LFEC6E-3FN484I

The LFEC6E-3FN484I is an EC-series Field Programmable Gate Array (FPGA) offered in a 484-ball BGA package and designed for mainstream, cost-conscious FPGA applications. This device combines a LUT-based FPGA fabric with on-chip RAM and flexible I/O to support a wide range of embedded designs.

Key positioning for this device includes compact, high-density I/O (224 I/Os), approximately 6,100 logic elements, and roughly 94 Kbits of total on-chip RAM, making it suitable for industrial-grade applications that require a programmable, integrated logic element.

Key Features

• Logic Fabric  Approximately 6,100 logic elements provide the programmable logic capacity for custom digital functions and control logic.
• On‑chip Memory  Approximately 94 Kbits of total RAM integrated on-chip to support distributed and block memory use within designs.
• I/O Density & Flexibility  224 user I/Os in a 484-ball package enable substantial external interfacing; the family datasheet documents support for a wide range of interface standards.
• Package & Mounting  484-BBGA, surface-mount package (supplier device package: 484-FPBGA, 23 × 23 mm) for compact board-level integration.
• Power  Operates from a supply range of 1.14 V to 1.26 V, compatible with low-voltage FPGA power domains and system requirements.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for reliable performance in industrial environments.
• Design Tools & IP Support  Part of the Lattice ECP/EC family, supported by the ispLEVER design tool suite and pre-designed IP modules referenced in the family datasheet to accelerate development.

Typical Applications

• Industrial Control  Industrial-grade operating range and dense I/O make this FPGA suitable for programmable control, sensor aggregation, and machine interface logic.
• Embedded Systems  On-chip memory and a flexible logic fabric enable custom embedded functions, protocol bridging, and application-specific peripherals.
• High‑I/O Connectivity  224 I/Os support boards that require multiple parallel interfaces or mixed-signal peripheral connections in compact form factors.
• Cost‑sensitive Mainstream Designs  Positioned for mainstream applications that need programmable logic with balanced capacity and integration at lower system cost.

Unique Advantages

• Balanced Logic Capacity: Approximately 6,100 logic elements provide a practical capacity for mid-range FPGA designs without excessive overhead.
• Compact, High‑Density I/O: 224 I/Os in a 484-BBGA package allow dense external connectivity while maintaining a compact board footprint.
• Embedded Memory Onboard: Roughly 94 Kbits of on-chip RAM simplifies memory needs for control functions and small buffering tasks, reducing external component count.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, the device meets environmental expectations for many industrial deployments.
• Low‑Voltage Operation: Narrow supply range (1.14 V–1.26 V) aligns with modern low-voltage system rails for efficient power design.
• Development Ecosystem: Family-level support with ispLEVER tools and pre-built IP modules helps accelerate bring-up and reduce development time.

Why Choose LFEC6E-3FN484I?

The LFEC6E-3FN484I delivers a practical mix of programmable logic, on-chip memory, and high I/O density in a compact 484-BBGA package. Its industrial temperature rating and low-voltage operation make it a fit for embedded and control applications that require reliable, flexible logic integration without excessive cost or board area.

Engineers seeking a mid-range FPGA solution for cost-sensitive, mainstream designs will find this device provides scalable logic capacity, substantial I/O, and the development support of the Lattice ECP/EC family to help shorten design cycles and simplify system integration.

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