LFEC3E-5FN256C

The LFEC3E-5FN256C is a commercial-grade EC family FPGA offering a compact footprint and mainstream FPGA capabilities. It delivers approximately 3,100 logic elements, 56,320 bits of on-chip RAM and 160 general-purpose I/Os in a 256-ball fpBGA (17 × 17 mm) surface-mount package.

Designed for cost- and space-sensitive embedded designs, this device provides flexible I/O, multiple clocking resources and family-level support for embedded and distributed memory architectures, making it suitable for a wide range of control, interface and system integration tasks within its specified commercial temperature range.

Key Features

• Logic Capacity — Approximately 3,100 logic elements to implement complex glue logic, finite state machines and custom peripheral functions.
• On‑Chip Memory — Total RAM of 56,320 bits for data buffering, small FIFOs and configuration storage.
• I/O Resources — 160 I/Os in the 256-ball fpBGA package to support broad interfacing needs and multiple peripherals.
• Flexible I/O Standards (family-level) — Family documentation describes programmable I/O buffers that support a wide range of standards for mainstream interfaces.
• Clocking — Device-level support includes dedicated PLL resources (family table lists two PLLs for this device class) to help manage clock domains and timing.
• Power — Operates from a core supply range of 1.14 V to 1.26 V, matching family supply conventions for 1.2 V core architectures.
• Package & Mounting — 256-FPBGA (17 × 17 mm) surface-mount package for compact board designs.
• Commercial Temperature & Compliance — Rated for 0 °C to 85 °C operation and RoHS compliant.
• System Integration (family-level) — Family data highlights system features such as SPI boot flash interface and IEEE 1149.1 boundary-scan for board-level testability; toolchain and IP support is available through the ispLEVER tool suite and ispLeverCORE modules.

Typical Applications

• Embedded Control — Implement control logic, protocol bridging and deterministic I/O handling in compact embedded systems.
• Communication Interfaces — Act as protocol glue or interface concentrator where multiple peripheral standards and parallel I/Os are required.
• Consumer Electronics — Provide customizable logic and buffering for device control, display interfaces and peripheral management within commercial temperature ranges.
• Memory Interface Support — Use on-chip memory and family DDR interface support to implement intermediate buffering and memory controllers for cost-sensitive designs.

Unique Advantages

• Compact, high-density package: 256-ball fpBGA (17 × 17 mm) reduces PCB area while providing substantial I/O and logic resources.
• Balanced logic and memory: Approximately 3,100 logic elements paired with 56,320 bits of RAM enable practical on-chip buffering and mid-sized logic functions without external memory.
• Flexible interfacing: 160 I/Os support a broad mix of peripherals and interfaces, simplifying system-level integration.
• Toolchain and IP availability: Family-level support with the ispLEVER design tools and ispLeverCORE IP modules accelerates development and reduces integration time.
• Test and boot capabilities: Boundary-scan and SPI boot support (family-level) improve board testability and deployment workflows.
• RoHS compliant: Environmentally compliant manufacturing and assembly compatibility.

Why Choose LFEC3E-5FN256C?

The LFEC3E-5FN256C combines a practical logic element count, useful on-chip RAM and a high I/O count in a small fpBGA package—making it a solid choice for designers looking to consolidate glue logic, interface functions and mid-sized embedded designs into a single device. Its commercial temperature rating and 1.14–1.26 V core supply align with many mainstream embedded system requirements.

Supported by family-level system features and design tools, this FPGA is suited to engineering teams seeking predictable integration, available IP blocks and standard board-level test and boot options, helping shorten development cycles while maintaining a compact BOM footprint.

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