LFEC3E-5T144C
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 97 56320 3100 144-LQFP |
|---|---|
| Quantity | 1,604 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 97 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 3100 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 56320 |
Overview of LFEC3E-5T144C – EC Field Programmable Gate Array (FPGA) IC 97 56320 3100 144-LQFP
The LFEC3E-5T144C is an EC Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, provided in a 144-pin LQFP package. It integrates 3100 logic elements, on-chip embedded RAM totaling 56,320 bits, and 97 user I/O pins, delivering a compact, reprogrammable logic device for commercial embedded designs.
With a nominal supply range of 1.14 V to 1.26 V and a commercial operating temperature range of 0 °C to 85 °C, this device targets applications that require modest logic capacity, embedded memory, and flexible I/O in a space-efficient surface-mount package.
Key Features
- Logic Capacity — 3100 logic elements providing programmable resources for implementing custom digital functions and glue logic.
- Embedded Memory — Approximately 56,320 bits of on-chip RAM to support small buffering, FIFOs, and state storage without external memory.
- I/O Count — 97 general-purpose I/O pins to handle multiple peripherals, interfaces, and control signals.
- Power — Low-voltage core operation with a supply range of 1.14 V to 1.26 V to support power-conscious system designs.
- Package & Mounting — Available in a 144-LQFP package (supplier device package listed as 144-TQFP 20×20) for surface-mount PCB assembly.
- Operating Range — Commercial-grade temperature rating from 0 °C to 85 °C for typical ambient environments.
- Compliance — RoHS-compliant component.
Typical Applications
- Custom digital logic and glue-code — Implement interface bridging, protocol adaptation, and control logic using the 3100 logic elements and available I/O.
- Embedded buffering and small data storage — Use approximately 56,320 bits of on-chip RAM for temporary data storage, FIFOs, and small lookup tables without external RAM.
- Peripheral interfacing — Drive and manage multiple peripherals or sensors with 97 available I/O pins for signal routing and control.
Unique Advantages
- Compact programmable solution: 3100 logic elements and integrated RAM reduce the need for discrete glue logic and separate memory, simplifying PCB layout.
- High I/O density: Ninety-seven I/O pins provide flexibility to connect multiple peripherals, interfaces, or expanders directly to the FPGA.
- Low-voltage core: The 1.14 V to 1.26 V supply range supports designs targeting reduced core power consumption.
- Surface-mount convenience: 144-LQFP (supplier package 144-TQFP 20×20) fits common PCB footprints for compact embedded modules.
- Commercial temperature grade: Rated 0 °C to 85 °C for standard commercial applications and environments.
- RoHS compliant: Conforms to RoHS requirements for use in lead-free assemblies.
Why Choose LFEC3E-5T144C?
The LFEC3E-5T144C offers a balanced combination of programmable logic capacity, on-chip memory, and a high number of I/Os in a compact 144-pin package. Its electrical and thermal specifications make it suitable for commercial embedded designs that need reconfigurable logic, modest memory, and flexible interfacing without excessive board space or component count.
Designed and supplied by Lattice Semiconductor Corporation, this device is appropriate for engineers and procurement teams building low- to mid-complexity digital systems where integration, predictable power envelope, and RoHS compliance are important considerations.
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