• I/O Density and Flexibility  352 user I/Os and a programmable sysI/O™ buffer supporting a wide range of standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI and various differential interfaces (LVDS, Bus‑LVDS, LVPECL, RSDS).
• Clocking  Up to four analog PLLs per device for clock multiplication, division and phase shifting to manage multiple clock domains.
• Memory Interface Support  Family-level support for dedicated DDR interfaces (implementation up to DDR400) for systems requiring external synchronous DRAM.
• System-Level Features  IEEE 1149.1 boundary-scan, ispTRACY internal logic analyzer capability and an SPI boot/flash interface for standard system debug and boot flows.
• Power and Supply  Operates from a core supply range of 1.14 V to 1.26 V (nominal 1.2 V).
• Package and Mounting  484-ball BBGA package (supplier device package: 484-FPBGA, 23 × 23 mm) intended for surface-mount board assembly.
• Grade and Environmental  Commercial-grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant.

Typical Applications

• Consumer and Embedded Systems  Implement control logic, user interfaces and peripheral bridging where moderate logic density and on-chip memory reduce external component count.
• Communications and Networking  High I/O count and flexible I/O standards enable protocol bridging, packet buffering and interface aggregation tasks.
• Security and Storage Interfaces  On-chip RAM and multiple PLLs support buffering and multi-clock-domain designs for secure boot and data-path control.
• Prototyping and Low-Cost Production  Fabric capacity and package options make the device suitable for cost-sensitive prototypes and production designs that require scalable logic and I/O resources.

Unique Advantages

• Balanced Logic and Memory  15,400 logic elements combined with ~0.36 Mbits of on-chip RAM provide a capable platform for mixed control and datapath implementations without excessive external memory.
• High I/O Count  352 I/Os give designers headroom for multiple interfaces, parallel buses and high-density connector implementations.
• Flexible I/O Standards  Programmable I/O buffers support a broad set of single‑ended and differential standards, simplifying mixed-signal board designs.
• System Integration Features  Boundary-scan, SPI boot and internal trace capabilities reduce debug and bring-up time during development and manufacturing.
• Compact Surface-Mount Package  484-ball BBGA (23 × 23 mm) enables a compact board footprint while retaining a large I/O count and signal density.
• Commercial-Temperature Operation  Rated for 0 °C to 85 °C to meet typical commercial application requirements.

Why Choose LFEC15E-3FN484C?

LFEC15E-3FN484C is positioned for designers seeking a cost-conscious FPGA with a balanced mix of logic capacity, on-chip RAM and high I/O density. Its package, supply range and system-level features suit mainstream embedded designs that require flexible interfacing and on-board data buffering.

The device benefits from the LatticeECP/EC family feature set—programmable I/O, multiple PLLs, boundary-scan and SPI boot support—offering a practical combination of integration and design support for commercial applications. Choose this part for scalable designs where predictable logic resources, memory and I/O simplify BOM and board-level integration.

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