LFEC6E-3Q208I

The LFEC6E-3Q208I is an industrial-grade Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It provides a mid-range logic capacity with 6,100 logic elements, 94,208 bits of on-chip RAM, and 147 user I/O in a 208-BFQFP surface-mount package.

Designed for embedded and industrial applications that require moderate logic density, substantial I/O and compact packaging, this device operates from a low-voltage supply of 1.14 V to 1.26 V and across an operating temperature range of −40°C to 100°C.

Key Features

• Logic Capacity 6,100 logic elements provide resources for glue logic, control state machines, and mid-level programmable functions.
• Embedded Memory 94,208 total RAM bits (approximately 0.094 Mbits) on-chip for buffering, small FIFOs and register storage without external memory.
• I/O Density 147 user I/O pins to support multiple interfaces and parallel connections in I/O-heavy designs.
• Package and Mounting 208-BFQFP surface-mount package; supplier device package listed as 208-PQFP (28×28) for PCB footprint planning.
• Power Low-voltage operation with a supply range of 1.14 V to 1.26 V to support modern low-voltage systems.
• Industrial Temperature Grade Rated for operation from −40°C to 100°C, suitable for deployments in industrial environments.
• RoHS Compliant Meets RoHS requirements for lead-free manufacturing and regulatory compliance.

Typical Applications

• Industrial Control Implement control logic, I/O aggregation and protocol translation in factory automation and process-control equipment.
• Embedded Systems Provide programmable glue logic, state machines and on-chip buffering for compact embedded platforms.
• Sensor and Actuator Interfaces Aggregate and condition multiple sensor inputs and drive actuator control with available I/O and embedded RAM.
• Prototyping and Development Use as a mid-density FPGA for proof-of-concept designs where moderate logic resources and many I/Os are required.

Unique Advantages

• Balanced Logic and Memory: 6,100 logic elements combined with 94,208 bits of on-chip RAM enable practical integration of control logic and buffering without external memory.
• High I/O Count in a Compact Package: 147 I/O pins in a 208-BFQFP package allow dense external connectivity while maintaining a compact PCB footprint.
• Low-Voltage Operation: Narrow supply range of 1.14 V to 1.26 V supports integration into modern low-voltage power domains.
• Industrial Temperature Range: Rated from −40°C to 100°C for use in temperature-demanding industrial environments.
• Surface-Mount Packaging: 208-BFQFP surface-mount construction simplifies assembly for high-volume or automated production.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing requirements.

Why Choose LFEC6E-3Q208I?

The LFEC6E-3Q208I is positioned for designers who need a mid-density FPGA with broad I/O capability and on-chip memory in an industrial-grade, surface-mount package. Its combination of 6,100 logic elements, substantial on-chip RAM and 147 I/O pins makes it well suited to embedded control, I/O aggregation and interface-centric designs that must operate over a wide temperature range.

Backed by Lattice Semiconductor Corporation, this device offers a straightforward option for projects that require reliable operation, compact packaging and low-voltage operation, enabling streamlined BOMs and predictable board-level integration.

Request a quote or submit an inquiry today to get pricing and availability for the LFEC6E-3Q208I.