LFEC6E-3T144I

The LFEC6E-3T144I is a member of the LatticeECP/EC family of Field Programmable Gate Arrays. It delivers approximately 6,100 logic elements with 97 general-purpose I/Os and roughly 94,208 bits of on-chip RAM in a 144-pin LQFP package, targeting industrial-grade embedded designs.

Designed for mainstream FPGA uses, the device combines programmable logic density, flexible I/O, and system-level features from the LatticeECP/EC family to address industrial control, communications and general embedded applications that require compact, low-voltage FPGA integration.

Key Features

• Core Density — Approximately 6,100 logic elements provide mid-range programmable logic capacity for control, glue logic and moderate-complexity processing tasks.
• On-chip RAM — Total on-chip RAM of 94,208 bits offers distributed and embedded memory resources for buffering, FIFOs and small data stores.
• I/O and Package — 97 I/Os in a 144-LQFP package (supplier device package: 144-TQFP, 20×20 mm) enable numerous peripheral and bus connections in a compact footprint.
• Power Supply — Operates from a supply range of 1.14 V to 1.26 V, accommodating low-voltage system designs.
• Industrial Temperature Range — Rated for operation from -40 °C to 100 °C for deployment in industrial environments.
• Flexible I/O Standards (Family Feature) — LatticeECP/EC family supports a wide range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and RSDS for diverse system integrations.
• Clocking and Timing (Family Feature) — Family devices can include up to four analog PLLs for clock multiplication, division and phase shifting to support complex timing requirements.
• System-Level Support (Family Feature) — Family capabilities include IEEE 1149.1 boundary scan, SPI boot flash interface and internal logic-analysis support (ispTRACY™) for in-system debugging and boot flexibility.
• RoHS Compliant — Device is compliant with RoHS environmental requirements.

Typical Applications

• Industrial Control — Use for machine control logic, protocol bridging and I/O aggregation where industrial temperature range and moderate logic density are required.
• Embedded Communication Interfaces — Implement custom interface logic and protocol translation leveraging the device's flexible I/O standards and 97 I/Os.
• Instrumentation and Test — Fit for mid-complexity data acquisition, filtering and control functions that benefit from on-chip RAM and programmable logic.
• Cost-Sensitive Embedded Systems — Compact 144-pin package and LatticeECP/EC family features make the device suitable for space-constrained, low-cost designs.

Unique Advantages

• Balanced Logic and Memory — Around 6,100 logic elements with ~94 Kbits of on-chip RAM provide a practical balance for control and data buffering in a single device.
• High I/O Count in a Compact Package — 97 I/Os in a 144-LQFP (144-TQFP, 20×20 mm) package reduce board area while supporting multiple external interfaces.
• Industrial Temperature Range — Specified -40 °C to 100 °C operation supports deployment in demanding environmental conditions.
• Low-Voltage Operation — Narrow supply window (1.14–1.26 V) for integration into low-voltage system rails.
• Family-Level System Tools and IP — Access to LatticeECP/EC family design tools and pre-built IP (ispLEVER/ispLeverCORE) helps accelerate development and reduces time-to-market.
• Boot and Debug Support — SPI boot flash interface and internal logic-analysis capabilities from the LatticeECP/EC family simplify development, test and field updates.

Why Choose LFEC6E-3T144I?

The LFEC6E-3T144I positions itself as a compact, industrial-grade FPGA option within the LatticeECP/EC family, offering a practical combination of logic density, on-chip RAM and a high I/O count for embedded systems. Its thermal range and low-voltage operation make it suitable for industrial and space-constrained designs that require reliable programmable logic.

Designers benefit from family-level ecosystem support—tooling and IP blocks that streamline implementation—while the device’s system-level features (boot interface, boundary scan and PLLs) provide the integration and debug capabilities needed for production-ready designs.

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