LFEC6E-3F484I

IC FPGA 224 I/O 484FBGA
Part Description

EC Field Programmable Gate Array (FPGA) IC 224 94208 6100 484-BBGA

Quantity 717 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O224Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs768Number of Logic Elements/Cells6100
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LFEC6E-3F484I – EC Field Programmable Gate Array (FPGA) IC 224 94208 6100 484-BBGA

The LFEC6E-3F484I is an EC Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation provided in a 484-BBGA package. This surface-mount, industrial-grade device combines 6,100 logic elements, 224 general-purpose I/O pins and approximately 0.09 Mbits of embedded RAM to support programmable logic functions in temperature-demanding applications.

With a core supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, the LFEC6E-3F484I is specified for designs that require stable operation across extended temperature ranges and a compact, high-pin-count BGA footprint.

Key Features

  • Logic Capacity  6,100 logic elements provide a mid-range programmable fabric for implementing custom digital functions and state machines.
  • Embedded Memory  Approximately 0.09 Mbits (94,208 total RAM bits) of on-chip RAM for buffering, small lookup tables, and temporary storage.
  • I/O Density  224 I/O pins support multiple external interfaces and peripheral connections from a single device.
  • Power Supply  Core voltage specified between 1.14 V and 1.26 V to match required supply domains in the target system.
  • Package & Mounting  484-BBGA package (supplier package: 484-FPBGA, 23×23) optimized for surface-mount PCB assembly and higher I/O density in a compact footprint.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in environments with extended temperature requirements.
  • RoHS Compliant  Device complies with RoHS environmental requirements.

Typical Applications

  • Industrial Control  Use the LFEC6E-3F484I where industrial-grade temperature range and programmable logic are needed for control, I/O aggregation, or protocol adaptation.
  • Embedded Systems  Integrate programmable logic and on-chip RAM for custom processing tasks, glue logic, and peripheral interfacing in compact embedded designs.
  • Interface Bridging  Leverage the 224 I/O pins to implement board-level protocol converters, signal multiplexing, or custom interface logic.
  • Prototyping and Custom Logic  Employ the device’s logic elements and RAM for rapid hardware prototyping or to validate custom digital functions before production scaling.

Unique Advantages

  • Balanced Logic and Memory:  6,100 logic elements paired with 94,208 RAM bits provide a practical balance for mid-complexity programmable designs without excessive overcapacity.
  • High I/O Count in a Compact Package:  224 I/O pins in a 484-BBGA (23×23) package enable dense connectivity while maintaining a small PCB footprint.
  • Industrial-Grade Temperature Range:  Specified operation from −40 °C to 100 °C supports deployments where wider thermal tolerance is required.
  • Surface-Mount Convenience:  Standard surface-mount BBGA packaging simplifies automated assembly and yields a reliable board-level connection.
  • Low-Voltage Core:  Core voltage range of 1.14 V to 1.26 V accommodates power-sensitive designs and modern supply domains.
  • Environmentally Compliant:  RoHS compliance supports regulatory requirements for reduced hazardous substances.

Why Choose LFEC6E-3F484I?

The LFEC6E-3F484I positions itself as a mid-range, industrial-grade FPGA offering a pragmatic combination of logic resources, embedded memory, and high I/O count in a compact 484-BBGA package. Its specified voltage range and extended operating temperature make it suitable for designs that require reliable programmable logic in thermally demanding environments.

Engineers and procurement teams seeking a surface-mount, RoHS-compliant FPGA from Lattice Semiconductor Corporation will find the LFEC6E-3F484I appropriate for embedded prototypes, control systems, and interface-centric applications where a balance of logic capacity and I/O density matters.

Request a quote or submit a procurement inquiry for the LFEC6E-3F484I to receive pricing and availability information tailored to your project needs.

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