LFEC6E-3F256I

The LFEC6E-3F256I is an EC family Field Programmable Gate Array (FPGA) device from Lattice Semiconductor designed for general-purpose, mainstream FPGA applications. It provides a balance of logic capacity, embedded memory and flexible I/O in a compact 256-ball fpBGA (17 × 17 mm) package.

This device is suitable for designs requiring up to 195 I/Os, approximately 92 Kbits of on-chip RAM, and industrial-grade operating range, while operating from a nominal 1.2 V supply window.

Key Features

• Logic Capacity — 6,100 logic elements (cells) and 768 CLBs provide a mid-range logic resource set for control, glue-logic and subsystem implementation.
• Embedded Memory — Approximately 92 Kbits (94,208 bits) of total on-chip RAM for distributed and block memory requirements.
• I/O Flexibility — 195 I/O pins in the 256-ball fpBGA package enable broad interfacing options to peripherals and external devices.
• Package and Mounting — 256-FPBGA (17 × 17 mm) surface-mount package offers a compact footprint for space-constrained boards.
• Power — Supported supply voltage range of 1.14 V to 1.26 V (nominal 1.2 V) for core operation.
• Temperature and Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for extended-environment deployments.
• Standards and Compliance — RoHS compliant.
• Family-Level System Support — As part of the LatticeECP/EC family, the device benefits from family features such as flexible I/O buffer support, PLL-based clocking, and dedicated DDR memory-interface support at the family level (per LatticeECP/EC documentation).

Typical Applications

• Industrial Control — Implement control logic, sensor aggregation and interface bridging where industrial temperature range and a moderate number of I/Os are required.
• Embedded Systems — Provide glue logic, peripheral interface and custom sequencing in compact embedded platforms using the 256-ball fpBGA footprint.
• Communication and Networking Subsystems — Support protocol adaptation, I/O aggregation and memory buffering functions enabled by the device’s I/O count and on-chip RAM.

Unique Advantages

• Balanced Mid-Range Resources: 6,100 logic elements and 768 CLBs supply sufficient capacity for control and subsystem tasks without excessive resource overhead.
• Compact, High-I/O Package: 256-ball fpBGA (17 × 17 mm) delivers up to 195 I/Os in a small board area to simplify board-level routing and layout.
• Embedded Memory Ready: Approximately 92 Kbits of on-chip RAM supports buffering, small data structures and local storage without external memory in many use cases.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation to meet extended-environment requirements.
• Defined Core Supply Window: 1.14 V to 1.26 V supply range aligns with the family’s 1.2 V power architecture for consistent power design.
• RoHS Compliant: Meets regulatory requirements for lead-free manufacturing and materials handling.

Why Choose LFEC6E-3F256I?

The LFEC6E-3F256I occupies a practical middle ground for designers seeking a compact FPGA with meaningful logic capacity, on-chip memory and a large I/O count in a 256-ball fpBGA package. With industrial-grade temperature capability and a defined core voltage range, it is well-suited for embedded and control-oriented applications that must operate reliably across extended environments.

As a member of the LatticeECP/EC family, this device aligns with established family-level features for flexible I/O buffering and system-level interfaces, offering a straightforward migration path within the family for projects that may scale in capacity or interface complexity.

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